Printed & Flexible Electronics

Printed and Flexible Electronics

Symposium Co-Chairs

Yiliang Wu
Director of Technology and Innovation
Colltech North America

Glass Light Guide Plate with Lenticular and Lenticular Extraction Features
Mandakini Kanungo
Senior Research Scientist, Corning, Inc.

Key Speakers

Data-Driven Manufacturing of Hierarchical Functional Materials for Energy and Sensing Applications
Harvey Shi
Assistant Professor, Western University

Amandine Yu
Global Market Director
Colltech Group

Organics, Printed, and Flexible Electronics technologies will have a far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries, biomedical devices, and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event

Back to Top ↑ 2023 Symposium Sessions
	Tuesday June 20
4:00	Printed & Flexible Electronics - Posters
	Wednesday June 21
9:00	Printed & Flexible Electronics

2023 Symposium Program
	Tuesday June 20

4:00	Printed & Flexible Electronics - Posters	Expo Hall AB
	Additive Manufacturing of Colloidal Nanocrystal Inks for In-Space Manufacturing of Advanced Sensors and Energy Harvesters F. Rajabi Kouchi, N. McKibben, A. Briggs, J. Manzi, M. Busuladzic-Begic, I. Estrada, J. Eixenberger, T. Varghese, H. Subbaraman, D. Estrada, Boise State University, US
	Functional Inks for Additive Manufacturing of Electronics T. Kirscht, M. Marander, F. Liu, S. Jiang, Iowa State University, US
	Wednesday June 21

9:00	Printed & Flexible Electronics	Chesapeake B
	Session chair: Yiliang Wu, CollTech North America, US
9:00	Data-Driven Manufacturing of Hierarchical Functional Materials for Energy and Sensing Applications H.T.H. Shi, Western University, CA
9:25	How to Make Flexible Printed Circuits More Reliable A. Yu, CollTech, US
9:50	Process planning and development of a multi-axis, multi-material, multi-tool Electronic Packaging (3M3D) technique using Additive Manufacturing S. Karam, S. Bilén, G. Manogharan, Penn State University, US
10:10	Direct-Write Mask Free Fabrication of Quality 1D-2D Hybrid Nanomaterials on Supported or Suspended Platforms using Custom Inks and Chemical Vapor Deposition Synthesis. I. Kuljanishvili, Saint Louis University, US