JUNE 19-21, 2023
WASHINGTON, DC


Special Symposium: CHIPS R&D — Challenges and Opportunities

CHIPS

Symposium Co-Chairs

Dalia YablonDalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

Alex NormanAlex Norman
Executive Director
Princeton Institute of Materials

R. Joseph KlineX-ray Metrology for Semiconductor Nanostructures
R. Joseph Kline
Project Leader, National Institute of Standards and Technology

 

Key Speakers

Daniel SchmidtIn-Line Metrology Requirements and Needs for Leading Edge Technology
Daniel Schmidt
Metrology Engineer, IBM Research

David HenshallCHIPS Act Semiconductor Metrology Needs for R&D
David Henshall
VP of Business Development, Semiconductor Research Corporation (SRC)

Semiconductor manufacturing for meta-optics
Wei Ting Chen
Founder, SNOChip

Xiaoting GuSolutions for Gate-all-around (GAA) Device Development and Manufacturing
Xiaoting Gu
Senior Manager, Thermo Fisher Scientific

Daniel LopezThe role of academia in the future of semiconductor manufacturing
Daniel Lopez
Professor, The Pennsylvania State University

Sandip BasuMitigating challenges in high resolution imaging and electrical failure analysis for advanced semiconductor devices
Sandip Basu
Product Marketing Manager, Zeiss Microscopy

Marla DowellCHIPS for America Research and Development
Marla Dowell
Director, NIST

Lisa FriedersdorfLisa Friedersdorf
Assistant Director for Microelectronics, Materials, and Critical Minerals
Office of Science and Technology Policy

 

With passage of the 2022 CHIPS for America Act, the US government is making a $50 billion investment to catalyze long-term growth in the domestic semiconductor industry in support of US national and economic security. A significant portion of this funding - $11 billion – goes towards R&D initiatives to create a network of innovation in the US semiconductor ecosystem.

This symposium will focus on 3 target areas identified as critical to the R&D initiatives:

  1. Metrology and characterization needs for leading-edge CMOS and beyond CMOS technologies including 3D devices for logic and memory
  2. Measurements for advanced packaging/3D heterogeneous integration
  3. Material purity and quality – requirement and challenges for the semiconductor industry as contamination and purity standards continue to become more strict.

*This symposium gathers experts to discuss research challenges and opportunities associated with the recently passed CHIPS act, but it is not an official activity by or related to the US CHIPS office.

 
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2023 Symposium Sessions

1:30CHIPS: Current Challenges and New Solutions to Boost Domestic Chips Manufacturing I

Tuesday June 20

10:30CHIPS: Keynotes
1:30CHIPS: Advanced Metrology to Ensure Success for Next Generation Semiconductors

Wednesday June 21

9:00CHIPS: Advances in Packaging for New Chips Innovation

2023 Symposium Program

Monday June 19

1:30CHIPS: Current Challenges and New Solutions to Boost Domestic Chips Manufacturing IChesapeake 3
Session chair: Joe Kline, National Institute of Standards & Technology, US
1:30Mitigating challenges in high resolution imaging and electrical failure analysis for advanced semiconductor devices
S. Basu, Zeiss, US
1:55Critical Materials for Critical Goods: Rebuilding the Microelectronics Industrial Base
A.N. Caruso, Midwest Microelectronics Collective, US
2:15Semiconductor manufacturing for meta-optics
W.T. Chen, SNOChip, US
2:40Vulnerability of In-Memory Compute to Hardware Trojans: A Case Study using Two-dimensional Memtransistor
A. Wali, H. Ravichandran, S. Das, Pennsylvania State University, US
3:00Accelerate time to market of semiconductor industry using AI software platform dedicated to data analytics for metrology and defectivity
J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, O. Cru, T. Ziraoui and S. Girard, Pollen Metrology, FR
3:20A Novel Photonic Switching Device
K. Sampayan, S. Sampayan, Opcondys, Inc., US

Tuesday June 20

10:30CHIPS: KeynotesNational Harbor 6
Session chair: Alex Norman, Princeton University, US
10:30Whole-of-Government efforts to support microelectronics R&D
L.E. Friedersdorf, Office of Science and Technology Policy, US
10:55The role of academia in the future of semiconductor manufacturing
D. Lopez, Pennsylvania State University, US
11:20CHIPS for America Research and Development
M. Dowell, National Institute of Standards and Technology, US
1:30CHIPS: Advanced Metrology to Ensure Success for Next Generation SemiconductorsNational Harbor 6
Session chair: Alex Norman, Princeton University, US
1:30In-Line Metrology Requirements and Needs for Leading Edge Technology
D. Schmidt, IBM Research, US
1:55Solutions for Gate-all-around (GAA) Device Development and Manufacturing
X. Gu, P. Hsu, Y.H. Kim, A. Mani, P. Kirby, Thermo Fisher Scientific, US
2:20CHIPS Act Semiconductor Metrology Needs for R&D
D. Henshall, V. Zhirnov, T. Younkin, Semiconductor Research Corporation (SRC), US
2:45Break
2:55Surface and subsurface quantitative mechanical property measurements by contact resonance atomic force microscopy on low-k dielectric structures
G. Stan, C.V. Ciobanu, S.W. King, National Institute of Standards and Technology, US
3:15Analysis of buried interfaces for device technology by soft and hard X-ray photoemission
K. Artyushkova, J. Mann, S. Zaccarine, Physical Electronics, US
3:35Evaluating the Impact of Defects, Interfaces and Boundaries on Thermal Transport in 2D Materials Using a Novel Opto-Thermal Metrology Technique with Sub-Micron Resolution
B.M. Foley, A.H. Jones, J.T. Gaskins, P.E. Hopkins, Laser Thermal Inc, US
3:55Silicon Dopant Quantification in Atom Probe Tomography
K. DeRocher, M. McLean, F. Meisenkothen, National Institute of Standards and Technology, US

Wednesday June 21

9:00CHIPS: Advances in Packaging for New Chips InnovationNational Harbor 6
Session chair: Joe Kline, National Institute of Standards and Technology, US
9:00Novel, Robust Anisotropic Conductive Epoxy Technology for Advanced Semiconductor Packaging Applications
M. Ramkumar, SunRay Scientific Inc., US
9:20What’s Missing in Your Cure Kinetics Model for Advanced Epoxy Molding Compounds?
R. Tao, S.P. Phansalkar, C. Kim, A.M. Forster, B. Han, National Institute of Standards and Technology, US
9:40Enabling a circular economy of semiconductor process gases through Metal-Organic Frameworks (MOFs)
M.H. Weston, NuMat Technologies, US
10:00X-ray Metrology for Semiconductor Nanostructures
J. Kline, National Institute of Standards and Technology,, US
Topics & Application Areas
  • Advanced metrology
  • Advanced Packaging
  • Material purity and quality
  • Workforce development
  • In-line process characterization
  • Visualization and automation
  • Other
 

Sponsor & Exhibitor Opportunities
 

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SBIR/STTR AGENCY PARTNERS
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