Special Symposium: CHIPS R&D — Challenges and Opportunities

CHIPS

Submit your Early Bird Abstract for a 15% reg discount - due December 16

Please first review the information for authors — abstract submission guidelines.

Symposium Co-Chairs

Dalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

Alex Norman
Executive Director
Princeton Institute of Materials

Joe Kline
Project Leader
NIST

Key Speakers

Daniel Schmidt
Metrology Engineer
IBM

David Henshall
VP of Business Development
SRC

Roya Lahiji
Director
Intel

Wei Ting Chen
Founder
SNOChip

Xiaoting Gu
Senior Manager
Thermo Fisher Scientific

With passage of the 2022 CHIPS for America Act, the US government is making a $50 billion investment to catalyze long-term growth in the domestic semiconductor industry in support of US national and economic security. A significant portion of this funding - $11 billion – goes towards R&D initiatives to create a network of innovation in the US semiconductor ecosystem.

This symposium will focus on 3 target areas identified as critical to the R&D initiatives:

Metrology and characterization needs for leading-edge CMOS and beyond CMOS technologies including 3D devices for logic and memory
Measurements for advanced packaging/3D heterogeneous integration
Material purity and quality – requirement and challenges for the semiconductor industry as contamination and purity standards continue to become more strict.

*This symposium gathers experts to discuss research challenges and opportunities associated with the recently passed CHIPS act, but it is not an official activity by or related to the US CHIPS office.

Topics & Application Areas