JUNE 19-21, 2023
WASHINGTON, DC


Special Symposium: CHIPS R&D — Challenges and Opportunities

CHIPS

Submit your Poster Only Abstract - due March 31

Please first review the information for authors — abstract submission guidelines.

Symposium Co-Chairs

Dalia YablonDalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

Alex NormanAlex Norman
Executive Director
Princeton Institute of Materials

Joe KlineJoe Kline
Project Leader
NIST

 

Key Speakers

Daniel SchmidtIn-Line Metrology Requirements and Needs for Leading Edge Technology
Daniel Schmidt
Metrology Engineer, IBM

David HenshallCHIPS Act Semiconductor Metrology Needs for R&D
David Henshall
VP of Business Development, SRC

Roya LahijiRoya Lahiji
Director
Intel

Wei Ting ChenSemiconductor manufacturing for meta-optics
Wei Ting Chen
Founder, SNOChip

Xiaoting GuSolutions for Gate-all-around (GAA) Device Development and Manufacturing
Xiaoting Gu
Senior Manager, Thermo Fisher Scientific

Daniel LopezThe role of academia in the future of semiconductor manufacturing
Daniel Lopez
Professor, Penn State University

Sandip BasuMitigating challenges in high resolution imaging and electrical failure analysis for advanced semiconductor devices
Sandip Basu
Product Marketing Manager, Zeiss Microscopy

David Hill3DHI in Geiger-mode Avalanche Photodiode Arrays
David Hill
Senior Research Scientist, SRI International

 

With passage of the 2022 CHIPS for America Act, the US government is making a $50 billion investment to catalyze long-term growth in the domestic semiconductor industry in support of US national and economic security. A significant portion of this funding - $11 billion – goes towards R&D initiatives to create a network of innovation in the US semiconductor ecosystem.

This symposium will focus on 3 target areas identified as critical to the R&D initiatives:

  1. Metrology and characterization needs for leading-edge CMOS and beyond CMOS technologies including 3D devices for logic and memory
  2. Measurements for advanced packaging/3D heterogeneous integration
  3. Material purity and quality – requirement and challenges for the semiconductor industry as contamination and purity standards continue to become more strict.

*This symposium gathers experts to discuss research challenges and opportunities associated with the recently passed CHIPS act, but it is not an official activity by or related to the US CHIPS office.

 
Topics & Application Areas
  • Advanced metrology
  • Advanced Packaging
  • Material purity and quality
  • Workforce development
  • In-line process characterization
  • Visualization and automation
  • Other
 

Sponsor & Exhibitor Opportunities
 

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Sponsors & Partners
 
2022 SBIR/STTR AGENCY PARTNERS
SBIR/STTR Agency Partners