JUNE 17-19, 2024
WASHINGTON, DC    


Electronics & Microsystems

Submit Poster Abstract - due April 1 »

Join industry partners and applied research leadership accelerating the development and deployment of advanced electronics solutions into products and society.


Speakers and Chairs Include:


2023 Sector Program - Electronics & Microsystems

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Sessions

7:00Registration
8:00TechConnect World Innovation Conference - Plenary Keynotes
9:00Carbon Nanostructures & Applications
9:00Photonics
9:00Novel Chemical & Physical Sensors
9:00TechConnect Innovation Pitches: Space, Defense, Mobility
9:00TechConnect Innovation Pitches: Manufacturing, Instrumentation
9:00Army xTech Startup Summit (Private Meeting)
10:30Health Tech and Space Sprint - Sponsored by Brycetech
10:45TechConnect Innovation Pitches: Biotech, Pharma, Health
10:30TechConnect Innovation Pitches: Advanced Materials & Chemicals I
1:30Fusion Manufacturing Innovation Challenge - UK Atomic Energy Authority & Commonwealth Fusion Systems
2:40Fusion Manufacturing Innovation Challenge - UK Atomic Energy Authority & Commonwealth Fusion Systems
1:30CHIPS: Current Challenges and New Solutions to Boost Domestic Chips Manufacturing I
1:30Synthesis of Novel 2D materials
1:30Additive Manufacturing: Digital
1:30Biosensors & Medical Applications
1:30NSF Engineering Research Visioning Alliance (ERVA) - Partnering (Pre-Registration Required)
1:30Army xTech Startup Summit (Private Meeting)
3:00Legal Perspective: Strategic IP and Funding Considerations for Innovative Companies
4:00TechConnect Innovation Showcase Reception, Corporate Scout Speed Dating, Army xTech Showcase, Poster Session I (4:00 - 6:00)
4:00TechConnect Business Team Meet & Greet
4:00TechConnect Corporate Scout Speed Dating
4:00Graphene & Carbon Nanostructures - Posters
4:00Additive Manufacturing - Posters
4:00Advanced Materials for Engineering Applications - Posters
4:00Sensors & Lab-on-a-Chip - Posters

Tuesday June 20

8:30Joint TechConnect & SBIR/STTR Keynote Program
9:00Medical & WMD Countermeasures Summit - Keynote (CWMD/MCDC Members meeting)
10:302D Materials Based Devices
10:30Additive Manufacturing: Machines
10:30Quantum Information Sciences & Technologies
10:30Nano4Earth - National Nanotechnology Coordination Office
10:30Navy MANTECH Advanced Manufacturing Challenge
10:30TechConnect Innovation Pitches: Electronics, Sensors, Communications
10:30Army xTech Startup Summit (Private Meeting)
11:00Medical & WMD Countermeasures Summit - (CWMD/MCDC Members meeting)
1:00Navy MANTECH Advanced Manufacturing Challenge
2:30Navy MANTECH Advanced Manufacturing Challenge
1:30CHIPS: Advanced Metrology to Ensure Success for Next Generation Semiconductors
1:30Graphene and 2D Materials for Energy Related Applications
1:30Advanced Manufacturing Innovation
1:30Micro & Bio Fluidics, Lab-on-a-Chip
1:30TechConnect Innovation Pitches: Electronics, Sensors & Communications
1:00Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 2 NIR Laser Technologies for Scientific Research
2:00Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 3 MIR and LWIR Laser Technologies for Scientific Research
3:00Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 4 High Power Industrial Accelerator Technologies - RF Sources
3:40Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 5 High Power Industrial Accelerator Technologies - Linacs
4:40Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Working with the DOE National Laboratories' Accelerator R&D Capabilities - information session open to all
1:00CBRN Defense Modernization Challenge - Protection (MCDC & CWMD Sponsored)
2:00CBRN Defense Modernization Challenge - Medical (MCDC & CWMD Sponsored)
3:00CBRN Defense Modernization Challenge - Medical (MCDC & CWMD Sponsored)
4:00CBRN Defense Modernization Challenge - Sensors (MCDC & CWMD Sponsored)
4:00TechConnect Innovation Showcase Reception, SBIR/STTR Program Office Meetup, Army xTech Showcase, Poster Session II (4:00 - 6:00)
4:00TechConnect Business Team Meet & Greet
4:00EPA P3 National Student Design Competition Showcase
4:00SBIR/STTR Pavilion
4:00Materials Characterization - Posters
4:00AI for Materials - Posters
4:00Printed & Flexible Electronics - Posters

Wednesday June 21

8:30Registration
9:00CHIPS: Advances in Packaging for New Chips Innovation
9:00Advanced Materials for Engineering Applications
9:00Printed & Flexible Electronics
9:00TechConnect Innovation Pitches: Biotech & Medical
9:00TechConnect Innovation Pitches: Manufacturing, Instrumentation II
10:30TechConnect Innovation Pitches: Medical Devices & Materials
9:00Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 1 - Industrial Partnerships in Accelerator Technology
10:30Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 2 - Accelerator Physics and Simulation
7:30Medical & WMD Countermeasures Summit - (CWMD/MCDC Members meeting)
12:40Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 3 Superconducting Accelerator R&D
2:20Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 4 New Particle Sources and Accelerator Concepts
1:00Medical & WMD Countermeasures Summit - (CWMD/MCDC Members meeting)

Program

Monday June 19

7:00RegistrationConvention Center Pre-Function
8:00TechConnect World Innovation Conference - Plenary KeynotesMaryland A
Session chair: Matthew Laudon, TechConnect Division, ATI, US
8:00Welcome to TechConnect
M. Laudon, TechConnect ATI, US
8:05TechConnect Overview: Connecting Research, Accelerating Innovation
D. Yablon, J. Rocha, TechConnect ATI, US
8:15Army xTech - Innovation Acceleration
A. D'Agostino, Army xTech, US
8:30The Future of Biosensing: Detecting Emerging Properties that Signal Underlying Disease Susceptibilities
L. Sohn, University of California, Berkeley, US
9:00Carbon Nanostructures & ApplicationsChesapeake 1
Session chair: Christopher Sims, National Institute of Standards & Technology, US
9:00Novel Designs for Single Photon Detection based on Molecular and Nanoscale Systems
F. Leonard, Sandia National Laboratories, US
9:25Overcoming the Materials Science Challenges to Leveraging Semiconducting Carbon Nanotubes in Logic and RF Technologies
M. Arnold, University of Wisconsin, US
9:50Aligned Arrays of Carbon Nanotubes with High Semiconducting Purity for Integrated Circuits
J Provine, Y. Yemane, Aligned Carbon, US
10:10High-Performance Highly-Scaled Carbon Nanotube Transistors: Recent advances on device component modules and integrated MOSFETs
G. Pitner, TSMC Corporate Research, US
10:35Semi-Automated Exploration of Aqueous Two-Phase Extraction Parameters for Single-wall Carbon Nanotube Separations via Fluorescence Spectroscopy
C.M. Sims, J.A. Fagan, National Institute of Standards and Technology, US
10:55A study on the effect of graphene oxide additives on the graphitization of carbon-carbon (C-C) composites
S. Ike, S. Ling, R. Vander Wal, Penn State University, US
9:00PhotonicsChesapeake C
Session chair: Chris Menzel, Fujifilm Dimatix, Inc., US
9:00Frontiers of the American Integrated Photonics Ecosystem: Sensors, PDKs, and Workforce Development
K. McComber, S. Nelan, Spark Photonics, US
9:25ActiveHogel, A Light-Field Photonic Solution
T. Burnett, FoVI3D, Inc., US
9:45Using 3D Printed Metamaterial Filters to Mitigate Inaudible Ultrasound Attacks on Smart Speakers
C. Shen, J. Lloyd, C. Ludwikowski, D. Phansalkar, C. Malik, Rowan University, US
10:05Taking aim – accurate integration of quantum dots and bullseye cavities
C.R. Copeland, A.L. Pintar, R.G. Dixson, A. Chanana, K. Srinivasan, D.A. Westly, B.R. Ilic, M.I. Davanco, S.M. Stavis, National Institute of Standards and Technology, US
10:25“Printing” High Performance All-Inorganic Metalenses, Waveguides and Diffractive Optics
D.E. Jung, V.J. Einck, L. Verrastro, A. Arbabi, J.J. Watkins, University of Massachsuetts, US
10:45Deep Diffractive Neural Network Meta-surface: Smart Optics through Smart Design
I.U. Idehenre, Azimuth Corporation, US
9:00Novel Chemical & Physical SensorsChesapeake B
Session chair: Martin Poitzsch, Aramco Services Company, US
9:00Continuous Methane Sensing for Rapid Detection and Repair of Intermittent Emitters
A. Speck, Schlumberger-Doll Research, US
9:25A smart and nanostructured perovskite for selective NO sensing in a broader temperature range
B. Saruhan, S. Nahirniak, Ch. Krasmann, R. Lontio Fomekong, German Aerospace Center (DLR e.V.), DE
9:45Cryogenic Helium Flow Sensor System
K. Jordan, G. Biallas, Jefferson Science Associates, US
10:05Break
10:15Wireless and Battery-Less Universal Power Consumption Monitoring Sensor
W. Yu, Archimedes Controls Corp., US
10:35Development of electromagnetic and acoustic metamaterials for demanding industrial applications
D. Swett, Aramco Research Services, US
11:00Ultrawideband Multistatic Positioning System
E. Heidhausen, University Research Foundation, US
11:20Miniaturized contactless sensors based on magnetically bistable microwires
R. Varga, RVmagnetics, a.s., SK
9:00TechConnect Innovation Pitches: Space, Defense, MobilityMaryland 1
Session chair: Nick Kacsandi, TechConnect Division, ATI, US
9:00ISS National Laboratory Innovation Spotlight
M. Alafrangy, International Space Station National Laboratory (ISSNL), US
9:15Wide-area Intelligence Surveillance and Reconnaissance Discovery (WISRD)
K. Mullis, CyOne Inc., US
9:22Advanced Compression Ignition Aviation Propulsion System
S. White, DeltaHawk Engines, Inc., US
9:29Electric - VTOL Hybrid LTA (Lighter Than AIr) Unmanned AIrships
J. White, Galaxy Unmanned Systems LLC, US
9:36SAUCED ( Smart, Adaptive, Ultra-Reliable, Cyber-Resilient, Efficient Data Infrastruture )
J. Song, Genesis Codes Inc, US
9:43A multi environment commercial spacesuit platform
K. Rambhatla, Metakosmos, AU
9:50Gyro-Magnetometer for Inertial Navigation Systems
K. Bechta-Metti, The Australian National University, AU
9:57Batch-manufacturing of biosensors in microgravity
S. Massa, Ecoatoms, US
Review Panelist
C. Owens, Lockheed Martin, US
Review Panelist
C. Collins, U.S. Air Force, US
Review Panelist
C. Chin, CLC Advisors, US
Review Panelist
C. Nieto, IEEE Entrepreneurship, US
Review Panelist
M. Alafrangy, International Space Station National Laboratory (ISSNL), US
9:00TechConnect Innovation Pitches: Manufacturing, InstrumentationMaryland 2
Session chair: Bart Romanowicz, TechConnect Division, ATI, US
9:00TechLink Innovation Spotlight
B. Metzger, TechLink, US
9:15Cryogenic Helium Gas Flow Meter
G. Biallas, Hyperboloid LLC, US
9:22Revolutionary Affordable 3D Sand Printer for Metalcasting Agility, Lightweighting & Advanced Materials
D. Shirkey, LightSpeed Concepts Inc., US
9:29Predictive Critical Mineral Measurement Software
A. Benson, Microbeam Technologies Inc., US
9:36EV-Powered Mobile 3D Concrete Printing of In Situ Material
Z. Graber, necoTECH, US
9:43Advanced Manufacturing Tech
A. Badesha, Orbital Composites, Inc., US
9:50Compact subsea lidar for micro/mini ROVs and AUVs
E. Larson, Tampa Deep Sea Xplorers, Inc., US
Review Panelist
J. Wong, IEEE, US
Review Panelist
M. Snider, ATI - Navy ManTech, US
Review Panelist
B. Segal, Lockheed Martin, US
Review Panelist
T. Long, Northrop Grumman, US
9:00Army xTech Startup Summit (Private Meeting)Maryland 6
10:30Health Tech and Space Sprint - Sponsored by BrycetechMaryland 3
Session chair: Jonathan Jakischa & Katie Bornfleth, TechConnect Division, ATI, US
10:45Sprint Pitch: Neurxstem
Neurxstem, US
10:52Sprint Pitch: Ejenta
Ejenta, US
10:59Sprint Pitch: EverMind
EverMind, US
11:06Sprint Pitch: MelaTech
MelaTech, US
11:13Sprint Pitch: Nanoionix
Nanoionix, LLC, US
11:20Sprint Pitch: SiOxMed
SiOxMed, US
11:27Sprint Pitch: UC Berkeley
UC Berkeley, US
11:34Sprint Pitch: ViBo Health
ViBo Health, US
11:41Sprint Pitch: Massachusetts General Hospital
Massachusetts General Hospital, US
Review Panelist
J. David, BryceTech, US
Review Panelist
C. Mullins, BryceTech, US
Review Panelist
A. Yuen, McKinsey & Company, US
Review Panelist
R. Pottathil, Zero Gravity Solutions, US
Review Panelist
T. Marshburn, Sierra Space, US
10:45TechConnect Innovation Pitches: Biotech, Pharma, HealthMaryland 1
Session chair: C. Clyburn, MedForeSight, US
10:45Trust-as-a-Service (TaaS) solution
R. Huber, Veridat, US
10:52Automating Rheumatoid Arthritis Assessment Via Deep Learning
J. Tan, National University of Singapore, SG
10:59Z-pods®
C. Hinkle, Zylo Therapeutics, Inc., US
11:06sam
A. Childress, 3 CulinaryMed Docs, US
11:13Human Brain Disease Models
R. Anand, Neurxstem Inc, US
11:20Carbon Monoxide Prodrug and Related Delivery Systems for Therapeutics
K. Franklin, Georgia State University, US
11:27NeuroRehab
V. Somareddy, Neuromersive Inc, US
Review Panelist
M. Stebbins, ATI - Medical & CBRN Defense Consortium (MCDC), Countering Weapons of Mass Destruction Consortium (CWMD), CA
Review Panelist
A. Emondi, PionTier, LLC., US
Review Panelist
C. Clyburn, MedForeSight, US
Review Panelist
C. Clyburn, MedForeSight, US
10:30TechConnect Innovation Pitches: Advanced Materials & Chemicals IMaryland 2
Session chair: S. Bagheri, University of Waterloo, CA
10:45Conductive Copper Inks
B. Bischoff, Copprium, Inc., US
10:52Environmentally friendly and efficient smart garments and heated textiles
A. Digon, Soliyarn, Inc., US
10:59High-density, direct photo-patterning of stretchable electronic polymers
Y.L. Chen, Stanford University - Office of Technology Licensing, US
11:06Compostable polyester plastics
L. Micek, University of Minnesota, US
11:13Multistable elastic pixels (MEPs) for reversible programming of optical properties
T. Bray, University of Pennsylvania or University of Pennsylvania-Penn Center for Innovation, US
11:203D Bioprinting using Stiffened Polymer Bioinks and Bioorthogonal Crosslinkers
Y.L. Chen, Stanford University - Office of Technology Licensing, US
11:27Industrial Bioplastics for a Circular Carbon Economy
J. Puracal, ZILA BioWorks, US
Review Panelist
J. Epstein, Lockheed Martin, US
Review Panelist
M. Aubart, Arkema, US
Review Panelist
C. Paul, Henkel, DE
Review Panelist
J. Wong, IEEE, US
Review Panelist
J. Yang, DMV Bio, US
1:30Fusion Manufacturing Innovation Challenge - UK Atomic Energy Authority & Commonwealth Fusion SystemsMaryland 3
Session chair: Jonathan Jakischa & Katie Bornfleth, TechConnect Division, ATI, US
1:30Fusion Challenge - Introduction
J. Jakischa, TechConnect Division, ATI, US
1:45Welcome - UKAEA & CFS
TBA, UK Atomic Energy Authority & Commonwealth Fusion Systems, UK
2:00Challenge Pitch: AlchLight
AlchLight, LLC, US
2:07Challenge Pitch: ALSYMEX
ALSYMEX, FR
2:14Challenge Pitch: Dr. Fritsch GmbH & Co. KG
Dr. Fritsch GmbH & Co. KG, DE
2:21Challenge Pitch: Faraday Technology
Faraday Technology, Inc., US
2:28Challenge Pitch: Fourier LLC
Fourier LLC, US
Review Panelist
H. Lewtas, UK Atomic Energy Authority, UK
Review Panelist
J. Deshpande, Commonwealth Fusion Systems, UK
Review Panelist
L. Aucott, UK Atomic Energy Authority, UK
Review Panelist
D. Raghu, Kaleidescope Energy, US
Review Panelist
R. Dylla-Spears, Lawrence Livermore National Laboratory, US
Review Panelist
A. Lumsdaine, Oak Ridge National Laboratory, US
2:40Fusion Manufacturing Innovation Challenge - UK Atomic Energy Authority & Commonwealth Fusion SystemsMaryland 3
2:40Challenge Pitch: Imperial College London
Imperial College London, US
2:47Challenge Pitch: Transition45 Technologies, Inc.
Transition45 Technologies, Inc., US
2:54Challenge Pitch: Unitive Design and Analysis
Unitive Design and Analysis Ltd, US
3:01Challenge Pitch: University of Nottingham
University of Nottingham, US
3:08Challenge Pitch: Baugh and Weedon NDE Ltd
Baugh and Weedon NDE Ltd, US
Review Panelist
H. Lewtas, UK Atomic Energy Authority, UK
Review Panelist
J. Deshpande, Commonwealth Fusion Systems, UK
Review Panelist
L. Aucott, UK Atomic Energy Authority, UK
Review Panelist
D. Raghu, Kaleidescope Energy, US
Review Panelist
R. Dylla-Spears, Lawrence Livermore National Laboratory, US
Review Panelist
A. Lumsdaine, Oak Ridge National Laboratory, US
1:30CHIPS: Current Challenges and New Solutions to Boost Domestic Chips Manufacturing IChesapeake 3
Session chair: Joe Kline, National Institute of Standards & Technology, US
1:30Mitigating challenges in high resolution imaging and electrical failure analysis for advanced semiconductor devices
S. Basu, Zeiss, US
1:55Critical Materials for Critical Goods: Rebuilding the Microelectronics Industrial Base
A.N. Caruso, Midwest Microelectronics Collective, US
2:15Semiconductor manufacturing for meta-optics
W.T. Chen, SNOChip, US
2:40Vulnerability of In-Memory Compute to Hardware Trojans: A Case Study using Two-dimensional Memtransistor
A. Wali, H. Ravichandran, S. Das, Pennsylvania State University, US
3:00Accelerate time to market of semiconductor industry using AI software platform dedicated to data analytics for metrology and defectivity
J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, O. Cru, T. Ziraoui and S. Girard, Pollen Metrology, FR
3:20A Novel Photonic Switching Device
K. Sampayan, S. Sampayan, Opcondys, Inc., US
1:30Synthesis of Novel 2D materialsChesapeake 1
Session chair: Elena Polyakova, Graphene Laboratories, US & Anirudha Sumant, Argonne National Laboratory, US
1:30Automated atomic-scale assembly of synthetic quantum materials
A. Mannix, Stanford University, US
1:55Properties of VO2 thin films grown through remote epitaxy on graphene interlayer
L. Stan, H. Cao, X. Yan, Y. Li, W. Chen, N.P. Guisinger, H. Zhou, D.D. Fong, Argonne National Laboratory, US
2:15Next generation powerful batteries with layered graphene anode
T. Paronyan, Hexalayer LLC, US
2:35Rapid, Large Area Fabrication of Porous Graphene Networks from Polyaniline on Carbon Fiber using Photothermal Processing for High Performance Supercapacitors
A. Bhardwaj, J.J. Watkins, University of Massachusetts Amherst, US
1:30Additive Manufacturing: DigitalChesapeake 2
Session chair: Slade Gardner, Big Metal Additive, US
1:30Innovating with AlMgty – the high performance Aluminium Alloy for Industrial Applications
M. Reddy, Fehrmann Tech Group, DE
1:55Enabling Additive Manufacturing of Reflective Metals
J.E. Barnes, M. Vlasea, Metal Powder Works, US
2:15A novel hybrid approach to laser additive manufacturing of aluminum alloys with concurrent cryogenic quenching for improved microstructure and hardness
C. Grohol, Y.C. Shin, Purdue University, US
2:35The SAE AMS - Additive Manufacturing Data Consortium
B. Bihlman, SAE Industry Technologies Consortia, US
3:00Break
3:10Post-Process Superfinishing of Additively Manufactured Aluminum Components with Complex Geometries
R. Shealy, REM SURFACE ENGINEERING, US
3:30Postprocess Effects to Fatigue Behavior of Additively Manufactured Maraging Steel
M. Rutkevičius, E.A. Périgo, ABB Inc., US
3:50Software tool for in-space printing of reliable parts
R. Bhowmik, S. Jha, Polaron Analytics, US
4:10Development of Build and Post-Build Guidelines for Additively Manufactured IN-718 Components
R. Shealy, REM Surface Engineering, US
1:30Biosensors & Medical ApplicationsChesapeake 11
Session chair: Sehoon Chang, Aramco Services Company, US
1:30Node-Pore Sensing: How a (Humble) Four-Terminal Measurement Can Measure the Mechanical Properties of Single Cells
L. Sohn, University of California, Berkeley, US
1:55A Diagnostic Device for Detecting Biomarkers of Organ Injury in Saliva
A.E. Saunders, R.K. Baldwin, S.J. Oldenburg, Fortis Life Sciences, US
2:15A Low-Cost Graphene Biosensing Platform for Multi-Analyte Point-of-Care Diagnostics
B. Fenech-Salerno, M. Holicky, C. Yao, F. Torrisi, Imperial College London, UK
2:35Nanosensor Coupling to Human and Plant Interfaces for Real Time Chemical Information Transfer
M. Strano, Massachusetts Institute of Technology, US
3:003D Nano-Printing Sensors for High-Fidelity Sensory Manikin Skin in Medical Simulation Training
X. Liu, T. Ko, J. Cai, A. Gnatt, L. Yeh, A. Hoffman, D. Summers, Nanobiofab, US
3:20Nanostructured Biomimetic ACE2 Memristive Electrochemical Sensors Speed up the Screening of a S1 SARS CoV-2 Inhibitor Candidate ABS02 Compared with the Performance of Remdesivir
E.T. Chen, J.T. Thornton, S-H. Duh, Advanced Biomimetic Sensors, Inc., US
1:30NSF Engineering Research Visioning Alliance (ERVA) - Partnering (Pre-Registration Required)Annapolis 1
Join ERVA and TechConnect for a Workshop and help us ideate engineering research priorities that advance U.S. R&D and solve society's most vexing problems.
1:30Army xTech Startup Summit (Private Meeting)Maryland 6
3:00Legal Perspective: Strategic IP and Funding Considerations for Innovative CompaniesMaryland 1
Innovation requires short-term and long-term vision, not to mention grit and stamina. It also requires strategic forethought to ensure your intellectual property is adequately protected throughout the journey from innovation to commercialization. Join attorneys from legendary Silicon Valley based law firm Fenwick & West as they shed light on IP strategy considerations - trademarks, copyrights, patents and trade secrets - you should have top of mind.  Then, dive into the similarities and differences between private funding and government funding, including parameters of SBIR Phase 1 and beyond.
D. Brownstone, Fenwick, US
P. Grilli, Fenwick, US
Z. Tejani, Fenwick, US
C. Schwartz, Palantir Technologies, US
4:00TechConnect Innovation Showcase Reception, Corporate Scout Speed Dating, Army xTech Showcase, Poster Session I (4:00 - 6:00)Expo Hall AB
4:00TechConnect Business Team Meet & GreetExpo Hall AB
4:00TechConnect Corporate Scout Speed DatingExpo Hall AB
Arkema, US
BryceTech, US
Dundee Precious Metals, US
Henkel, DE
Linde, IE
Rio Tinto, US
TechLink, US
Resonac, US
Raytheon, US
Saint-Gobain, FR
Koch Modular Process, US
Dow, US
ATI - Innovation Funding Pipeline, US
ATI - Navy ManTech, US
ATI - Countering Weapons of Mass Destruction Consortium, US
ATI - Medical & CBRN Defense Consortium, US
4:00Graphene & Carbon Nanostructures - PostersExpo Hall AB
Honeycomb-Structured S and N Dual-Doped Highly Graphitized Carbon as a Catalyst Support for Rh Nanoparticles: High Performance Electrocatalyst for Hydrogen Evolution Reaction
C-H Shin, H-Y Lee, F.K. Tareq, J-S Yu, Deagu Gyeongbuk Institute of Science and Technology, KR
Effect of graphene oxide additives via interfacial templating on the graphitization of carbon-carbon (C-C) composites
S. Ike, S. Ling, R. Vander Wal, Penn State University, US
4:00Additive Manufacturing - PostersExpo Hall AB
Rapid Prototype Tooling For Rapid Composite Manufacturing
H. Watts, Mississippi State University, US
Overview of Additive Manufacturing and 3-D Printing Utilizing Numerous Analytical Techniques
C. Stephan, T. Dillon, PerkinElmer Inc, CA
Layer time optimization in large-scale additive manufacturing via a reduced physics-based model
E. Jo, L. Liu, N. Garg, U. Vaidya, S. Chakraborty, F. Ju, S. Kim, Oak Ridge National Laboratory, US
Microreactor-Assisted Nanomaterial Deposition for Additive Manufacturing
A. Chang, Oregon State University, US
4:00Advanced Materials for Engineering Applications - PostersExpo Hall AB
Corrosion resistant coatings from bio-derived sodium alginate and inorganic components for metallic materials
T. Moskalewicz, M. Warcaba, A. Łukaszczyk, AGH University of Science and Technology, PL
Flexible Personal Thermoregulatory Device Embedded with Silver Nanoparticle
A. Hazarika, B.K. Deka, D.Y. Kim, H.W. Park, Ulsan National Institute of Science and Technology, KR
Superconductors in Space @ Ambient Temperature for Boost-Phase Missile Interception
W.C.W. Lau, LAU Superconductors, US
High thermal capacity silica-based fibers for potential application as insulators
C. Robinson, A. Sahu, S. Banks, R. Nelson, American Nano, LLC, US
Reinforced High Temperature Superconductors for Nuclear Fusion?
W.C.W. Lau, LAU Superconductors, US
PoF – Power over Fiber: A Novel Approach for Energy Transmission in B5G Networks
L.C. Souza, A.C. Sodré Jr., Inatel - Instituto Nacional de Telecomunicações, BR
New Coating Additives: Tiny Soap Particles that Help Repel Water
Y. Li, Iowa State University, US
Contribution of Thermal Radiation to the Temperature Profile of Ceramic Composite Materials via a (2-D) Two Flux Model
K. Orikasa, M. Landazuri and A. Tremante, Florida International University, US
4:00Sensors & Lab-on-a-Chip - PostersExpo Hall AB
Quantum-based sensing of biomolecules using fluorescent nitrogen vacancy-center nanodiamonds
A. Rampersaud, I. Rampersaud, C. Fletcher, M. Slocum, L. Drummy, Columbus Nanoworks, US
A mechano-electrical and potentially biocompatible transduction platform for smart hydrogel-based sensors
B. Ahmed, C.F. Reiche, F. Solzbacher, J. Körner, Leibniz University Hannover, DE
A Novel Approach for Microplastic Detection Based on the Triboelectric Method in a Microfluidic Platform
M. Hoorfar, A. Motalebizadeh, S. Fardindoost, University of Victoria, CA
Viscometry of microliter biofluids
C. Kim, J. Shim, S. An, M. Lee, D. Weitz, W. Jhe, Seoul National University, KR
Fabrication and Performance Studies for Nanopillar Localized Surface Plasmon Resonance Biosensors
R.L. Cromartie, Y. Zhao, K.D. Benkstein, K.L. Steffens, S. Semancik, National Institute of Standards and Technology, US
OpiTracker for Universal Detection of Opioid
G. Zhang, J. Zhou, Zymeron Corporation, US
Developing a Plasmonic Sensor for Liquid-Phase Biomedical Applications
S. Sayin, Y. Zhou, K.D. Benkstein, K.L. Steffens, S. Xin, S. Semancik, M. Zaghloul, The George Washington University, US
Developing Biosensors for High Throughput Drug Screening against Muscular Dystrophy
R. Mahrat, R. Chaturvedi, Calico Biosciences, US
3D Micro-instrumentation for Organoid Intelligence (OI)
C. Acha, D. George, K. Murugesan, A. Pantula, D-M Alam El Din, D. Patel, L. Smirnova, D. Gracias, Johns Hopkins Univerisity, US
Remote, Non-Contact Monitor of Heart Rate, Respiratory Rate, Pulse Oximetry, Pain, Mood, Perfusion, and other parameters
A. Wallace, T. Heintz, A. Badathala, Atapir, US

Tuesday June 20

8:30Joint TechConnect & SBIR/STTR Keynote ProgramMaryland A
Session chair: Jennifer Rocha, TechConnect Division ATI
8:35Fast-tracking National R&D Opportunities
M. Stebbins, ATI, US
8:50Materials & Manufacturing Innovation Priorities
J. Sopcisak, Manufacturing Capability Expansion & Investment Prioritization (MCEIP), Office of the Assistant Secretary of Defense (OASD) for Industrial Base Policy (IBP), US
9:15SBIR/STTR Keynote Panel: Investment, Innovation, & Strategic Capital for Critical Technologies – SBIR/STTR, US
E. Page-Littleford, Office of Investment & Innovation, US
B. DeVries, Office of Investment & Innovation, US
J. Rathje, DoD, US
9:00Medical & WMD Countermeasures Summit - Keynote (CWMD/MCDC Members meeting)Maryland CD
10:302D Materials Based DevicesChesapeake 1
Session chair: Anirudha Sumant, Argonne National Laboratory, US
10:30Two-Dimensional Heterostructures for Logic, Memory and Photonics
D. Jariwala, University of Pennsylvania, US
10:552D Memtransistors for Stochastic Computing and Their Applications
S. Das, The Pennsylvania State University, US
11:20Straintronic Graphene Transistor with Colossal On/Off Current Ratio
D. Sen, Y. Zheng, S. Das, S. Ghosh, S. Das, The Pennsylvania State University, US
11:40A Peripheral-free True Random Number Generator Based on Integrated Circuits Enabled by Atomically Thin Two-dimensional Materials
H. Ravichandran, Pennsylvania State University, US
10:30Additive Manufacturing: MachinesChesapeake 2
Session chair: John Barnes, The Barnes Global Advisors, US & Slade Gardner, Big Metal Additive, US
10:30Massively-Accessible Approach to Metal 3D Printing
K. Hsu, Arizona State University, US
10:55Additive Manufacturing of Bone Graft Ceramics
A. Steinmark, Materic, US
11:15The development of Rheo-Printing technology on interlayer adhesion strength for Big Area Additive Manufacturing
F.J. Alzahrani, H. Noor, J.P. Coulter, Lehigh University, US
10:30Quantum Information Sciences & TechnologiesChesapeake B
Session chair: Piotr Kulczakowicz, Quantum Startup Foundry, US
10:30Supply Chain Optimization using quantum computers and hybrid technology
A. Khan, ZebraKet, Ltd., US
10:55Today's Quantum Network Challenges
C. McClelland, Qubitekk, US
11:20Quantum Enabled Sensing and Control
G. Teklemariam, gSpin Technologies, US
11:45Controlled Encapsulation of Nanodiamond Qubits by Metal-Organic Frameworks: Towards Enhanced Quantum Sensing
S. Crawford, R. Shugayev, G. Lander, H. Paudel, Y. Duan, J. Baltrus, N. Diemler, J. Ellis, K. Kim, P. Cvetic, National Energy Technology Laboratory/Leidos, Inc., US
12:05Opportunities for Quantum Computing and Simulations for Applications to Energy-Relevant Materials
H.P. Paudel, B. Avramidis, D. Alfonso, K.D. Jordan, Y. Duan, National Energy Technology Laboratory, US
10:30Nano4Earth - National Nanotechnology Coordination OfficeChesapeake C
10:30Overview remarks
Q. Spadola, National Nanotechnology Coordination Office, US
10:40Reducing waste in the production of nanoelectronics
J. Draa, Grolltex, Inc., US
10:50Carbon Nanotubes to Enable 1000x Reduction in Data Center Computing
J. Provine, Aligned Carbon, US
11:00Synthesis of Carbon Nanotubes and Fabrication of Multilayer Nanocomposites
V.M. Boddu, Office of Research and Development (ORD), US Environmental Protection Agency (USEPA), US
11:10Protein-based nanoparticles as bioengineered platforms for pesticide delivery
I. González-Gamboa and N. Steinmetz, University of California San Diego, US
Panelist
P. Antunez, Brookhaven National Laboratory, US
Panelist
C. Allen-Chu, Clark Street Associates, US
Panelist
H. Henry, National Institutes of Health, US
Panelist
M. Kiley, National Nanotechnology Coordination Office, US
Panelist
B. Brough, National Nanotechnology Coordination Office, US
10:30Navy MANTECH Advanced Manufacturing ChallengeNational Harbor 5
Session chair: Jonathan Jakischa & Laura Murphree, TechConnect - ATI, US
10:30Navy MANTECH Centers - Overview
M. Snider, ATI - Navy ManTech, US
10:45Additive Manufacturing with Dynamic Laser Beam Shaping based on Coherent Beam Combining
L. Lev, Civan Lasers USA, US
10:52Intrepid Expeditionary 3D Printer
E. Shnell, Craitor, Inc., US
10:59Hybrid Additive System For Ceramic Matrix Composites
D. Crenshaw, DC Precision Ceramics LLC, US
11:06A single step seamless digital solution for autonomous hybrid remanufacturing and repair: from 3D scanning to path planning.
R. Samson, Elementiam Materials & Manufacturing Inc., CA
11:13Onshoring of Custom Chip Carriers for DOD Applications
B. English, EngeniusMicro, US
11:20Multi-axis 3D printing
H. Noori, Oklahoma State University, US
11:27Robotic Additive Manufacturing with Continuous Carbon Fiber for Large and Novel Structures
A. Badesha, Orbital Composites, Inc., US
11:34Convolution HiDeNN-AI for Integrating Multiscale Topological Optimization with Additive Manufacturing
D. Qian, HIDENN-AI, LLC, US
11:413D Sand Printer for Metalcasting Agility, Lightweighting & Advanced Defense Materials
D. Shirkey, LightSpeed Concepts Inc., US
Review Panelist
A. Cauley, Huntington Ingalls Industries, US
Review Panelist
J. Chaidez, Lockheed Martin Aeronautics Company, US
Review Panelist
G. Buczkowski, General Dynamics Bath Iron Works, US
Review Panelist
J. Iraci, General Dynamics Electric Boat, US
Review Panelist
TBA, Lockheed Martin Hypersonics Engineering & Accelerated Technologies, US
Review Panelist
K. Thorn, NAVAIR, US
Review Panelist
J. McRoberts, Manufacturing Science & Technology Program - OSD Manufacturing Technology, US
Review Panelist
S. Ng, NAVAIR, US
10:30TechConnect Innovation Pitches: Electronics, Sensors, CommunicationsMaryland 2
Session chair: Brent Segal, Lockheed Martin, US
10:30Lockheed Martin Innovation Spotlight
C. Owens, Lockheed Martin, US
10:45elementalGEO(TM)
E. Enig, Enig Associates, Inc., US
10:52A Secure Wireless IoT Chipset for Smart Building and Smart City Applications
J. Terry, Espre Technologies, Inc., US
10:59Smallest Infrared Hyperspectral Camera
M. Hinnrichs, Pacific Advanced Technology, US
11:06Spectrally Efficient Peer-to-Peer (SEPP) Wireless Technology
A. Salindong, Trabus Technologies, US
11:13MEMCPU Platform
J. Aiken, MemComputing, Inc., US
Review Panelist
C. Owens, Lockheed Martin, US
Review Panelist
C. Nieto, IEEE Entrepreneurship, US
Review Panelist
N. Edmonsond, Northrop Grumman, US
Review Panelist
B. Segal, Lockheed Martin, US
Review Panelist
TBA, TechLink, US
10:30Army xTech Startup Summit (Private Meeting)Maryland 6
11:00Medical & WMD Countermeasures Summit - (CWMD/MCDC Members meeting)Maryland CD
1:00Navy MANTECH Advanced Manufacturing ChallengeNational Harbor 5
Session chair: Jonathan Jakischa & Laura Murphree, TechConnect Division, ATI, US
1:00Non-composite, polymer-free densified carbon nanotube (DCN) sheet as extreme cold weather resistant gasket material
C. Li, 4TH Phase Technologies, Inc., US
1:07A new class of smart responsive materials developed for self-healing anti-corrosion coatings in extreme environments.
D. Gilmour, A2O Advanced Materials Inc., CA
1:14Effective and Non-toxic Underwater and Marine Adhesive
L. Takiff, Akita Innovations LLC, US
1:214D Printing of Novel Materials
Y. Mirchandani, Beacon Industries Inc., US
1:28Naval Alloys With Reduced Sensitization
D. Weiss, Ce-Ri-SS Materials LLC, US
1:35Additively Manufactured Continuous Fiber C/C and Ceramic Matrix Composite (C/SiC, SiC/SiC) Preforms for Hypersonic Applications
P. McHail, Continuous Composites, US
1:42Additive Hypersonic Fabrication
Y. Mirchandani, Beacon Industries Inc., US
1:49Uncooled Shortwave Imagers for Hypersonic Targeting
M. Ettenberg, Princeton Infrared Technologies, Inc., US
Review Panelist
A. Cauley, Huntington Ingalls Industries, US
Review Panelist
J. Chaidez, Lockheed Martin Aeronautics Company, US
Review Panelist
G. Buczkowski, General Dynamics Bath Iron Works, US
Review Panelist
J. Iraci, General Dynamics Electric Boat, US
Review Panelist
TBA, Lockheed Martin Hypersonics Engineering & Accelerated Technologies, US
Review Panelist
K. Thorn, NAVAIR, US
Review Panelist
L. Moreno, NAVSEA, US
Review Panelist
J. McRoberts, Manufacturing Science & Technology Program - OSD Manufacturing Technology, US
Review Panelist
S. Ng, NAVAIR, US
2:30Navy MANTECH Advanced Manufacturing ChallengeNational Harbor 5
Session chair: Jonathan Jakischa & Laura Murphree, TechConnect Division, ATI, US
2:30A fast-learning and low-cost humanoid robot that acts as workforce multiplier
S. Srivastav, Aivot Robotics, Inc, US
2:37Blockchain and AI/ML Enabled 6G network for Swarm of UAVs
S. Mirchandani, Bryka Skystocks LLC, US
2:44A Defect Measurement Tool to Improve Aircraft Sustainment and Decrease Downtime
J. Rozzi, Creare LLC, US
2:51Physical Identifiers for 21st Century Fleet Fabrication and Sustainment
M. Kozicki, Densec ID, US
2:58FLX BOT for Manufacturing Maintenance
M. Bilsky, FLX Solutions, US
3:05High-Quality Composite Repair with a Single Vacuum Bag
D. Metrey, Luna Labs USA, LLC, US
3:12Machine Learning Enabled Nondestructive Monitoring Device for Surface Adhesives and Coatings
J. Yoon, Optowares, Inc., US
3:19Real-time and passive acoustic structural monitoring of ships and components
E. Cretu, The University of British Columbia, Dept. of Electrical and Computer Eng., CA
Review Panelist
A. Cauley, Huntington Ingalls Industries, US
Review Panelist
J. Chaidez, Lockheed Martin Aeronautics Company, US
Review Panelist
G. Buczkowski, General Dynamics Bath Iron Works, US
Review Panelist
J. Iraci, General Dynamics Electric Boat, US
Review Panelist
TBA, Lockheed Martin Hypersonics Engineering & Accelerated Technologies, US
Review Panelist
K. Thorn, NAVAIR, US
Review Panelist
L. Moreno, NAVSEA, US
Review Panelist
J. McRoberts, Manufacturing Science & Technology Program - OSD Manufacturing Technology, US
Review Panelist
S. Ng, NAVAIR, US
1:30CHIPS: Advanced Metrology to Ensure Success for Next Generation SemiconductorsNational Harbor 6
Session chair: Alex Norman, Princeton University, US
1:30In-Line Metrology Requirements and Needs for Leading Edge Technology
D. Schmidt, IBM Research, US
1:55Solutions for Gate-all-around (GAA) Device Development and Manufacturing
X. Gu, P. Hsu, Y.H. Kim, A. Mani, P. Kirby, Thermo Fisher Scientific, US
2:20CHIPS Act Semiconductor Metrology Needs for R&D
D. Henshall, V. Zhirnov, T. Younkin, Semiconductor Research Corporation (SRC), US
2:45Break
2:55Surface and subsurface quantitative mechanical property measurements by contact resonance atomic force microscopy on low-k dielectric structures
G. Stan, C.V. Ciobanu, S.W. King, National Institute of Standards and Technology, US
3:15Analysis of buried interfaces for device technology by soft and hard X-ray photoemission
K. Artyushkova, J. Mann, S. Zaccarine, Physical Electronics, US
3:35Evaluating the Impact of Defects, Interfaces and Boundaries on Thermal Transport in 2D Materials Using a Novel Opto-Thermal Metrology Technique with Sub-Micron Resolution
B.M. Foley, A.H. Jones, J.T. Gaskins, P.E. Hopkins, Laser Thermal Inc, US
3:55Silicon Dopant Quantification in Atom Probe Tomography
K. DeRocher, M. McLean, F. Meisenkothen, National Institute of Standards and Technology, US
1:30Graphene and 2D Materials for Energy Related ApplicationsChesapeake 1
Session chair: Elena Polyakova, Graphene Laboratories, US & Anirudha Sumant, Argonne National Laboratory, US
1:30Disrupting Lubrication Industry: Achieving Superlubricity on Rough Steel Surfaces without Oil Under Sustained Sliding-Rolling Contact
A. Sumant, Argonne National Laboratory, US
1:55From Concepts to Real-World Solutions: The Evolving Landscape of Graphene Oxide Advancements
E. Polyakova, Graphene Laboratories, Inc., US
2:15Scalable, Conformal Graphene-based encapsulation for Li-ion cathode materials
D. Despinoy, J. Pistorino, Volexion, US
2:35Fast Identification of Monolayer MoS2 on Various Substrates Using Deep Neural Network
Y. Zhou, Y. Zheng, S. Wang, S. Sayin, Z. Li, M. Zaghloul, George Washington University, US
1:30Advanced Manufacturing InnovationChesapeake 2
Session chair: Chris Menzel, Fujifilm Dimatix, Inc., US
1:30A LifeCycle Use case comparison of 3D/Additive vs Traditional Manufactured part
S. Monroe, AMGTA, US
1:55Digital Material Deposition using Inkjet - Inkjet for Industrial 3D Applications
R. Baker, Integrity Integration, US
2:20Unlocking the Potential of High-Performance, Multi-Material Printing with NovoJet
R. Borrell, Quantica Gmbh, US
2:45Metal Additive Manufacturing for Production
A.C. Barbati, Desktop Metal
3:10Break
3:20Stable uniform nanoparticle dispersion in composite materials for antibacterial food packaging
S. Lee, C&G Hitech Co., Ltd., KR
3:40Cyber-Physical Trust Anchors for a Secure Supply Chain
M. Maasberg, I. Taylor, L.G. Butler, United States Naval Academy, US
4:00A sure shot: Fine-tuning focused ion beam placement with critical-dimension localization microscopy
A.C. Madison, C.R. Copeland, R.G. Dixson, B.R. Ilic, J.A. Liddle, S.M. Stavis, National Institute of Standards and Technology, US
4:20How A Modular Delivery Model Drives Developing Technology Project Viability
M. Villegas, Koch Modular Process Systems, US
1:30Micro & Bio Fluidics, Lab-on-a-ChipChesapeake B
Session chair: Kwang W. Oh, University at Buffalo (SUNY), US
1:30Membrane displacement traps for deterministic droplet and cell manipulation
M. Yeh, J. Harriot, D.L. DeVoe, University of Maryland, US
1:55Sensitive POC (point-of-care) system to detect virus from the environmental and fecal samples using graphene oxide
J. Min, Chung-Ang University, KR
2:20Automated Acoustic Levitation Sample Delivery for Multiple Synchrotron and XFEL Beam Lines
P.T. Docker, D. Axford, V. Baker, F. Gueniat, A. Barnes, J. Drewitt, D. Crivelli, Diamond light Source, UK
2:40Soft, tissue-integrated microfluidics for self-powered, wireless biosensors and biofluid-activated batteries
A.J. Bandodkar, North Carolina State University, US
1:30TechConnect Innovation Pitches: Electronics, Sensors & CommunicationsMaryland 2
Session chair: Bart Romanowicz, TechConnect Division, ATI, US
1:30TechLink Innovation Spotlight
D. Scott, TechLink, US
1:45Embedded Concrete Resistivity Sensor System
N. Kargah-Ostadi, Callentis Consulting Group, LLC, US
1:52Aligned Carbon Nanotube RF Devices for Next-Gen Wireless Communication
K. Jinkins, SixLine Semiconductor, US
1:59High-Speed High-Throughput Imaging with Radio Waves
T. Cargol, Spectrohm, Inc,, US
2:06Compact Underwater Lidar System
E. Larson, Tampa Deep Sea Xplorers, Inc., US
2:13Wireless Battery Personalized Wearable Electronics
P. Gutruf, T. Stuart, University of Arizona, US
2:20Nanocircuits at optical frequencies
T. Bray, University of Pennsylvania-Penn Center for Innovation, US
Review Panelist
B. Romanowicz, TechConnect Division, ATI, US
Review Panelist
J. Wong, IEEE, US
Review Panelist
P. Parthiban, Just Venture Labs, US
Review Panelist
D. Ojika, Flapmax, US
Review Panelist
D. Scott, TechLink, US
1:00Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 2 NIR Laser Technologies for Scientific ResearchMaryland 5
Session chair: Eric Colby, U.S. Department of Energy, US
1:00A Novel Coherent Combining Approach Towards High Peak and High Average Power Ultrafast Lasers Phase III
A. Galvanauskas, University of Michigan, US
1:20Scaling high energy utrafast Yb-based lasers for compact accelerators and applications
J. Rocca, Colorado State University, US
1:40Energy and Power Scaling of Nonlinearly Compressed Ultrashort Laser Pulses using Coherent Pulse Combining
T. Zhou, Lawrence Berkeley National Laboratory, US
2:00Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 3 MIR and LWIR Laser Technologies for Scientific ResearchMaryland 5
Session chair: Eric Colby, U.S. Department of Energy, US
2:00Optical Materials for Ultrahigh-Power Long-Wave Infrared Lasers
M. Polyanskiy, Brookhaven National Laboratory, US
2:20Novel, Middle and Long Wave Infrared Laser Sources For Accelerator Applications
S. Mirov, University of Alabama, Birmingham, US
3:00Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 4 High Power Industrial Accelerator Technologies - RF SourcesMaryland 5
Session chair: Eric Colby, U.S. Department of Energy, US
3:00Electrostatic potential depression and its applications
H. Xu, Los Alamos National Laboratory, US
3:20Progress of the Design and Testing of an L-Band, High Efficiency, 100 kW average power RF Amplifier for Accelerator Applications
M. Othman, SLAC National Accelerator Laboratory, US
3:40Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 5 High Power Industrial Accelerator Technologies - LinacsMaryland 5
Session chair: Eric Colby, U.S. Department of Energy, US
3:40Progress on the Development of A High Efficiency 1 MW, 1 MeV Linac for Industrial Applications
M. Shumail, SLAC National Accelerator Laboratory, US
4:00Design and Prototyping for a Compact 10 MeV SRF Accelerator for Irradiation Purposes – Year 2
G. Ciovati, Thomas Jefferson National Accelerator Facility, US
4:40Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Working with the DOE National Laboratories' Accelerator R&D Capabilities - information session open to allMaryland 5
Session chair: Eric Colby, U.S. Department of Energy, US
4:40DOE ARDAP Program Managers
1:00CBRN Defense Modernization Challenge - Protection (MCDC & CWMD Sponsored)Maryland CD
Session chair: Katie Bornfleth & Nick Kacsandi, TechConnect Division, ATI, US
1:00Challenge Overview - MCDC & CWMD
M. Stebbins, ATI - CWMD & MCDC, US
1:10Advancing CBRN Protection with MOFs
P. Fuller, NuMat Technologies, US
1:17Electrospin/spray for production of high mitigant-loaded fabrics
R. Pawle, Akita Innovations, LLC, US
1:24Surface Ionization Noncontact Extended-Wear (SINEW) Mask
A. Mamishev, University of Washington, US
1:31A Negative Pressure Protective Barrier Enclosure: The STAT Enclosure
S. Venticinque, Olifant Medical, US
1:38Point of Use CBRN Filter
M. Knapke, Guild Associates Inc, US
1:45Self-Detoxifying Garment
R. Harding, Guild Associates Inc, US
Review Panelist
R.K. Batchelor, CWMD Program Manager JPEO, US
Review Panelist
L. Hess, MCDC Program Manager JPEO, US
Review Panelist
M. Stebbins, ATI - CWMD & MCDC, US
Review Panelist
J. Osborn, ATI - CWMD & MCDC, US
Review Panelist
J. David, Brycetech, US
Review Panelist
J.Yang, DMVBio, US
Review Panelist
C. Clyburn, Med4Site, US
2:00CBRN Defense Modernization Challenge - Medical (MCDC & CWMD Sponsored)Maryland CD
Session chair: Katie Bornfleth & Nick Kacsandi , TechConnect Division, ATI, US
2:00The Protein ProFiler™: A Microfluidic Solution to the Biomarker Complexity
J. Wiktorowicz, InnovaRegi, LLC, US
2:07Software to model immune biological responses across multiple biological scales
T. Helikar, University of Nebraska - Lincoln, US
2:14Next-generation protein sequencing for pathogen agnostic and massively parallel infectious disease diagnostics
J. Yang, Glyphic Bio, US
2:21An Orally Delivered Transuranic Element Nuclear Chelator Therapeutic
A. Sosica, Captura Biopharma, Inc, US
2:28Sensible PCR Platform
E. Templin, Sensible Diagnostics, Inc., US
2:35Rapid, low-cost, scalable biothreat response platform
B. Finrow, Lumen Bioscience, Inc., US
2:42Recognize- A first-in-class diagnostic platform
R. Khosravi-Far, InnoTech Precision Medicine, Inc, US
Review Panelist
R.K. Batchelor, CWMD Program Manager JPEO, US
Review Panelist
L. Hess, MCDC Program Manager JPEO, US
Review Panelist
M. Stebbins, ATI - CWMD & MCDC, US
Review Panelist
J. Osborn, ATI - CWMD & MCDC, US
Review Panelist
J. David, Brycetech, US
Review Panelist
J. Yang, DMVBio, US
Review Panelist
C. Clyburn, Med4Site, US
3:00CBRN Defense Modernization Challenge - Medical (MCDC & CWMD Sponsored)Maryland CD
Session chair: Katie Bornfleth & Nick Kacsandi, TechConnect Division, ATI, US
3:07Engineered protein for tissue protection
J. Way, General Biologics, Inc., US
3:14KWYN™ EFECTIVE
B. Bauchwitz, Charles River Analytics, US
3:21Vaccine Microarray Patch / VaxiPatch
A. Van Prooyen, Verndari, Inc., US
3:28Antibody Platform for Detection and Treatment of Bioterrorism Attacks
M. Martino, Northstar Emergency Management, LLC, US
3:35A New Drug for Traumatic Brain Injury
N. Simon, Azevan Pharmaceuticals, Inc, US
3:42ARN-75039: A small molecule broad-spectrum hemorrhagic arenavirus therapeutic
K. McCormack, Arisan Therapeutics, US
Review Panelist
R.K. Batchelor, CWMD Program Manager JPEO, US
Review Panelist
L. Hess, MCDC Program Manager JPEO, US
Review Panelist
M. Stebbins, ATI - CWMD & MCDC, US
Review Panelist
J. Osborn, ATI - CWMD & MCDC, US
Review Panelist
J. David, Brycetech, US
Review Panelist
J. Yang, DMVBio, US
Review Panelist
C. Clyburn, Med4Site, US
4:00CBRN Defense Modernization Challenge - Sensors (MCDC & CWMD Sponsored)Maryland CD
Session chair: Katie Bornfleth & Nick Kacsandi, TechConnect Division, ATI, US
4:00Sensor-integrated proteome on-chip (SPOC™): a multiplexed pan-pathogen detection platform
B. Takulapalli, INanoBio, Inc., US
4:07Universal Protocol Adapter (UPA)
C. Oneil, Domenix, US
4:14Machine Learning for Multi-modal CBRN Threat Classification and Localization
F. Kitchell, KEF Robotics Inc, US
4:21A Wearable Diamond Sensor of Ionizing Radiation
S. Kuzikov, Euclid Techlabs, LLC, US
4:28A Field Rugged and Mobile Aerosol Particulate Analytical Laboratory with Aerial Drone Sampling Capability
D. Dikken, Measurement Technology Laboratories, US
4:35MIDNIGHT: Monitoring and Inspecting Dirty Nukes Including Generating Heat Maps of Terrain
D. Stouch, Charles River Analytics, Inc., US
Review Panelist
R.K. Batchelor, CWMD Program Manager JPEO, US
Review Panelist
L. Hess, MCDC Program Manager JPEO, US
Review Panelist
M. Stebbins, ATI - CWMD & MCDC, US
Review Panelist
J. Osborn, ATI - CWMD & MCDC, US
Review Panelist
J. David, Brycetech, US
Review Panelist
J. Yang, DMVBio, US
Review Panelist
C. Clyburn, Med4Site, US
4:00TechConnect Innovation Showcase Reception, SBIR/STTR Program Office Meetup, Army xTech Showcase, Poster Session II (4:00 - 6:00)Expo Hall AB
4:00TechConnect Business Team Meet & GreetExpo Hall AB
4:00EPA P3 National Student Design Competition ShowcaseExpo Hall AB
4:00SBIR/STTR PavilionExpo Hall AB
U.S. Department of Defense, US
U.S. Navy, US
U.S. Air Force, US
U.S. Army, US
HHS/NIH, US
U.S. Department of Energy, US
USSOCOM, US
DARPA, US
NSF, US
DHS, US
DHA, US
NASA, US
USDA, US
CDC, US
NOAA, US
MDA, US
EPA, US
US DOT, US
US Department of Education, US
US SBA, US
4:00Materials Characterization - PostersExpo Hall AB
A Powerful New Tool for Rapid Chemical Characterization of Advanced Manufacturing Materials
E. Williams, J. Putman, P. Willis, Exum Instruments, US
Versatile thin film adhesion and scratch testing machine for different material surfaces under various environmental condition
W. Demisse, P. Tyagi, University of the District of Columbia, US
A Decade Team Work in Pursuing Discoveries in Nanostructure Membrane Characterizations and Observations of Friedel-oscillation by AFM for Quantum Sensing and Energy Storage Applications
J. Thornton, E.T. Chen, Advanced Biomimetic Sensors, Inc., US
Democratizing the Assessment of Thermal Robustness of Metal-Organic Frameworks
S. Bonakala, A. Abutaha, E. Palani, A. Samara, S. Mansour, F. El-Mellouhi, Hamad Bin Khalifa University, QA
Chemical identification & characterization of sub-20nm residues and defects with Nano IR PiFM
P. O'Hara, Molecular Vista, Inc., US
High Resolution Measurement of Potential-Dependent Electrochemical Activities on HOPG Using Scanning Electrochemical Cell Microscopy (SECCM)
M-H. Choi, S-J. Cho, L.A. Baker, S. Kaemmer, Park Systems inc., US
Princeton Collaborative Research Facility: diagnostics and modeling for plasma material synthesis and processing applications
Y. Raitses, I. Kaganovich, M. Shneider, A. Dogariu, S. Yatom, S. Gershman, I. Romadanov, N. Chopra, W. Villafana, Y. Ussenov, S. Abe, Princeton Plasma Physics Laboratory, US
Wyonics: Advancing Sustainable Innovations in Wyoming
D. Rone, J. O'Hayre, R.D. Rogers, G. Gurau, C.M. Hill, K.R. Di Bona, Wyonics, US
Broadband Plasmonic SEIRA Structures for Signal Enhancement in nanoIR Spectroscopy
G. Rutins, L. Tetard, University of Central Florida, US
4:00AI for Materials - PostersExpo Hall AB
Metal Hydride Composition-Derived Parameters as Machine Learning Features for Alloy Design and H2 Storage
S. Nations, T. Nandi, A. Ramazani, S. Wang, Y. Duan, National Energy Technology Laboratory, US
Single-Electron Reservoir Computing Circuit with Online Learning
S. Watanabe, T. Oya, Yokohama National University, JP
AI-driven Part Printability Recommendation System for Additive Manufacturing
J.A. Steets, D. Mooney, B. O’Briant, Illumination Works, LLC., US
Relatable Explanations For AI Applications
J. Tan, National University of Singapore, SG
Faux-Data Injection Optimization for Accelerating Data-Driven Discovery of Materials
A. Ziaullah, S. Chawla, F. El Mellouhi, Hamad Bin Khalifa University, QA
Accelerating Materials discovery: Best practices for Research Data Management Strategies
J. Medina, A. Wahab Ziaullah, E-T. Bentria, H. Park, I.E. Castelli, A. Shaon, H. Bensmail, F. El-Mellouhi, Hamad Bin Khalifa University, QA
Physics-informed machine learning prediction of Curie temperature of rare-earth magnetic materials
P. Singh, T. Del Rose, A. Palasyuk, Y. Mudryk, Ames National Laboratory, US
AI-Based Linearization Schemes for 5G/6G Fiber/Wireless Systems
L.A. Melo Pereira, L..L. Mendes, C.J. Albanez Bastos Filho, A. Cerqueira Sodré Junior, National Institute of Telecommunications (Inatel), BR
Design and Implementation of a Modified Shortest Path Algorithm for Package Delivery
B. Abegaz, Loyola University Chicago, US
Developing a Multi-Sensing Platform for a Six Degrees of Freedom Industrial Robot
B. Abegaz, Loyola University Chicago, US
4:00Printed & Flexible Electronics - PostersExpo Hall AB
Additive Manufacturing of Colloidal Nanocrystal Inks for In-Space Manufacturing of Advanced Sensors and Energy Harvesters
F. Rajabi Kouchi, N. McKibben, A. Briggs, J. Manzi, M. Busuladzic-Begic, I. Estrada, J. Eixenberger, T. Varghese, H. Subbaraman, D. Estrada, Boise State University, US
Functional Inks for Additive Manufacturing of Electronics
T. Kirscht, M. Marander, F. Liu, S. Jiang, Iowa State University, US

Wednesday June 21

8:30RegistrationConvention Center Pre-Function
9:00CHIPS: Advances in Packaging for New Chips InnovationNational Harbor 6
Session chair: Joe Kline, National Institute of Standards and Technology, US
9:00Novel, Robust Anisotropic Conductive Epoxy Technology for Advanced Semiconductor Packaging Applications
M. Ramkumar, SunRay Scientific Inc., US
9:20What’s Missing in Your Cure Kinetics Model for Advanced Epoxy Molding Compounds?
R. Tao, S.P. Phansalkar, C. Kim, A.M. Forster, B. Han, National Institute of Standards and Technology, US
9:40Enabling a circular economy of semiconductor process gases through Metal-Organic Frameworks (MOFs)
M.H. Weston, NuMat Technologies, US
10:00X-ray Metrology for Semiconductor Nanostructures
J. Kline, National Institute of Standards and Technology,, US
9:00Advanced Materials for Engineering ApplicationsChesapeake 2
Session chair: Cy Wilson, NASA Langley Research Center, US & Jim Johnston, Victoria University of Wellington, NZ
9:00The Spring's the Thing: How Kirigami Techniques and Biomimetic Adhesives can Remake Materials
D. Sameoto, University of Alberta, CA
9:25Micromachined Aerodynamics Measurement Technologies
R. White, Tufts University, US
9:50Geothermal Energy and Nanostructured Calcium Silicate – Climate Change Mitigation and Clean Water Protection
J.H. Johnston, Victoria University of Wellington and CaSil Technologies Ltd, NZ
10:10Tunable properties and microstructure net-shape aluminum matrix composites parts fabricated via 3D printing.
M. Seleznev, J. Roy-Mayhew, J. Faust, Markforged Inc., US
10:30Break
10:40Nano and Single-Atom Catalysts Manufacturing Assisted by Inexpensive Custom Designed Low-Temperature Plasma
M.M. Feng, Polykala Technologies LLC, US
11:00Novel Low Energy, High Speed Ambient Catalysis of Polymerization through Solid Objects
A. Malofsky, Srinagesh Potluri, Nano Catalytics, Inc., US
11:20Thermally Conductive Composite with High Mechanical Strength
S-K Koh, C&G Hitech Co., Ltd., KR
11:40Piezoelectric Nanofiber Yarns for Wearable Energy Harvesting Textiles
M. Pallotta, Materic LLC, US
9:00Printed & Flexible ElectronicsChesapeake B
Session chair: Yiliang Wu, CollTech North America, US
9:00Data-Driven Manufacturing of Hierarchical Functional Materials for Energy and Sensing Applications
H.T.H. Shi, Western University, CA
9:25How to Make Flexible Printed Circuits More Reliable
A. Yu, CollTech, US
9:50Process planning and development of a multi-axis, multi-material, multi-tool Electronic Packaging (3M3D) technique using Additive Manufacturing
S. Karam, S. Bilén, G. Manogharan, Penn State University, US
10:10Direct-Write Mask Free Fabrication of Quality 1D-2D Hybrid Nanomaterials on Supported or Suspended Platforms using Custom Inks and Chemical Vapor Deposition Synthesis.
I. Kuljanishvili, Saint Louis University, US
9:00TechConnect Innovation Pitches: Biotech & MedicalMaryland 1
Session chair: E. Mooney, TechConnect Division, ATI, US
9:00A dissolving, sharps-free microneedle intradermal injection platform for site specific nonopioid pain relief
B. Lanier, Isosceles Pharmaceuticals, Inc., US
9:07Linear Displacement Adhesion Assay (LiDiAA)
L. Kudo, NeuroInDx, Inc., US
9:14Human Brain Model of Opioid Addiction and Novel Therapeutics
R. Anand, Neurxstem Inc, US
9:21A Software Tool for Microbubble Enhanced HIFU for Non-invasive Tumor Ablations
J. Ma, Dynaflow, Inc., US
9:28Eye-in-Ear device
S. Wevster, EndoTheia, Inc., US
9:35OpiTracker for Universal Detection of Opioid
J. Zhou, Zymeron Corporation, US
Review Panelist
E. Diehl, U.S. Army Medical Research and Development Command, US
Review Panelist
J. Bindra, University of Ottawa , CA
Review Panelist
A. Emondi, PionTier, LLC., US
Review Panelist
C. Clyburn, MedForeSight, US
Review Panelist
J. David, BryceTech, US
9:00TechConnect Innovation Pitches: Manufacturing, Instrumentation IIMaryland 2
Session chair: Chris Menzel, Fujifilm Dimatix, US
9:00Robotic Construction using AI, CV, and needing only 2D plans
B. Wadas, BotBuilt, Inc, US
9:07Passive contacless MicroWire sensor (based on bistable magnetic microwires)
V. Marhefka, RVmagnetics, a.s., SK
9:14Interactive Control System for Robot Manipulation with AR Technology
Y. Li, Hong Kong Industrial Artificial Intelligence and Robotics Centre (FLAIR), HK
9:21NovoJet Printhead Technology
J. Kuhrt, Quantica GmbH, DE
9:28Wireless Approach for Vibration Estimation of Structures (WAVES)
A. Trias Blanco, Rowan University, US
9:35Copper and tin 3D-printing ink for electronics
D. Mayer, TechLink, US
9:42High-gain high-power Planar Antenna array
S. Mirchandani, Bryka Skystocks, LLC, IN
Review Panelist
C. Menzel, Fujifilm Dimatix, US
Review Panelist
M. Snider, ATI - Navy ManTech, US
Review Panelist
D. Ojika, Flapmax, US
10:30TechConnect Innovation Pitches: Medical Devices & MaterialsMaryland 1
Session chair: E. Mooney, TechConnect Division, ATI, US
10:30The Cog-Sobriety™ a Work Accident Reduction Tool: On-demand Cognitive Sobriety Test in 30 Seconds - Detect impairments regardless of underlying CAUSE
M. Zarreii, Axon Medical Technologies, US
10:37A safe, rapid, and effective way to cure gum disease
A. Lyons, SingletO2 Therapeutics LLC, US
10:44Next generation diagnostic and therapeutic bone fracture healing
J. Winder, Sonogen Medical, Inc., US
10:51Capillary-Embedded Rapid Adaptable Multiscale (CERAM) Bioprinting for Engineering Large Vascularized Tissues
G. Tan, Texas Tech University Office of Research Commercialization, US
10:58Enclosed Hollow Needle Blister-Packs for Drug Delivery
W. Jones, Texas Tech University Office of Research Commercialization, US
11:05Biomimicking Photocrosslinkable Nanocomposite Bone Grafts
X. Zhao, The Hong Kong Polytechnic University, HK
11:12A lean, affordable robotic technology that provides a unique functionality and option to current robotic furniture / assisted access products
W. Crolley, Novare Products LLC, HK
Review Panelist
E. Diehl, U.S. Army Medical Research and Development Command, US
Review Panelist
C. Clyburn, MedForeSight, US
Review Panelist
C. Paul, Henkel, DE
Review Panelist
A. Emondi, PionTier, LLC., US
Review Panelist
J. David, BryceTech, US
9:00Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 1 - Industrial Partnerships in Accelerator TechnologyMaryland 5
Session chair: C. Ginsburg, U.S. Department of Energy, US
9:00Introduction & Welcome
C. Ginsburg, U.S. Department of Energy, US
9:20Development of the U.S. Vendor base for high power RF klystrons
S. Lenci, Communications & Power Industries, Inc., US
9:40Towards industrial manufacturing of alkali antimonide photocathodes by automated thin film growth
V. Pavlenko, Los Alamos National Laboratory, US
10:00Manufacturing full-scale high gradient copper accelerators: Electron beam welding and allied processes
P. Carriere, RadiaBeam Technologies, LLC, US
10:30Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 2 - Accelerator Physics and SimulationMaryland 5
Session chair: C. Ginsburg, U.S. Department of Energy, US
10:30Computational methods for nanotip array electron sources
B. Erdelyi, Northern Illinois University, US
10:50Nonlinear Dynamics Studies in Ring Accelerator with Square Matrix Method and Rigid Rotation Diffeomorphism
Y. Hao, Michigan State University, US
11:10Numerical Optimization for Spin Dynamics in Electron (Positron) Storage Rings
G. Hoffstaetter, Cornell University, US
11:30Modeling high energy density conditions for electron beams at 4th generation light sources
N. Cook, RadiaSoft, LLC, US
7:30Medical & WMD Countermeasures Summit - (CWMD/MCDC Members meeting)Maryland CD
12:40Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 3 Superconducting Accelerator R&DMaryland 5
Session chair: C. Ginsburg, U.S. Department of Energy, US
12:40Businesses Models for Advanced Superconductors and Superconducting Magnet Technology
L. Cooley, Applied Superconductivity Center, Florida State University, US
1:00Design, prototype and testing of a SRF cavity for a low-cost, compact accelerator for environmental applications
G. Ciovati, Thomas Jefferson National Accelerator Facility, US
1:20Optimization of superconducting radio frequency properties of sputtered Nb3Sn films for accelerator applications
G. Eremeev, Fermi National Accelerator Laboratory, US
1:40A metallurgical approach to improving Nb SRF Cavity Performance
P. Lee, Florida State University, US
2:20Department of Energy’s (DOE) Office of Science Accelerator Research and Development and Production (ARDAP), Annual Principal (PI) Meeting: Session 4 New Particle Sources and Accelerator ConceptsMaryland 5
Session chair: C. Ginsburg, U.S. Department of Energy, US
2:20From Theory to Practical High Brightness Photocathodes
W. Schroeder, University of Illinois at Chicago, US
2:40On-Chip Integrated Photonics based Photocathodes
R. Kapadia, University of Southern California, US
3:00Demonstrating Improved Lifetime in Superlattice Photocathodes
M. Andorf, Cornell University, US
3:20Extreme Longitudinal Compression of Optimized Beams for MEV Ultrafast Electron Diffraction
G. Hoffstaetter, Cornell University, US
3:40Using the multi-Petawatt ZEUS facility for laser wakefield acceleration
K. Krushelnick, University of Michigan, US
4:00Feedback & Final Remarks from DOE
E. Colby, U.S. Department of Energy, US
1:00Medical & WMD Countermeasures Summit - (CWMD/MCDC Members meeting)Maryland CD
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