Join industry partners and applied research leadership accelerating the development and deployment of new material solutions into products and society.

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2023 Speakers and Chairs Include:

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2023 Sector Program - Advanced Manufacturing

Back to Top ↑ Sessions
	Monday June 19
7:00	Registration
8:00	TechConnect World Innovation Conference - Plenary Keynotes
9:00	Carbon Nanostructures & Applications
9:00	Additive Manufacturing: Materials Innovation
9:00	AI Innovations I
9:00	Industrial Decarbonization: Global Views
9:00	Novel Chemical & Physical Sensors
9:00	TechConnect Innovation Pitches: Space, Defense, Mobility
9:00	TechConnect Innovation Pitches: Manufacturing, Instrumentation
9:00	Army xTech Startup Summit (Private Meeting)
10:45	TechConnect Innovation Pitches: Biotech, Pharma, Health
10:30	TechConnect Innovation Pitches: Advanced Materials & Chemicals I
1:30	Fusion Manufacturing Innovation Challenge - UK Atomic Energy Authority & Commonwealth Fusion Systems
2:40	Fusion Manufacturing Innovation Challenge - UK Atomic Energy Authority & Commonwealth Fusion Systems
1:30	CHIPS: Current Challenges and New Solutions to Boost Domestic Chips Manufacturing I
1:30	Additive Manufacturing: Digital
1:30	AI Innovations II
1:30	Industrial Decarbonization: CCS & Hydrogen
1:30	NSF Engineering Research Visioning Alliance (ERVA) - Partnering (Pre-Registration Required)
1:30	Army xTech Startup Summit (Private Meeting)
3:00	Legal Perspective: Strategic IP and Funding Considerations for Innovative Companies
4:00	TechConnect Innovation Showcase Reception, Corporate Scout Speed Dating, Army xTech Showcase, Poster Session I (4:00 - 6:00)
4:00	TechConnect Business Team Meet & Greet
4:00	TechConnect Corporate Scout Speed Dating
4:00	Additive Manufacturing - Posters
4:00	Advanced Materials for Engineering Applications - Posters
4:00	AI Innovations - Posters
4:00	Industrial Decarbonization - Posters
	Tuesday June 20
8:30	Joint TechConnect & SBIR/STTR Keynote Program
10:30	CHIPS: Current Challenges and New Solutions to Boost Domestic Chips Manufacturing II
10:30	Rare Earths & Critical Materials - Keynotes
10:30	Additive Manufacturing: Machines
10:30	Industrial Decarbonization: Bioresources
10:30	Nano4Earth - National Nanotechnology Coordination Office
10:30	Navy MANTECH Advanced Manufacturing Challenge
10:30	TechConnect Innovation Pitches: Electronics, Sensors, Communications
10:30	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 1 Accelerators for Security and Medicine
1:00	Navy MANTECH Advanced Manufacturing Challenge
2:30	Navy MANTECH Advanced Manufacturing Challenge
1:30	CHIPS: Advanced Metrology to Ensure Success for Next Generation Semiconductors
1:30	Advanced Manufacturing Innovation
1:30	AI for Materials
1:30	TechConnect Innovation Pitches: Electronics, Sensors & Communications
1:00	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 2 NIR Laser Technologies for Scientific Research
2:00	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 3 MIR and LWIR Laser Technologies for Scientific Research
3:00	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 4 High Power Industrial Accelerator Technologies - RF Sources
3:40	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 5 High Power Industrial Accelerator Technologies - Linacs
4:40	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Working with the DOE National Laboratories' Accelerator R&D Capabilities - information session open to all
4:00	TechConnect Innovation Showcase Reception, SBIR/STTR Program Office Meetup, Army xTech Showcase, Poster Session II (4:00 - 6:00)
4:00	TechConnect Business Team Meet & Greet
4:00	EPA P3 National Student Design Competition Showcase
4:00	SBIR/STTR Pavilion
4:00	Materials Characterization - Posters
4:00	Nanparticle Synthesis & Characterization - Posters
4:00	Advanced Manufacturing - Posters
4:00	Printed & Flexible Electronics - Posters
	Wednesday June 21
8:30	Registration
9:00	CHIPS: Advances in Packaging for New Chips Innovation
9:00	Materials for Sustainable Building
9:00	Nanoparticle Synthesis & Characterization
9:00	Advanced Materials for Engineering Applications
9:00	Printed & Flexible Electronics
9:00	TechConnect Innovation Pitches: Manufacturing, Instrumentation II
9:00	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 1 - Industrial Partnerships in Accelerator Technology
10:30	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 2 - Accelerator Physics and Simulation
12:40	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 3 Superconducting Accelerator R&D
2:20	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 4 New Particle Sources and Accelerator Concepts
Program
	Monday June 19
7:00	Registration	Convention Center Pre-Function
8:00	TechConnect World Innovation Conference - Plenary Keynotes	Maryland A
	Session chair: Matthew Laudon, TechConnect Division ATI
8:00	Welcome & National Technology Alliance Launch M. Laudon, TechConnect ATI, US
8:15	Army xTech - Innovation Acceleration A. D'Agostino, Army xTech, US
8:30	Interdisciplinary Art and Future of Sensing Innovation L. Sohn, University of California, Berkeley, US
9:00	Carbon Nanostructures & Applications	Chesapeake 1
	Session chair: Christopher Sims, National Institute of Standards & Technology, US
9:00	Novel Designs for Single Photon Detection based on Molecular and Nanoscale Systems F. Leonard, Sandia National Laboratories, US
9:25	Overcoming the Materials Science Challenges to Leveraging Semiconducting Carbon Nanotubes in Logic and RF Technologies M. Arnold, University of Wisconsin, US
9:50	Aligned Arrays of Carbon Nanotubes with High Semiconducting Purity for Integrated Circuits J Provine, Y. Yemane, Aligned Carbon, US
10:00	High-Performance Highly-Scaled Carbon Nanotube Transistors: Recent advances on device component modules and integrated MOSFETs G. Pitner, TSMC Corporate Research, US
10:25	Semi-Automated Exploration of Aqueous Two-Phase Extraction Parameters for Single-wall Carbon Nanotube Separations via Fluorescence Spectroscopy C.M. Sims, J.A. Fagan, National Institute of Standards and Technology, US
10:45	A study on the effect of graphene oxide additives on the graphitization of carbon-carbon (C-C) composites S. Ike, S. Ling, R. Vander Wal, Penn State University, US
9:00	Additive Manufacturing: Materials Innovation	Chesapeake 2
	Session chair: John Barnes, The Barnes Global Advisors, US
9:00	Product Acceptance is the Real Innovation and It Requires More than Just Machines and Feedstock S. Gardner, A. Barnes, Big Metal Additive, US
9:25	Distortion and stress simulation of complex AM parts using a feature-aware periodic adaptive FEA meshing approach P. Michaleris, E. Denlinger, G. Adams, E. Pierson, PanOptimization, US
9:45	An Extreme Field-of-View Broadband Antenna Enabled by Advances in 3D Printed GRIN Devices E. Versluys, A. Long, Fortify, US
10:10	Data-driven modeling for microstructure-property relationships of stainless steels B. Zhang, M. Porro, A. Parmar, Y. Shin, Purdue University, US
10:25	Neural Net Modeling of Voxel Scale DLP Additive Manufacturing J. Killgore, National Institute of Standards and Technology, US
10:40	3D Printing of Carbide and Nitride Ceramics for Powered Electronics Packaging A. Steinmark, I. Ivanov, A. Peters, Materic, US
10:55	Unlocking Antenna Performance with Economically Viable GRIN Devices E. Versluys, Fortify, US
9:00	AI Innovations I	Chesapeake A
	Session chair: Amarda Shehu, George Mason University, US
9:00	TBA B. Jacobson, University of New Mexico, US
9:25	Predicting Antimalarial Activity of Compounds using SMILES strings and Machine Learning: A Study on the Relationship between Chemical Structure and Molecular Properties in the fight against Malaria C. Ekenna, University at Albany, US
9:50	Generative design for small molecule drugs A. Roy, Norachem, US
10:00	Creating the Extended Reality of the Future with Artificial Intelligence and Computational Design L-F. Yu, George Mason University, US
10:25	Industrial Internet of Things (IIOT) Physics-Based Dimensionality Reduction N. Loychik, Los Alamos National Laboratory, US
10:45	Why You Need to Start Preparing for the American Data Privacy and Protection Act (ADPPA): Understanding its Impact on Enterprises M. O'Malley, SenecaGlobal, US
11:05	Automated Detection and Classification of Vehicle Dashboard Warning Lights for Improved Understanding of Vehicle Condition W. Giegerich, T.S. Porter, K. Shuttleworth, L. Forte III, Ph.J. Schneider, K.W. Oh, University at Buffalo, US
9:00	Industrial Decarbonization: Global Views	National Harbor 6
	Session chair: Tim Barckholtz, ExxonMobil, US & Carlos Quiroz-Arita, Sandia National Laboratories, US
9:00	DOE Overview of Industrial Efficiency and Decarbonization Research, Development, and Demonstration A. Shultz, U.S. Department of Energy, US
9:25	On the role and value of BECCS in deep decarbonisation scenarios N. Mac Dowell, Imperial College London, UK
9:50	Decarbonizing Industrial Processes Utilizing Concentrating Solar Thermal Input A. Ambrosini, Sandia National Laboratories, US
10:15	Technology Enabling Low Carbon Intensity Hydrogen Production and Use J.M. McMullan, ExxonMobil Low Carbon Solutions Technology, US
10:35	Decarbonization of Water Resource Recovery Facilities (WRRF), Wet-Waste Transformation and Destruction of Forever Chemicals: Two Problematic Birds, One Sustainable Stone W. Lovins, T. Gross, AECOM, US
9:00	Novel Chemical & Physical Sensors	Chesapeake B
	Session chair: Martin Poitzsch, Aramco Services Company, US
9:00	Continuous Methane Sensing for Rapid Detection and Repair of Intermittent Emitters A. Speck, Schlumberger-Doll Research, US
9:25	A smart and nanostructured perovskite for selective NO sensing in a broader temperature range B. Saruhan, S. Nahirniak, Ch. Krasmann, R. Lontio Fomekong, German Aerospace Center (DLR e.V.), DE
9:45	Cryogenic Helium Flow Sensor System K. Jordan, G. Biallas, Jefferson Science Associates, US
10:05	Wireless and Battery-Less Universal Power Consumption Monitoring Sensor W. Yu, Archimedes Controls Corp., US
10:25	Development of electromagnetic and acoustic metamaterials for demanding industrial applications D. Swett, Aramco Research Services, US
10:50	Ultrawideband Multistatic Positioning System E. Heidhausen, University Research Foundation, US
11:10	Miniaturized contactless sensors based on magnetically bistable microwires R. Varga, RVmagnetics, a.s., SK
9:00	TechConnect Innovation Pitches: Space, Defense, Mobility	Maryland 1
	Session chair: Nick Kacsandi, TechConnect Division, ATI, US
9:00	ISS National Laboratory Innovation Spotlight M. Alafrangy, International Space Station National Laboratory (ISSNL), US
9:15	Wide-area Intelligence Surveillance and Reconnaissance Discovery (WISRD) K. Mullis, CyOne Inc., US
9:22	Advanced Compression Ignition Aviation Propulsion System S. White, DeltaHawk Engines, Inc., US
9:29	Electric - VTOL Hybrid LTA (Lighter Than AIr) Unmanned AIrships P. Egan, Galaxy Unmanned Systems LLC, US
9:36	SAUCED ( Smart, Adaptive, Ultra-Reliable, Cyber-Resilient, Efficient Data Infrastruture ) J. Song, Genesis Codes Inc, US
9:43	A multi environment commercial spacesuit platform K. Rambhatla, Metakosmos, AU
9:50	Gyro-Magnetometer for Inertial Navigation Systems K. Bechta-Metti, The Australian National University, AU
9:57	Lunaspatial Intelligence XGEO Sensor (LInXS) H. Kling, Lunasonde, Inc., US
10:04	Batch-manufacturing of biosensors in microgravity S. Massa, Ecoatoms, US
	Review Panelist C. Owens, Lockheed Martin, US
	Review Panelist C. Collins, U.S. Air Force, US
	Review Panelist C. Chin, CLC Advisors, US
	Review Panelist C. Nieto, IEEE Entrepreneurship, US
	Review Panelist M. Alafrangy, International Space Station National Laboratory (ISSNL), US
9:00	TechConnect Innovation Pitches: Manufacturing, Instrumentation	Maryland 2
	Session chair: Bart Romanowicz, TechConnect Division, ATI, US
9:00	TechLink Innovation Spotlight B. Metzger, TechLink, US
9:15	Cryogenic Helium Gas Flow Meter G. Biallas, Hyperboloid LLC, US
9:22	Revolutionary Affordable 3D Sand Printer for Metalcasting Agility, Lightweighting & Advanced Materials D. Shirkey, LightSpeed Concepts Inc., US
9:29	Predictive Critical Mineral Measurement Software A. Benson, Microbeam Technologies Inc., US
9:36	EV-Powered Mobile 3D Concrete Printing of In Situ Material Z. Graber, necoTECH, US
9:43	Advanced Manufacturing Tech A. Badesha, Orbital Composites, Inc., US
9:50	Compact subsea lidar for micro/mini ROVs and AUVs E. Larson, Tampa Deep Sea Xplorers, Inc., US
	Review Panelist J. Wong, IEEE, US
	Review Panelist M. Snider, ATI - Navy ManTech, US
	Review Panelist B. Segal, Lockheed Martin, US
	Review Panelist TBA, Northrop Grumman, US
9:00	Army xTech Startup Summit (Private Meeting)	Maryland 6
10:45	TechConnect Innovation Pitches: Biotech, Pharma, Health	Maryland 1
	Session chair: C. Clyburn, MedForeSight, US
10:45	Trust-as-a-Service (TaaS) solution R. Huber, Veridat, US
10:52	Automating Rheumatoid Arthritis Assessment Via Deep Learning J. Tan, National University of Singapore, SG
10:59	Z-pods® C. Hinkle, Zylo Therapeutics, Inc., US
11:06	sam A. Childress, 3 CulinaryMed Docs, US
11:13	Human Brain Disease Models R. Anand, Neurxstem Inc, US
11:20	Carbon Monoxide Prodrug and Related Delivery Systems for Therapeutics K. Franklin, Georgia State University, US
	Review Panelist M. Stebbins, ATI - Medical & CBRN Defense Consortium (MCDC), Countering Weapons of Mass Destruction Consortium (CWMD), CA
	Review Panelist A. Emondi, NTT Research, US
	Review Panelist C. Clyburn, MedForeSight, US
10:30	TechConnect Innovation Pitches: Advanced Materials & Chemicals I	Maryland 2
	Session chair: S. Bagheri, University of Waterloo, CA
10:45	Conductive Copper Inks B. Bischoff, Copprium, Inc., US
10:52	Environmentally friendly and efficient smart garments and heated textiles A. Digon, Soliyarn, Inc., US
10:59	High-density, direct photo-patterning of stretchable electronic polymers Y.L. Chen, Stanford University - Office of Technology Licensing, US
11:06	Compostable polyester plastics L. Micek, University of Minnesota, US
11:13	Multistable elastic pixels (MEPs) for reversible programming of optical properties T. Bray, University of Pennsylvania or University of Pennsylvania-Penn Center for Innovation, US
11:20	3D Bioprinting using Stiffened Polymer Bioinks and Bioorthogonal Crosslinkers Y.L. Chen, Stanford University - Office of Technology Licensing, US
11:27	Industrial Bioplastics for a Circular Carbon Economy J. Puracal, ZILA BioWorks, US
	Review Panelist J. Epstein, Lockheed Martin, US
	Review Panelist M. Aubart, Arkema, US
	Review Panelist C. Paul, Henkel, DE
	Review Panelist J. Wong, IEEE, US
	Review Panelist S. Bagheri, University of Waterloo, CA
1:30	Fusion Manufacturing Innovation Challenge - UK Atomic Energy Authority & Commonwealth Fusion Systems	Maryland 3
	Session chair: Jonathan Jakischa & Katie Bornfleth, TechConnect Division, Advanced Technology International
1:30	Fusion Challenge - Introduction J. Jakischa, TechConnect Division, ATI, US
1:45	Welcome - UKAEA & CFS TBA, UK Atomic Energy Authority & Commonwealth Fusion Systems, UK
2:00	Challenge Pitch: AlchLight AlchLight, LLC, US
2:07	Challenge Pitch: ALSYMEX ALSYMEX, FR
2:14	Challenge Pitch: Dr. Fritsch GmbH & Co. KG Dr. Fritsch GmbH & Co. KG, DE
2:21	Challenge Pitch: Faraday Technology Faraday Technology, Inc., US
2:28	Challenge Pitch: Fourier LLC Fourier LLC, US
	Review Panelist H. Lewtas, UK Atomic Energy Authority, UK
	Review Panelist J. Deshpande, Commonwealth Fusion Systems, UK
	Review Panelist L. Aucott, UK Atomic Energy Authority, UK
	Review Panelist D. Raghu, Kaleidescope Energy, US
	Review Panelist R. Dylla-Spears, Lawrence Livermore National Laboratory, US
	Review Panelist A. Lumsdaine, Oak Ridge National Laboratory, US
2:40	Fusion Manufacturing Innovation Challenge - UK Atomic Energy Authority & Commonwealth Fusion Systems	Maryland 3
2:40	Challenge Pitch: Imperial College London Imperial College London, US
2:47	Challenge Pitch: Transition45 Technologies, Inc. Transition45 Technologies, Inc., US
2:54	Challenge Pitch: Unitive Design and Analysis Unitive Design and Analysis Ltd, US
3:01	Challenge Pitch: University of Nottingham University of Nottingham, US
3:08	Challenge Pitch: Baugh and Weedon NDE Ltd Baugh and Weedon NDE Ltd, US
	Review Panelist H. Lewtas, UK Atomic Energy Authority, UK
	Review Panelist J. Deshpande, Commonwealth Fusion Systems, UK
	Review Panelist L. Aucott, UK Atomic Energy Authority, UK
	Review Panelist D. Raghu, Kaleidescope Energy, US
	Review Panelist R. Dylla-Spears, Lawrence Livermore National Laboratory, US
	Review Panelist A. Lumsdaine, Oak Ridge National Laboratory, US
1:30	CHIPS: Current Challenges and New Solutions to Boost Domestic Chips Manufacturing I	Chesapeake 3
	Session chair: Joe Kline, National Institute of Standards & Technology, US
1:30	Mitigating challenges in high resolution imaging and electrical failure analysis for advanced semiconductor devices S. Basu, Zeiss, US
1:55	Semiconductor manufacturing for meta-optics W.T. Chen, SNOChip, US
2:20	Vulnerability of In-Memory Compute to Hardware Trojans: A Case Study using Two-dimensional Memtransistor A. Wali, H. Ravichandran, S. Das, Pennsylvania State University, US
2:40	Critical Materials for Critical Goods: Rebuilding the Microelectronics Industrial Base A.N. Caruso, Midwest Microelectronics Collective, US
3:00	Accelerate time to market of semiconductor industry using AI software platform dedicated to data analytics for metrology and defectivity J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, O. Cru, T. Ziraoui and S. Girard, Pollen Metrology, FR
3:20	A Novel Photonic Switching Device K. Sampayan, S. Sampayan, Opcondys, Inc., US
1:30	Additive Manufacturing: Digital	Chesapeake 2
	Session chair: Slade Gardner, Big Metal Additive, US
1:30	Innovating with AlMgty – the high performance Aluminium Alloy for Industrial Applications M. Reddy, Fehrmann Tech Group, DE
1:55	Enabling Additive Manufacturing of Reflective Metals J.E. Barnes, M. Vlasea, Metal Powder Works, US
2:15	A novel hybrid approach to laser additive manufacturing of aluminum alloys with concurrent cryogenic quenching for improved microstructure and hardness C. Grohol, Y.C. Shin, Purdue University, US
2:35	The SAE AMS - Additive Manufacturing Data Consortium B. Bihlman, SAE Industry Technologies Consortia, US
3:00	Post-Process Superfinishing of Additively Manufactured Aluminum Components with Complex Geometries R. Shealy, REM SURFACE ENGINEERING, US
3:20	Postprocess Effects to Fatigue Behavior of Additively Manufactured Maraging Steel M. Rutkevičius, E.A. Périgo, ABB Inc., US
3:40	Software tool for in-space printing of reliable parts R. Bhowmik, S. Jha, Polaron Analytics, US
4:00	Development of Build and Post-Build Guidelines for Additively Manufactured IN-718 Components R. Shealy, REM Surface Engineering, US
1:30	AI Innovations II	Chesapeake A
	Session chair: Craig Yu, George Mason University, US
1:30	Automated Classification of Electric Vehicle Models and Drivetrains by Means of Magnetic Field Characterization via Machine Learning W. Giegerich, Dennis Federoshin, Philip Gentz, Livio Forte III, Ph.J. Schneider, K.W. Oh, University at Buffalo, US
1:50	Neural Networks and the Problem of Style in Art Attribution V. Sundaram, A. Coyle, Southern Methodist University, US
2:10	Utilizing AI & Wearable Technology to Optimize Physical Performance in Military Personnel H. Bundele, ibLaunch Company, US
2:30	Artificial Intelligence for Visual Battlefield Awareness M. Karnes, Ubihere, US
2:50	Investigating Intersection Safety with 3D Object Detection and Digital Twin Technology from Video Data D. Patel, A. Nayeem, R. Alfaris, M. Jalayer, Rowan University, US
3:10	Predictive Human Motion Using Physics-Based Avatars for Unreal Engine 4 T. Klopfenstein, R. Bhatt, K. Malek, University of Iowa Technology Institute, US
3:30	Graph Anomaly Dection R. Karn, V. Sundaram, SMU Dallas, US
1:30	Industrial Decarbonization: CCS & Hydrogen	National Harbor 6
	Session chair: Tim Barckholtz, ExxonMobil, US & Carlos Quiroz-Arita, Sandia National Laboratories, US
1:30	Current and near-future decarbonization options for steelmaking D. Pistorius, Carnegie Mellon University, US
1:55	What does net-zero industry look like? N. Sunny, N. Mac Dowell, Imperial College London, UK
2:15	Insights and Best Practices for Planning and Executing Geologic Sequestration Projects J. Lemaster, T. Eggeman, S. Quillinan, F. McLaughlin, Carbon Solutions, US
2:35	Thermo-catalytic Decomposition of Methane to Produce hydrogen Using Carbon as Catalyst M. Nkiawete, R. Vander Wal, Penn State University, US
2:55	Challenges and Considerations of Implementing Carbon Capture at Industrial Point Sources A. Erickson, Sargent & Lundy, US
3:15	Techno-economic assessments of fuels or electricity production from biomass with CO2 capture H. Luo, E.D. Larson, Princeton University, US
1:30	NSF Engineering Research Visioning Alliance (ERVA) - Partnering (Pre-Registration Required)	Annapolis 1
	Join ERVA and TechConnect for a Workshop and help us ideate engineering research priorities that advance U.S. R&D and solve society's most vexing problems.
1:30	Army xTech Startup Summit (Private Meeting)	Maryland 6
3:00	Legal Perspective: Strategic IP and Funding Considerations for Innovative Companies	Maryland 1
	Innovation requires short-term and long-term vision, not to mention grit and stamina. It also requires strategic forethought to ensure your intellectual property is adequately protected throughout the journey from innovation to commercialization. Join attorneys from legendary Silicon Valley based law firm Fenwick & West as they shed light on IP strategy considerations - trademarks, copyrights, patents and trade secrets - you should have top of mind.  Then, dive into the similarities and differences between private funding and government funding, including parameters of SBIR Phase 1 and beyond.
	D. Brownstone, Fenwick, US
	P. Grilli, Fenwick, US
	Z. Tejani, Fenwick, US
	C. Schwartz, Palantir Technologies, US
4:00	TechConnect Innovation Showcase Reception, Corporate Scout Speed Dating, Army xTech Showcase, Poster Session I (4:00 - 6:00)	Expo Hall AB
4:00	TechConnect Business Team Meet & Greet	Expo Hall AB
4:00	TechConnect Corporate Scout Speed Dating	Expo Hall AB
	Arkema, US
	BryceTech, US
	Dundee Precious Metals, US
	Henkel, DE
	Linde, IE
	Rio Tinto, US
	TechLink, US
	Resonac, US
	Raytheon, US
	Saint-Gobain, FR
	Koch Modular Process, US
	Dow, US
	ATI - Innovation Funding Pipeline, US
	ATI - Navy ManTech, US
	ATI - Countering Weapons of Mass Destruction Consortium, US
	ATI - Medical & CBRN Defense Consortium, US
4:00	Additive Manufacturing - Posters	Expo Hall AB
	Rapid Prototype Tooling For Rapid Composite Manufacturing H. Watts, Mississippi State University, US
	Overview of Additive Manufacturing and 3-D Printing Utilizing Numerous Analytical Techniques C. Stephan, T. Dillon, PerkinElmer Inc, CA
	Layer time optimization in large-scale additive manufacturing via a reduced physics-based model E. Jo, L. Liu, N. Garg, U. Vaidya, S. Chakraborty, F. Ju, S. Kim, Oak Ridge National Laboratory, US
	Microreactor-Assisted Nanomaterial Deposition for Additive Manufacturing A. Chang, Oregon State University, US
4:00	Advanced Materials for Engineering Applications - Posters	Expo Hall AB
	Corrosion resistant coatings from bio-derived sodium alginate and inorganic components for metallic materials T. Moskalewicz, M. Warcaba, A. Łukaszczyk, AGH University of Science and Technology, PL
	Flexible Personal Thermoregulatory Device Embedded with Silver Nanoparticle A. Hazarika, B.K. Deka, D.Y. Kim, H.W. Park, Ulsan National Institute of Science and Technology, KR
	Superconductors in Space @ Ambient Temperature for Boost-Phase Missile Interception W.C.W. Lau, LAU Superconductors, US
	High thermal capacity silica-based fibers for potential application as insulators C. Robinson, A. Sahu, S. Banks, R. Nelson, American Nano, LLC, US
	Reinforced High Temperature Superconductors for Nuclear Fusion? W.C.W. Lau, LAU Superconductors, US
	PoF – Power over Fiber: A Novel Approach for Energy Transmission in B5G Networks L.C. Souza, A.C. Sodré Jr., Inatel - Instituto Nacional de Telecomunicações, BR
	New Coating Additives: Tiny Soap Particles that Help Repel Water Y. Li, Iowa State University, US
	Contribution of Thermal Radiation to the Temperature Profile of Ceramic Composite Materials via a (2-D) Two Flux Model K. Orikasa, M. Landazuri and A. Tremante, Florida International University, US
4:00	AI Innovations - Posters	Expo Hall AB
	AI and THz Based Advanced Hardware Security and Reliability Testing for VLSI N. Akter, J. Suarez, M. Shur, N. Pala, Rensselaer Polytechnic Institute, US
	Machine learning pipeline of novel peptide and protein generation with refined selection for production in vivo S.N. Dean , J.A.E. Alvarez, P.M. Legler, A.P. Malanoski, US Naval Research Laboratory, US
	Adversarial probabilistic AI T. Ekin, Texas State University, US
	Real-Time Intelligent Surveillance using Ethical Anomoly Detection S. Reid, C. Neff, Chimeras, US
	Innovation in Contracting and Focus on SBIR Phase IIIs A. Donahoo, A. Rouse, GSA, US
	Detection of Distracted Driving using Deep Learning Algorithm A.S. Hasan, D. Patel, M. Jalayer, Rowan University, US
4:00	Industrial Decarbonization - Posters	Expo Hall AB
	Carbon Catalyzed Thermo-catalytic Decomposition of Methane: Connecting Nanostructure to Deposition Conditions and Rates M. Nkiawete, R. Vander Wal, Penn State University, US
	Development of the Joule Hive™ High Temperature Thermal Battery to Electrify Industry B. Truong, D. Stack, P. Stephenson, Electrified Thermal Solutions, US
	The Role of Biochar Concentration on the Structure and Electrical Performance of MnO2-Biochar Composite Electrodes for Supercapacitor Applications. T. Sadowski, M. Martone, V. Adamski, A. Grynyk, K. Roman, J. Scanley, R. Singhal, C. Broadbridge, Southern CT State University, US
	Decarbonization of the US Steel Industry J.H. Ng, K. Lee, G. Zang, P. Sun, E. Amgad, Argonne National Laboratory, US
	Assessing the Feasibility and Cost of Decarbonizing the U.S. Refinery Sector P. Sun, V. Cappello, A. Elgowainy, P. Vyawahare, O. Ma, K. Podkaminer, N. Rustagi, M. Koleva, M. Melaina., Argonne National Laboratory, US
	Spirulina-laden cements for green construction materials: effects of algae incorporation on the mechanical properties and environmental impact of cement M-Y. Lin, P. Grandgeorge, A.M. Jimenez, C. Quiroz-Arita, E. Roumeli, University of Washington, US
	Strong and Stiff Bioplastics from Spirulina Cells H. Iyer, P. Grandgeorge, A.M. Jimenez, I.R. Campbell, M. Parker, M. Holden, M. Venkatesh, C. Quiroz-Arita, E. Roumeli, University of Washington, US
	Low-Carbon Dialkoxyalkanoate (DAOA) Diesel Fuels N.R. Myllenbeck, C. Quiroz-Arita, Sandia National Laboratories, US
	Tuesday June 20
8:30	Joint TechConnect & SBIR/STTR Keynote Program	Maryland A
	Session chair: Jennifer Rocha, TechConnect Division ATI
8:30	Fast-tracking National R&D Opportunities M. Stebbins, ATI, US
8:50	Materials & Manufacturing Innovation Priorities J. Sopcisak, Manufacturing Capability Expansion & Investment Prioritization (MCEIP), Office of the Assistant Secretary of Defense (OASD) for Industrial Base Policy (IBP), US
9:10	SBIR/STTR Technology Targets Panel (Investment, Innovation, & Strategic Capital for critical technologies) TBA, SBA - SBIR/STTR, US
	E. Page-Littleford, Office of Investment & Innovation, US
	B. DeVries, Office of Investment & Innovation, US
	J. Rathje, DoD, US
10:30	CHIPS: Current Challenges and New Solutions to Boost Domestic Chips Manufacturing II	Chesapeake 3
	Session chair: Alex Norman, Princeton University, US
10:30	TBA L.E. Friedersdorf, Office of Science and Technology Policy, US
10:55	The role of academia in the future of semiconductor manufacturing D. Lopez, Pennsylvania State University, US
11:20	TBA M. Dowell, National Institute of Standards and Technology, US
10:30	Rare Earths & Critical Materials - Keynotes	National Harbor 12
	Session chair: Santa Jansone-Popova, Oak Ridge National Laboratory, US
10:30	Substitutions as an Effective Strategy for Mitigating Supply Chain Risks T. Lograsso, Ames Laboratory, US
10:55	An R&D portfolio to help commercialize America’s abundant unconventional critical mineral resources. R.B. Thomas, National Energy Technology Laboratory, US
11:20	Biomolecular rare earth extraction and separation using lanmodulin J.A. Mattocks, Z. Dong, G.J.-P. Deblonde, Y. Jiao, D.M. Park, J.A. Cotruvo Jr, The Pennsylvania State University, US
10:30	Additive Manufacturing: Machines	Chesapeake 2
	Session chair: John Barnes, The Barnes Global Advisors, US & Slade Gardner, Big Metal Additive, US
10:30	Massively-Accessible Approach to Metal 3D Printing K. Hsu, Arizona State University, US
10:55	Additive Manufacturing of Bone Graft Ceramics A. Steinmark, Materic, US
11:15	The development of Rheo-Printing technology on interlayer adhesion strength for Big Area Additive Manufacturing F.J. Alzahrani, H. Noor, J.P. Coulter, Lehigh University, US
10:30	Industrial Decarbonization: Bioresources	National Harbor 6
	Session chair: Tim Barckholtz, ExxonMobil, US & Carlos Quiroz-Arita, Sandia National Laboratories, US
10:30	Welcome to the Post Pollution Future with LanzaTech T. Dower, LanzaTech, US
10:55	Renewable Methanol Conversion to Lower Emissions Fuels A. Behkish, S.H. Brown, D.C. Dankworth, M.A. Deimund, M.T. Kapelewski, K.H. Kuechler, M.P. Lanci, L.R. Martens, J.M. McMullan, S. Li, B. O’Neill, A. Souvaliotis, K. Trivedi, S. Weigel, A. Wiersum, L. Zhang, ExxonMobil Technology and Engineering Company, US
11:20	Decarbonization of Wastewater Treatment with Microalgae Processes. J. Polle, S. Blackwell, C. Lesne, J. Coyne, B. Crowe, J. Benemann, T. Lundquist, MicroBio Engineering Inc., US
10:30	Nano4Earth - National Nanotechnology Coordination Office	Chesapeake C
10:30	Overview remarks Q. Spadola, National Nanotechnology Coordination Office, US
10:40	Reducing waste in the production of nanoelectronics J. Draa, Grolltex, Inc., US
11:00	Carbon Nanotubes to Enable 1000x Reduction in Data Center Computing J. Provine, Aligned Carbon, US
11:20	Synthesis of Carbon Nanotubes and Fabrication of Multilayer Nanocomposites V.M. Boddu, Office of Research and Development (ORD), US Environmental Protection Agency (USEPA), US
11:40	Graphene Membrane for Direct Air Capture (DAC) A. Shiliwala, C. Heissenbuttel, Graphene Layers, US
12:00	Protein-based nanoparticles as bioengineered platforms for pesticide delivery I. González-Gamboa and N. Steinmetz, University of California San Diego, US
	Panelist P. Antunez, Brookhaven National Laboratory, US
	Panelist C. Allen-Chu, Clark Street Associates, US
	Panelist H. Henry, National Institutes of Health, US
	Panelist M. Kiley, National Nanotechnology Coordination Office, US
	Panelist B. Brough, National Nanotechnology Coordination Office, US
10:30	Navy MANTECH Advanced Manufacturing Challenge	National Harbor 5
	Session chair: Jonathan Jakischa & Laura Murphree, TechConnect Division, Advanced Technology International
10:30	Navy MANTECH Centers - Overview M. Snider, ATI - Navy ManTech, US
10:45	Additive Manufacturing with Dynamic Laser Beam Shaping based on Coherent Beam Combining L. Lev, Civan Lasers USA, US
10:52	Intrepid Expeditionary 3D Printer E. Shnell, Craitor, Inc., US
10:59	Hybrid Additive System For Ceramic Matrix Composites D. Crenshaw, DC Precision Ceramics LLC, US
11:06	A single step seamless digital solution for autonomous hybrid remanufacturing and repair: from 3D scanning to path planning. R. Samson, Elementiam Materials & Manufacturing Inc., CA
11:13	Onshoring of Custom Chip Carriers for DOD Applications B. English, EngeniusMicro, US
11:20	Multi-axis 3D printing H. Noori, Oklahoma State University, US
11:27	Robotic Additive Manufacturing with Continuous Carbon Fiber for Large and Novel Structures A. Badesha, Orbital Composites, Inc., US
11:34	Convolution HiDeNN-AI for Integrating Multiscale Topological Optimization with Additive Manufacturing D. Qian, HIDENN-AI, LLC, US
11:41	3D Sand Printer for Metalcasting Agility, Lightweighting & Advanced Defense Materials D. Shirkey, LightSpeed Concepts Inc., US
	Review Panelist A. Cauley, Huntington Ingalls Industries, US
	Review Panelist J. Chaidez, Lockheed Martin Aeronautics Company, US
	Review Panelist G. Buczkowski, General Dynamics Bath Iron Works, US
	Review Panelist J. Iraci, General Dynamics Electric Boat, US
	Review Panelist TBA, Lockheed Martin Hypersonics Engineering & Accelerated Technologies, US
	Review Panelist K. Thorn, NAVAIR, US
	Review Panelist L. Moreno, NAVSEA, US
	Review Panelist J. McRoberts, Manufacturing Science & Technology Program - OSD Manufacturing Technology, US
	Review Panelist S. Ng, NAVAIR, US
10:30	TechConnect Innovation Pitches: Electronics, Sensors, Communications	Maryland 2
	Session chair: Brent Segal, Lockheed Martin, US
10:30	Lockheed Martin Innovation Spotlight C. Owens, Lockheed Martin, US
10:45	elementalGEO(TM) E. Enig, Enig Associates, Inc., US
10:52	A Secure Wireless IoT Chipset for Smart Building and Smart City Applications J. Terry, Espre Technologies, Inc., US
10:59	Smallest Infrared Hyperspectral Camera M. Hinnrichs, Pacific Advanced Technology, US
11:06	Spectrally Efficient Peer-to-Peer (SEPP) Wireless Technology A. Salindong, Trabus Technologies, US
11:13	MEMCPU Platform J. Aiken, MemComputing, Inc., US
	Review Panelist C. Owens, Lockheed Martin, US
	Review Panelist C. Nieto, IEEE Entrepreneurship, US
	Review Panelist TBA, Northrop Grumman, US
	Review Panelist B. Segal, Lockheed Martin, US
	Review Panelist TBA, TechLink, US
10:30	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 1 Accelerators for Security and Medicine	Maryland 5
	Session chair: Eric Colby, U.S. Department of Energy, US
10:30	Introduction & Welcome E. Colby, U.S. Department of Energy, US
10:50	Development of Compact Carbon Beam Scanners for Cancer Therapy B. Mustapha, Argonne National Laboratory, US
11:10	Compact High Efficiency Traveling Wave Linac with Pulse-to-Pulse Tunable Energy V. Dolgashev, SLAC National Accelerator Laboratory, US
11:30	Adaptive Machine Learning for Control of Compact Accelerators A. Scheinker, Los Alamos National Laboratory, US
1:00	Navy MANTECH Advanced Manufacturing Challenge	National Harbor 5
	Session chair: Jonathan Jakischa & Laura Murphree, TechConnect Division, Advanced Technology International
1:00	Non-composite, polymer-free densified carbon nanotube (DCN) sheet as extreme cold weather resistant gasket material C. Li, 4TH Phase Technologies, Inc., US
1:07	A new class of smart responsive materials developed for self-healing anti-corrosion coatings in extreme environments. D. Gilmour, A2O Advanced Materials Inc., CA
1:14	Effective and Non-toxic Underwater and Marine Adhesive L. Takiff, Akita Innovations LLC, US
1:21	4D Printing of Novel Materials Y. Mirchandani, Beacon Industries Inc., US
1:28	Naval Alloys With Reduced Sensitization D. Weiss, Ce-Ri-SS Materials LLC, US
1:35	Additively Manufactured Continuous Fiber C/C and Ceramic Matrix Composite (C/SiC, SiC/SiC) Preforms for Hypersonic Applications P. McHail, Continuous Composites, US
1:42	Additive Hypersonic Fabrication Y. Mirchandani, Beacon Industries Inc., US
1:49	Uncooled Shortwave Imagers for Hypersonic Targeting M. Ettenberg, Princeton Infrared Technologies, Inc., US
	Review Panelist A. Cauley, Huntington Ingalls Industries, US
	Review Panelist J. Chaidez, Lockheed Martin Aeronautics Company, US
	Review Panelist G. Buczkowski, General Dynamics Bath Iron Works, US
	Review Panelist J. Iraci, General Dynamics Electric Boat, US
	Review Panelist TBA, Lockheed Martin Hypersonics Engineering & Accelerated Technologies, US
	Review Panelist K. Thorn, NAVAIR, US
	Review Panelist L. Moreno, NAVSEA, US
	Review Panelist J. McRoberts, Manufacturing Science & Technology Program - OSD Manufacturing Technology, US
	Review Panelist S. Ng, NAVAIR, US
2:30	Navy MANTECH Advanced Manufacturing Challenge	National Harbor 5
	Session chair: Jonathan Jakischa & Laura Murphree, TechConnect Division, Advanced Technology International
2:30	A fast-learning and low-cost humanoid robot that acts as workforce multiplier S. Srivastav, Aivot Robotics, Inc, US
2:37	Blockchain and AI/ML Enabled 6G network for Swarm of UAVs S. Mirchandani, Bryka Skystocks LLC, US
2:44	A Defect Measurement Tool to Improve Aircraft Sustainment and Decrease Downtime J. Rozzi, Creare LLC, US
2:51	Physical Identifiers for 21st Century Fleet Fabrication and Sustainment M. Kozicki, Densec ID, US
2:58	FLX BOT for Manufacturing Maintenance M. Bilsky, FLX Solutions, US
3:05	High-Quality Composite Repair with a Single Vacuum Bag D. Metrey, Luna Labs USA, LLC, US
3:12	Machine Learning Enabled Nondestructive Monitoring Device for Surface Adhesives and Coatings J. Yoon, Optowares, Inc., US
3:19	Real-time and passive acoustic structural monitoring of ships and components E. Cretu, The University of British Columbia, Dept. of Electrical and Computer Eng., CA
	Review Panelist A. Cauley, Huntington Ingalls Industries, US
	Review Panelist J. Chaidez, Lockheed Martin Aeronautics Company, US
	Review Panelist G. Buczkowski, General Dynamics Bath Iron Works, US
	Review Panelist J. Iraci, General Dynamics Electric Boat, US
	Review Panelist TBA, Lockheed Martin Hypersonics Engineering & Accelerated Technologies, US
	Review Panelist K. Thorn, NAVAIR, US
	Review Panelist L. Moreno, NAVSEA, US
	Review Panelist J. McRoberts, Manufacturing Science & Technology Program - OSD Manufacturing Technology, US
	Review Panelist S. Ng, NAVAIR, US
1:30	CHIPS: Advanced Metrology to Ensure Success for Next Generation Semiconductors	Chesapeake 3
	Session chair: Alex Norman, Princeton University, US
1:30	In-Line Metrology Requirements and Needs for Leading Edge Technology D. Schmidt, IBM Research, US
1:55	Solutions for Gate-all-around (GAA) Device Development and Manufacturing X. Gu, P. Hsu, Y.H. Kim, A. Mani, P. Kirby, Thermo Fisher Scientific, US
2:20	CHIPS Act Semiconductor Metrology Needs for R&D D. Henshall, V. Zhirnov, T. Younkin, Semiconductor Research Corporation (SRC), US
2:45	Surface and subsurface quantitative mechanical property measurements by contact resonance atomic force microscopy on low-k dielectric structures G. Stan, C.V. Ciobanu, S.W. King, National Institute of Standards and Technology, US
3:05	Analysis of buried interfaces for device technology by soft and hard X-ray photoemission K. Artyushkova, J. Mann, S. Zaccarine, Physical Electronics, US
3:25	Evaluating the Impact of Defects, Interfaces and Boundaries on Thermal Transport in 2D Materials Using a Novel Opto-Thermal Metrology Technique with Sub-Micron Resolution B.M. Foley, A.H. Jones, J.T. Gaskins, P.E. Hopkins, Laser Thermal Inc, US
3:45	Silicon Dopant Quantification in Atom Probe Tomography K. DeRocher, M. McLean, F. Meisenkothen, National Institute of Standards and Technology, US
1:30	Advanced Manufacturing Innovation	Chesapeake 2
	Session chair: Chris Menzel, Fujifilm Dimatix, Inc., US
1:30	A LifeCycle Use case comparison of 3D/Additive vs Traditional Manufactured part S. Monroe, AMGTA, US
1:55	Digital Material Deposition using Inkjet - Inkjet for Industrial 3D Applications R. Baker, Integrity Integration, US
2:20	Unlocking the Potential of High-Performance, Multi-Material Printing with NovoJet R. Borrell, Quantica Gmbh, US
2:45	Metal Additive Manufacturing for Production A.C. Barbati, Desktop Metal
3:10	Stable uniform nanoparticle dispersion in composite materials for antibacterial food packaging S. Lee, C&G Hitech Co., Ltd., KR
3:30	Cyber-Physical Trust Anchors for a Secure Supply Chain M. Maasberg, I. Taylor, L.G. Butler, United States Naval Academy, US
3:50	A sure shot: Fine-tuning focused ion beam placement with critical-dimension localization microscopy A.C. Madison, C.R. Copeland, R.G. Dixson, B.R. Ilic, J.A. Liddle, S.M. Stavis, National Institute of Standards and Technology, US
4:10	How A Modular Delivery Model Drives Developing Technology Project Viability M. Villegas, Koch Modular Process Systems, US
1:30	AI for Materials	Chesapeake A
	Session chair: Jan-Willem Handgraaf, Siemens Digital Industries Software, NE
1:30	Generative Models for Synthetically Accessible Polymers N.E. Jackson, University of Illinois Urbana-Champaign, US
1:55	Accelerating Materials Discovery and Design using AI and Machine Learning P.S. Dutta, A. Koneru, D. Sanpui, A. Chandra, H. Chan, S. Manna, S. Banik, T.D. Loeffler, S.K.R.S. Sankaranarayanan, University of Illinois at Chicago, US
2:15	Robocoater: Automated, Multi-Modal Optical Characterization Platform for Performing Closed-loop Bayesian Optimization of Thin-Film Hybrid Perovskite for PV Application N. Woodward, B. Guo, M. Chauhan, M. Abolhasani, K. Rayes, A. Amassian, North Carolina State University, US
2:35	Machine Learning-Driven Automated Scanning Probe Microscopy Y. Liu, K.P. Kelley, R.K. Vasudevan, M. Ziatdinov, S.V. Kalinin, Oak Ridge National Laboratory, US
2:55	Machine learning accelerated computational design of materials and processes T.P.M. Goumans, M. Hellström, P.S.N. Onofrio, N. Aguirre, R. Rüger, Software for Chemistry & Materials, NL
1:30	TechConnect Innovation Pitches: Electronics, Sensors & Communications	Maryland 2
	Session chair: Bart Romanowicz, TechConnect Division, ATI, US
1:30	TechLink Innovation Spotlight D. Scott, TechLink, US
1:45	Embedded Concrete Resistivity Sensor System N. Kargah-Ostadi, Callentis Consulting Group, LLC, US
1:52	Aligned Carbon Nanotube RF Devices for Next-Gen Wireless Communication K. Jinkins, SixLine Semiconductor, US
1:59	High-Speed High-Throughput Imaging with Radio Waves T. Cargol, Spectrohm, Inc,, US
2:06	Compact Underwater Lidar System E. Larson, Tampa Deep Sea Xplorers, Inc., US
2:13	Wireless Battery Personalized Wearable Electronics P. Gutruf, T. Stuart, University of Arizona, US
2:20	Nanocircuits at optical frequencies T. Bray, University of Pennsylvania-Penn Center for Innovation, US
	Review Panelist B. Romanowicz, TechConnect Division, ATI, US
	Review Panelist J. Wong, IEEE, US
	Review Panelist P. Parthiban, Just Venture Labs, US
	Review Panelist D. Ojika, Flapmax, US
	Review Panelist D. Scott, TechLink, US
1:00	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 2 NIR Laser Technologies for Scientific Research	Maryland 5
	Session chair: Eric Colby, U.S. Department of Energy, US
1:00	A Novel Coherent Combining Approach Towards High Peak and High Average Power Ultrafast Lasers Phase III A. Galvanauskas, University of Michigan, US
1:20	Scaling high energy utrafast Yb-based lasers for compact accelerators and applications J. Rocca, Colorado State University, US
1:40	Energy and Power Scaling of Nonlinearly Compressed Ultrashort Laser Pulses using Coherent Pulse Combining T. Zhou, Lawrence Berkeley National Laboratory, US
2:00	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 3 MIR and LWIR Laser Technologies for Scientific Research	Maryland 5
	Session chair: Eric Colby, U.S. Department of Energy, US
2:00	Optical Materials for Ultrahigh-Power Long-Wave Infrared Lasers M. Polyanskiy, Brookhaven National Laboratory, US
2:20	Novel, Middle and Long Wave Infrared Laser Sources For Accelerator Applications S. Mirov, University of Alabama, Birmingham, US
3:00	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 4 High Power Industrial Accelerator Technologies - RF Sources	Maryland 5
	Session chair: Eric Colby, U.S. Department of Energy, US
3:00	Electrostatic potential depression and its applications H. Xu, Los Alamos National Laboratory, US
3:20	Progress of the Design and Testing of an L-Band, High Efficiency, 100 kW average power RF Amplifier for Accelerator Applications M. Othman, SLAC National Accelerator Laboratory, US
3:40	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 5 High Power Industrial Accelerator Technologies - Linacs	Maryland 5
	Session chair: Eric Colby, U.S. Department of Energy, US
3:40	Progress on the Development of A High Efficiency 1 MW, 1 MeV Linac for Industrial Applications M. Shumail, SLAC National Accelerator Laboratory, US
4:00	Design and Prototyping for a Compact 10 MeV SRF Accelerator for Irradiation Purposes – Year 2 G. Ciovati, Thomas Jefferson National Accelerator Facility, US
4:40	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Working with the DOE National Laboratories' Accelerator R&D Capabilities - information session open to all	Maryland 5
	Session chair: Eric Colby, U.S. Department of Energy, US
4:40	DOE ARDAP Program Managers
4:00	TechConnect Innovation Showcase Reception, SBIR/STTR Program Office Meetup, Army xTech Showcase, Poster Session II (4:00 - 6:00)	Expo Hall AB
4:00	TechConnect Business Team Meet & Greet	Expo Hall AB
4:00	EPA P3 National Student Design Competition Showcase	Expo Hall AB
4:00	SBIR/STTR Pavilion	Expo Hall AB
	U.S. Department of Defense, US
	U.S. Navy, US
	U.S. Air Force, US
	U.S. Army, US
	HHS/NIH, US
	U.S. Department of Energy, US
	USSOCOM, US
	DARPA, US
	NSF, US
	DHS, US
	DHA, US
	NASA, US
	USDA, US
	CDC, US
	NOAA, US
	MDA, US
	EPA, US
	US DOT, US
	US Department of Education, US
	US SBA, US
4:00	Materials Characterization - Posters	Expo Hall AB
	A Powerful New Tool for Rapid Chemical Characterization of Advanced Manufacturing Materials E. Williams, J. Putman, P. Willis, Exum Instruments, US
	Versatile thin film adhesion and scratch testing machine for different material surfaces under various environmental condition W. Demisse, P. Tyagi, University of the District of Columbia, US
	A Decade Team Work in Pursuing Discoveries in Nanostructure Membrane Characterizations and Observations of Friedel-oscillation by AFM for Quantum Sensing and Energy Storage Applications J. Thornton, E.T. Chen, Advanced Biomimetic Sensors, Inc., US
	Democratizing the Assessment of Thermal Robustness of Metal-Organic Frameworks S. Bonakala, A. Abutaha, E. Palani, A. Samara, S. Mansour, F. El-Mellouhi, Hamad Bin Khalifa University, QA
	Chemical identification & characterization of sub-20nm residues and defects with Nano IR PiFM P. O'Hara, Molecular Vista, Inc., US
	High Resolution Measurement of Potential-Dependent Electrochemical Activities on HOPG Using Scanning Electrochemical Cell Microscopy (SECCM) M-H. Choi, S-J. Cho, L.A. Baker, S. Kaemmer, Park Systems inc., US
	Princeton Collaborative Research Facility: diagnostics and modeling for plasma material synthesis and processing applications Y. Raitses, I. Kaganovich, M. Shneider, A. Dogariu, S. Yatom, S. Gershman, I. Romadanov, N. Chopra, W. Villafana, Y. Ussenov, S. Abe, Princeton Plasma Physics Laboratory, US
	Wyonics: Advancing Sustainable Innovations in Wyoming D. Rone, J. O'Hayre, R.D. Rogers, G. Gurau, C.M. Hill, K.R. Di Bona, Wyonics, US
	Broadband Plasmonic SEIRA Structures for Signal Enhancement in nanoIR Spectroscopy G. Rutins, L. Tetard, University of Central Florida, US
4:00	Nanparticle Synthesis & Characterization - Posters	Expo Hall AB
	2-D Pd-cellulose with optimized morphology for the effective solar to steam generation O. Omelianovych, E. Park, H-S Choi, Chungnam National University, KR
	Core–Satellite–Satellite Hierarchical Nanostructures: Assembly, Plasmon Coupling, and Gap-Selective Surface-Enhanced Raman Scattering H. Duc Trinh, S. Yoon, Chung-Ang University, KR
4:00	Advanced Manufacturing - Posters	Expo Hall AB
	Efficient Fabrication of Self Organised Nanostructures C.C. Keen, Z. Na, National University of Singapore, SG
	Development of Antenna Systems for 4G, 5G and B5G Applications H.R.D. Filgueiras, T. H. Brandão, L.G. da Silva, A. Cerqueira S. Jr., National Institute of Telecommunications, BR
	Characterization of Optical and Charge Transport Properties of TCNQ-based Organic Field Effect Transistors Y. Chung, S. Melis, X. Zhang, P. Barbara, E. Van Keuren, Georgetown University, US
	Synthesis, structural study and optical properties of Dy3+ doped La(PO3)3 S. Chemingui, M. Ferhi, K. Horchani-Naifer and M. Férid, universty Tunis Elmanar, TN
	Plasmonic Nanomaterials Assisted 3-D printing of Thermoset Resins A. Saha, M. Finale, S. Chowdhury, New Mexico Institute of Mining and Technology, US
	Process Innovations to Advance the State-of-the-Art in Structural Materials E.Y. Chen, C.C. Chen, Transition45 Technologies, Inc, US
4:00	Printed & Flexible Electronics - Posters	Expo Hall AB
	Additive Manufacturing of Colloidal Nanocrystal Inks for In-Space Manufacturing of Advanced Sensors and Energy Harvesters F. Rajabi Kouchi, N. McKibben, A. Briggs, J. Manzi, M. Busuladzic-Begic, I. Estrada, J. Eixenberger, T. Varghese, H. Subbaraman, D. Estrada, Boise State University, US
	Functional Inks for Additive Manufacturing of Electronics T. Kirscht, M. Marander, F. Liu, S. Jiang, Iowa State University, US
	Wednesday June 21
8:30	Registration	Convention Center Pre-Function
9:00	CHIPS: Advances in Packaging for New Chips Innovation	Chesapeake 3
	Session chair: Joe Kline, National Institute of Standards and Technology, US
9:25	Novel, Robust Anisotropic Conductive Epoxy Technology for Advanced Semiconductor Packaging Applications M. Ramkumar, SunRay Scientific Inc., US
9:55	What’s Missing in Your Cure Kinetics Model for Advanced Epoxy Molding Compounds? R. Tao, S.P. Phansalkar, C. Kim, A.M. Forster, B. Han, National Institute of Standards and Technology, US
10:25	Enabling a circular economy of semiconductor process gases through Metal-Organic Frameworks (MOFs) M.H. Weston, NuMat Technologies, US
9:00	Materials for Sustainable Building	Chesapeake C
	Session chair: Jan Kosny, University of Massachusetts, Lowell, US
9:00	Scalable and Sustainable Waste-Wood-Based Insulation Materials for Building Energy Efficiency A. Siciliano, University of Maryland, US
9:20	Smart Windows for Energy-Efficient Buildings B.P. Jelle, Norwegian University of Science and Technology (NTNU), NO
9:40	Materials from renewable resources – great future or just a modern trend? Are they really sustainable? B. Kasal, Fraunhofer WKI Braunschweig Germany, DE
10:05	Coal-based Bricks & Blocks (CBBs): Process Development to Prototype Fabrication Coupled with Techno-Economic Analysis and Market Survey J.W. Heim II, R.L. Vander Wal, The Pennsylvania State University, US
9:00	Nanoparticle Synthesis & Characterization	Chesapeake 11
	Session chair: Jan Niehaus, Fraunhofer IAP-CAN, DE
9:00	Cadmium Reduced QDs for Superior Brightness and Stability within RoHS Limits J. Niehaus, S. Becker, Fraunhofer IAP-CAN, DE
9:20	Novel hydrogen peroxide-responsive polymer nanoparticles for medical applications E. Hughes, H. Cartwright, A. Stevens, L. Chen, E. Van Keuren, J. Reder, M. Ramstack, P. Kang, Georgetown University, US
9:40	Meta-control of a Heat Pump Nanoparticle Film W. Kohn, Z.B. Zabinsky, Y. Shen, University of Washington, US
10:00	Investigating the Synergistic Action of Tio2-Sds Nanoparticles Using Venturi-Shaped Micromixer H. Hoorfar, K.Y. Motlagh, Z.S. Motamedi, S. Fardindoost, University of Victoria, CA
10:20	Synthesis and application of multicomponent nanoparticles E. Van Keuren, E. Hughes, O. Bulgin, Y. Chung, S. Taylor, H. Cartwright, L. Chen, R. Alan, A. Keegan, A. Stevens, Georgetown University, US
10:40	Colloidal microchannel formation of binary particle solution R. Dumont, B. Li, Kennesaw State University, US
11:00	A new gold standard in catalyst S. Lim, S.H. Kang, QuantumCat Co., Ltd., KR
11:20	Reactive Laser Ablation Synthesis in Solution (r-LASiS): A facile route for one-pot synthesis of Al/C-based composite energetic nanomaterials (ENMs) with tailored interfacial structures D. Mukherjee, University of Tennessee, US
9:00	Advanced Materials for Engineering Applications	Chesapeake 2
	Session chair: Cy Wilson, NASA Langley Research Center, US & Jim Johnston, Victoria University of Wellington, NZ
9:00	The Spring's the Thing: How Kirigami Techniques and Biomimetic Adhesives can Remake Materials D. Sameoto, University of Alberta, CA
9:25	Micromachined Aerodynamics Measurement Technologies R. White, Tufts University, US
9:50	Geothermal Energy and Nanostructured Calcium Silicate – Climate Change Mitigation and Clean Water Protection J.H. Johnston, Victoria University of Wellington and CaSil Technologies Ltd, NZ
10:10	Tunable properties and microstructure net-shape aluminum matrix composites parts fabricated via 3D printing. M. Seleznev, J. Roy-Mayhew, J. Faust, Markforged Inc., US
10:30	Nano and Single-Atom Catalysts Manufacturing Assisted by Inexpensive Custom Designed Low-Temperature Plasma M.M. Feng, Polykala Technologies LLC, US
10:50	Novel Low Energy, High Speed Ambient Catalysis of Polymerization through Solid Objects A. Malofsky, Srinagesh Potluri, Nano Catalytics, Inc., US
11:10	Thermally Conductive Composite with High Mechanical Strength S-K Koh, C&G Hitech Co., Ltd., KR
11:20	Piezoelectric Nanofiber Yarns for Wearable Energy Harvesting Textiles M. Pallotta, Materic LLC, US
9:00	Printed & Flexible Electronics	Chesapeake B
	Session chair: Yiliang Wu, CollTech North America, US
9:00	Data-Driven Manufacturing of Hierarchical Functional Materials for Energy and Sensing Applications H.T.H. Shi, Western University, CA
9:25	How to Make Flexible Printed Circuits More Reliable A. Yu, CollTech, US
9:50	Process planning and development of a multi-axis, multi-material, multi-tool Electronic Packaging (3M3D) technique using Additive Manufacturing S. Karam, S. Bilén, G. Manogharan, Penn State University, US
10:00	Direct-Write Mask Free Fabrication of Quality 1D-2D Hybrid Nanomaterials on Supported or Suspended Platforms using Custom Inks and Chemical Vapor Deposition Synthesis. I. Kuljanishvili, Saint Louis University, US
9:00	TechConnect Innovation Pitches: Manufacturing, Instrumentation II	Maryland 2
	Session chair: Chris Menzel, Fujifilm Dimatix, US
9:00	Robotic Construction using AI, CV, and needing only 2D plans B. Wadas, BotBuilt, Inc, US
9:07	Passive contacless MicroWire sensor (based on bistable magnetic microwires) V. Marhefka, RVmagnetics, a.s., SK
9:14	Interactive Control System for Robot Manipulation with AR Technology Y. Li, Hong Kong Industrial Artificial Intelligence and Robotics Centre (FLAIR), HK
9:21	NovoJet Printhead Technology J. Kuhrt, Quantica GmbH, DE
9:28	Wireless Approach for Vibration Estimation of Structures (WAVES) A. Trias Blanco, Rowan University, US
9:35	Copper and tin 3D-printing ink for electronics D. Mayer, TechLink, US
9:42	High-gain high-power Planar Antenna array S. Mirchandani, Bryka Skystocks, LLC, IN
	Review Panelist C. Menzel, Fujifilm Dimatix, US
	Review Panelist M. Snider, ATI - Navy ManTech, US
	Review Panelist D. Ojika, Flapmax, US
9:00	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 1 - Industrial Partnerships in Accelerator Technology	Maryland 5
	Session chair: C. Ginsburg, U.S. Department of Energy, US
9:00	Introduction & Welcome C. Ginsburg, U.S. Department of Energy, US
9:20	Development of the U.S. Vendor base for high power RF klystrons S. Lenci, Communications & Power Industries, Inc., US
9:40	Towards industrial manufacturing of alkali antimonide photocathodes by automated thin film growth V. Pavlenko, Los Alamos National Laboratory, US
10:00	Manufacturing full-scale high gradient copper accelerators: Electron beam welding and allied processes P. Carriere, RadiaBeam Technologies, LLC, US
10:30	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 2 - Accelerator Physics and Simulation	Maryland 5
	Session chair: C. Ginsburg, U.S. Department of Energy, US
10:30	Computational methods for nanotip array electron sources B. Erdelyi, Northern Illinois University, US
10:50	Nonlinear Dynamics Studies in Ring Accelerator with Square Matrix Method and Rigid Rotation Diffeomorphism Y. Hao, Michigan State University, US
11:10	Numerical Optimization for Spin Dynamics in Electron (Positron) Storage Rings G. Hoffstaetter, Cornell University, US
11:30	Modeling high energy density conditions for electron beams at 4th generation light sources N. Cook, RadiaSoft, LLC, US
12:40	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 3 Superconducting Accelerator R&D	Maryland 5
	Session chair: C. Ginsburg, U.S. Department of Energy, US
12:40	Businesses Models for Advanced Superconductors and Superconducting Magnet Technology L. Cooley, Applied Superconductivity Center, Florida State University, US
1:00	Design, prototype and testing of a SRF cavity for a low-cost, compact accelerator for environmental applications G. Ciovati, Thomas Jefferson National Accelerator Facility, US
1:20	Optimization of superconducting radio frequency properties of sputtered Nb3Sn films for accelerator applications G. Eremeev, Fermi National Accelerator Laboratory, US
1:40	A metallurgical approach to improving Nb SRF Cavity Performance P. Lee, Florida State University, US
2:20	Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 4 New Particle Sources and Accelerator Concepts	Maryland 5
	Session chair: C. Ginsburg, U.S. Department of Energy, US
2:20	From Theory to Practical High Brightness Photocathodes W. Schroeder, University of Illinois at Chicago, US
2:40	On-Chip Integrated Photonics based Photocathodes R. Kapadia, University of Southern California, US
3:00	Demonstrating Improved Lifetime in Superlattice Photocathodes M. Andorf, Cornell University, US
3:20	Extreme Longitudinal Compression of Optimized Beams for MEV Ultrafast Electron Diffraction G. Hoffstaetter, Cornell University, US
3:40	Using the multi-Petawatt ZEUS facility for laser wakefield acceleration K. Krushelnick, University of Michigan, US
4:00	Feedback & Final Remarks from DOE E. Colby, U.S. Department of Energy, US
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