JUNE 19-21, 2023
WASHINGTON, DC

Technical Program Co-Chairs


Matthew Laudon, TechConnect
Bart Romanowicz, TechConnect
Dalia Yablon, TechConnect

Founding Advisory Committee

Wolfgang Bacsa, University of Toulouse
Lynn Foster, Z-Field Technologies LLC
Lisa Friedersdorf,National Nanotechnology Coordination Office
Srinivas Iyer, Los Alamos National Laboratory

Chris Menzel, Fujifilm Dimatix, Inc.
Brent Segal, Lockheed Martin
William (Cy) Wilson, NASA Langley Research Center
Xing Zhou, Nanyang Technological University, Singapore


Organizing Committee

Thomas Anchordoquy, University of Colorado, US
Wolfgang Bacsa, University of Toulouse, France
John Barnes, The Barnes Global Advisors, US
Scott Broderick, University at Buffalo - SUNY, US
Jeannine Coburn, Worcester Polytechnic Institute, US
Philip Demokritou, Harvard School of Public Health, US
Eric Gale, Harvard Medical School, US
Imre Gyuk, U.S. Department of Energy, US
Jan-Willem Handgraaf, Siemens Digital Industries Software, Netherlands
Nanci Hardwick, MELD Manufacturing Corporation, US
Greg Haugstad, University of Minnesota, US
Sean Ireland, Fiberlean Technologies Ltd., US
Jim Johnston, Victoria University of Wellington, New Zealand
Mandakini Kanungo, Corning, Inc., US
John Kopasz, Argonne National Laboratory, US
Jan Kosny, University of Massachusetts, Lowell, US
Piotr Kulczakowicz, Quantum Startup Foundry, US
Marina Leite, University of California, Davis, US
Joey Mead, University of Massachusetts, Lowell, US
Chris Menzel, Fujifilm Dimatix, Inc., US
Prakash Nallathamby, Notre Dame University, US
World L-S Nieh, U.S. Forest Service, US

Alex Norman, Modern Meadow, US
Kwang Oh, University at Buffalo (SUNY), US
Martin Poitzsch, Aramco Services Company, US
Elena Polyakova, Graphene Laboratories, Inc., US
Yuanqiao Rao, The Dow Chemical Company, US
Richard Ross, 3M Company, US
Maksim Shivokhin, ExxonMobil, US
Christopher Sims, National Institute of Standards and Technology, US
Kenan Song, Arizona State University, US
Erik Spoerke, Sandia National Laboratories, US
Sam Stavis, National Institute of Standards and Technology, US
Anirudha Sumant, Argonne National Laboratory, US
Mark Swihart, University at Buffalo, SUNY, US
Ranjani Theregowda, Material Innovation Initiative, Canada
Loucas Tsakalakos, L3Harris Technologies, Inc., US
Puneet Tyagi, AstraZeneca, US
Dana Vanderwall, Schrodinger, US
Thomas Webster, Interstellar Therapeutics, US
William "Cy" Wilson, NASA Langley Research Center, US
Yiliang Wu, TE Connectivity, US
Dalia Yablon, TechConnect World Innovation Conference, US
Xindi Yu, The Dow Chemical Company, US
Steve Zullo, National Institute of Biomedical Imaging and Bioengineering, US


Review Committee

Thomas Anchordoquy, University of Colorado, US
Wolfgang Bacsa, University of Toulouse, France
John Barnes, The Barnes Global Advisors, US
Osman Basaran, Purdue University, US
Jean Berthier, Consultant, France
Scott Broderick, University at Buffalo - SUNY, US
Matt Clancy, UltraTech, US
Jeannine Coburn, Worcester Polytechnic Institute, US
Philip Demokritou, Harvard School of Public Health, US
Antoine F├ęcant, IFP energies Nouvelles, France
Kun (Kelvin) Fu, University of Delaware, US
Eric Gale, Harvard Medical School, US
Joamin Gonzalez-Gutierrez, Luxembourg Institute of Science and Technology, Luxembourg
Shubhodeep Goswami, GE Global Research, US
Imre Gyuk, U.S. Department of Energy, US
Johannes Hachman, Univesrity at Buffalo, SUNY, US
Jan-Willem Handgraaf, Siemens Digital Industries Software, Netherlands
Nanci Hardwick, MELD Manufacturing Corporation, US
Greg Haugstad, University of Minnesota, US
Lili He, University of Massachusetts, Amherst, US
Andreas Hieke, Stanford University, US
Jay Horwath, Univesrity of Pennsylvania, US
Sean Ireland, Fiberlean Technologies Ltd., US
Jim Johnston, Victoria University of Wellington, New Zealand
Steven Jons, DuPont Water Solutions, US
Mandakini Kanungo, Corning, Inc., US
Bryan Koene, Luna Innovations, US
John Kopasz, Argonne National Laboratory, US
Jan Kosny, University of Massachusetts, Lowell, US
Piotr Kulczakowicz, Quantum Startup Foundry, US
Kock-Yee Law, Research and Innovative Solutions, US
Sang-Young Lee, Yonsei University, South Korea
Marina Leite, University of California, Davis, US
C. Rebecca Locker, Modern Meadow, US
Anil Mane, Argonne National Laboratory, US
Joey Mead, University of Massachusetts, Lowell, US
Chris Menzel, Fujifilm Dimatix, Inc., US
Moein Moghimi, Newcastle University, United Kingdom
Sven Mumme, U.S. Department of Energy, US

Prakash Nallathamby, Notre Dame University, US
World L-S Nieh, U.S. Forest Service, US
Jan-Steffen Niehaus, Center for Applied Nanotechnology, Germany
Patricia Nieva, University of Waterloo,Canada
Alex Norman, Modern Meadow, US
Kwang Oh, University at Buffalo, SUNY, US
Martin Poitzsch, Aramco Services Company, US
Elena Polyakova, Graphene Laboratories, Inc., US
Zhiyuan (Zach) Qian, Modern Meadow, US
Yuanqiao Rao, The Dow Chemical Company, US
Bart Romanowicz, TechConnect World Innovation Conference, US
Richard Ross, 3M Company, US
Robert Rudd, Lawrence Livermore National Laboratory, US
Paul Sander, UltraTech, US
Luis Santos, AstraZeneca, US
Neeraj Sharma, 3M Corporate Research Laboratory, US
Amarda Shehu, George Mason University, US
Maksim Shivokhin, ExxonMobil, US
Ginger Sigmon, Energy Frontier Research Center, US
Christopher Sims, National Institute of Standards and Technology, US
Emilie J Siochi, NASA Langley Research Center, US
Kenan Song, Arizona State University, US
Erik Spoerke, Sandia National Laboratories, US
Sam Stavis, National Institute of Standards and Technology, US
Anirudha Sumant, Argonne National Laboratory, US
Mark Swihart, University at Buffalo, SUNY, US
Ranjani Theregowda, Material Innovation Initiative, Canada
Loucas Tsakalakos, L3Harris Technologies, Inc., US
Puneet Tyagi, AstraZeneca, US
Dana Vanderwall, Schrodinger, US
Erika Vreeland, Sandia National Laboratories, US
Thomas Webster, Interstellar Therapeutics, US
William (Cy) Wilson, NASA Langley Research Center, US
Yiliang Wu, TE Connectivity, US
Dalia Yablon, TechConnect World Innovation Conference, US
Yaroslava Yingling, North Carolina State University, US
Xindi Yu, The Dow Chemical Company, US
Xing Zhou, Nanyang Technological University, Singapore
Steve Zullo, National Institute of Biomedical Imaging and Bioengineering, US


Conference Operations Manager

Sarah Wenning, NSTI & TechConnect Group, USA

Sponsors & Partners
 
2022 SBIR/STTR AGENCY PARTNERS
SBIR/STTR Agency Partners