JUNE 17-19, 2024
WASHINGTON, DC    


Special Symposium: CHIPS R&D — Challenges and Opportunities

CHIPS


Sponsored by:

micron
MNT-EC

Symposium Co-Chairs

Dalia YablonDalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

Alex NormanAlex Norman
Executive Director
Princeton Institute of Materials

Daniel SchmidtDaniel Schmidt
In-Line Metrology Manager
IBM Research



Key Speakers

Jeff NelsonDOE Nanoscale Science Research Centers Support of the Chips and Science Act
Jeff Nelson
Director of Center of Integrated Technologies, Sandia National Laboratories

Yevgeny RaitsesAdvanced plasma diagnostics for materials synthesis and processing applications
Yevgeny Raitses
Principal Research Physicist, Princeton Plasma Physics Lab

Robert BasemanSmartFab Data and Analytics - Challenges and Opportunities
Robert Baseman
Senior Staff Member, IBM

Chris AndersonThe Last Light Source
Chris Anderson
Vice President, XLight, Inc.

Mike Young-Han KimFrom Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing
Mike Young-Han Kim
CEO, Gauss Labs

Ali HallalCollaborative and Holistic AI driven process control software platform to accelerate IC Manufacturing
Ali Hallal
Application Manager and Senior Data Scientist, Pollen Metrology, France

 

With passage of the 2022 CHIPS for America Act, the US government is making a $50 billion investment to catalyze long-term growth in the domestic semiconductor industry in support of US national and economic security. A significant portion of this funding - $11 billion – goes towards R&D initiatives to create a network of innovation in the US semiconductor ecosystem.

This symposium will focus on 3 target areas identified as critical to the R&D initiatives:

  1. Heterogeneous integration and chiplet technology
  2. SmartFab infrastructure for large scale data handling and more efficient operation
  3. Emerging methods in metrology

*This symposium gathers experts to discuss research challenges and opportunities associated with the recently passed CHIPS act, but it is not an official activity by or related to the US CHIPS office.

 
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2024 Symposium Sessions

Monday June 17

10:00CHIPS Workforce Development and Student Leaders Conference Internal Welcome and Networking (SLC Participants Only)
10:30CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry
1:30CHIPS Workforce Development Program: Career Panel for Community College/Technical College Students and Educators
2:30CHIPS Workforce Development Program: Career Panel for Four Year Undergraduates/Graduate Students and Educators
3:30CHIPS Workforce Development Program: Registered Apprenticeships

Tuesday June 18

9:00CHIPS R&D - SmartFab
10:30CHIPS R&D - Metrology
12:00CHIPS Workforce Development Program Career Awareness Fair (12:00 - 6:00)
4:00CHIPS R&D - Posters
4:00Student Leaders Poster Session

Wednesday June 19

9:00XR for Semiconductor Workforce Development and Training
11:00CHIPS Workforce Development Symposium and Student Leaders Conference Closing Remarks and Summary Discussion (SLC Participants Only)

2024 Symposium Program

Monday June 17

10:00CHIPS Workforce Development and Student Leaders Conference Internal Welcome and Networking (SLC Participants Only)National Harbor 12
Session chair: Maria Fernanda Campa, National Nanotechnology Coordination Office, US
Panelist
B. Brough, National Nanotechnology Coordination Office, US
Panelist
J. Ashcroft, Micro Nano Technology Education Center, US
Panelist
D. Yablon, TechConnect World Innovation Conference, US
10:30CHIPS Workforce Development Program: Tutorial on the Semiconductor IndustryNational Harbor 12
Introductory Remarks, Congressman Jake Auchincloss - MA
D. Weinstein, OSTP, The White House, US
S. Roberts, City University of New York, US
L. Folks, University of Arizona, US
A. Michelin, SUNY Poly/NY CREATES, US
J. Ellington, Wolfspeed, US
1:30CHIPS Workforce Development Program: Career Panel for Community College/Technical College Students and EducatorsNational Harbor 12
Session chair: Quinn Spadola, National Nanotechnology Coordination Office, US
Introductory Remarks
V.C. Carter, National Science Foundation, US
Panelist
B. Harrop, Princeton University, US
Panelist
T. Pennell, Cornell University, US
Panelist
T. McCaughey, GlobalFoundries, US
Panelist
A. Denmon, Santa Monica College, US
Panelist
M. Murdock, Intel Corp., US
2:30CHIPS Workforce Development Program: Career Panel for Four Year Undergraduates/Graduate Students and EducatorsNational Harbor 12
Session chair: Alex Norman, Princeton University, US
Panelist
D. Schmidt, IBM Research, US
Panelist
C. Cramer, Highline College, US
Panelist
J. Ellington, Wolfspeed, US
Panelist
J. Rush-Byers, Micron, US
Panelist
M. Murdock, Intel Corp., US
3:30CHIPS Workforce Development Program: Registered ApprenticeshipsNational Harbor 12
Session chair: Robert Weinman, NIICA, US
Panelist
S. Newton-Klitz, Micron, US
Panelist
J. Ellington, Wolfspeed, US
Panelist
K. McDaniel, Indium Corporation, IMT Apprenticeship, US
Panelist
T. McCaughey, GlobalFoundries

Tuesday June 18

9:00CHIPS R&D - SmartFabNational Harbor 12
Session chair: Daniel Schmidt, IBM, US
DOE Nanoscale Science Research Centers Support of the Chips and Science Act
J. Nelson, Sandia National Laboratories, US
SmartFab Data and Analytics - Challenges and Opportunities
R. Baseman, IBM, US
From Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing
M.Y.-H. Kim, Gauss Labs Inc., US
Collaborative and Holistic AI driven process control software platform to accelerate IC Manufacturing
J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, A. Hallal, M. Jacob, S. Garrais, POLLEN Metrology Inc., US
10:30CHIPS R&D - MetrologyNational Harbor 12
Session chair: Alex Norman, Princeton University, US
The Last Light Source
C. Anderson, xLight, Inc., US
Advanced plasma diagnostics for materials synthesis and processing applications
Y. Raitses, Princeton Plasma Physics Laboratory, US
Characterizing Thermal Properties and Temperature-rise of High Frequency RF Transistors In-Operando at sub-50 nm Length Scales
B.M. Foley, T. Bates, P.E. Hopkins, J.T. Gaskins, Laser Thermal Inc., US
Scaling Chiplet Integration Through Advances in Printed Interconnects
N. Frick, M. Fisher and C. Contreras Sepulveda, North Carolina State University, US
Dendritic Identifiers as Digital Triggers in Microelectronics Manufacturing
M.N. Kozicki, J. Joseph, Arizona State University and Densec ID, LLC, US
12:00CHIPS Workforce Development Program Career Awareness Fair (12:00 - 6:00)Expo Hall BC
Princeton Plasma Physics Laboratory
Intel
Micron
Wolfspeed
IBM
National Institute for Innovation and Technology (NIIT)
MNT-EC
Texas Instruments
University of Arizona
4:00CHIPS R&D - PostersExpo Hall BC
Advances in Thermal Metrology of Thin Films via Steady-State Thermoreflectance
J.T. Gaskins, B.F. Foley, D.H. Olson, J.L. Braun, P.E. Hopkins, Laser Thermal, US
High-performance, power efficient storage device, on a base of NVDIMM for embedded systems
I. Sharovar, Truememorytechnology LLC, US
Fabrication of Epsilon-near-zero Metamaterial with Anomalous Refraction
A. Enriquez, M. Meretska, F. Capasso, Harvard University, US
Rugged SiC Device & Power Module Technology for Reliable Power Electronics
A. Morgan, NoMIS Power, US
4:00Student Leaders Poster SessionExpo Hall BC
Polymeric layer-by-layer microcapsules containing iron oxide magnetic nanoparticles exposed to breast cancer cells: A viability study using tetrazolium-based (MTT) and calcein-AM assays
M. Ashcroft, R. Swift, N. Habibi, Micro Nano Technology Education Center, US
Understanding Electronic Properties of Gold and Streptavidin-Conjugated Gold Nanoparticles for Use in Photothermal Cancer Medicine
T. Nguyen, T.L. Sung, W.L. Yu, A. Ashcroft, M. Ashcroft, J. Ashcroft, Pasadena City College, US
Exploring the Performance of Convolutional Neural Networks for mRNA cancer vaccine 5’ UTR Design
A. Yan, Mercer County Community College, US
Student Created AI-powered Digital Twin for Semiconductor Workforce Training
I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Micro Nano Technology Education Center, US
Enhancing Microfabrication Education and Industry Readiness Leveraging the University of New Mexico’s Manufacturing Training and Technology Center Cleanroom Infrastructure
M.W. Pleil, N. Jackson, University of New Mexico, US
Photonics Programs at Stonehill College: Bridging Education and Industry
G. Gu, C. Schnitzer, R. Adams, J. Evora, V. Taylor, N. Vu, J. Wong, Stonehill College, US
Recyclable Nanocomposite Conductive Wire
C. Fitton-Gillen, A. Rivera, C. Pazmino-Izquierdo, C. Li, Hudson County Community College, US
Generative AI-based Personalized Semiconductor Education using Extended Reality
S. Salehi, P. Satam, E. Azimi, R. Straight, A. Salado, The University of Arizona, US
SemImmerse: Smart Immersive Training Ecosystem for Semiconductor Manufacturing
E. Azimi, R. Lan, C. Wang, K. A. Knudson, T. Peterson, Z. Mutlu, University of Arizona, US
Surface smoothing of diamond by isotropic plasma atomic layer etching
L. Stockl, C.M. Lewis, M. Huerta, N. Moldovan, R. Divan, S. Miller, L. Stan, A. Sumant, Rowan University, US
Designing a Sample Holder for Improved Instrument Sensitivity
K. Lewis, D. Nimlos, S. Cushing, Pasadena City College, US
Synthesis of a novel hydrazone-based compound applied as a fluorescence turn-on chemosensor for iron (III) and a colorimetric sensor for copper (II) with antimicrobial, DFT and molecular docking studies.
A. Adams, A.R. Sharmin, A.M. Patwary, E.G. William, K.M. Royhana, M.M. Mahmud, M.A. Haque, J. Uddin, and K. Morshin, Coppin State University, US
Determining Optimal Base Dose with Electron Beam Lithography
K. Ohashi, Caltech/Pasadena City College, US
*STUDENT POSTER AWARDEE* Copper-bearing hydrotalcite minerals as precursors for photocatalytic supported plasmonic nanoparticles
J. Cabezas Parra, E.R. Newmeyer, J. North, M. Hershey, D.F. Swearer, Northwestern University, US

Wednesday June 19

9:00XR for Semiconductor Workforce Development and TrainingNational Harbor 12
Session chair: Jared Ashcroft, Pasadena City College, US
Co-designing Generative AI-powered Immersive Learning Experiences for Workforce Training
R. Jha, C. Johnson, SimInsights Inc, US
Student Centered Undergraduate Research Experiences in Creating Virtual Digital Twin Cleanroom
J. Ashcroft, I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Pasadena City College, US
How to overcome Reality's semiconductor self-identification, training and up-skilling challenges
J. Spyres, Training All People, Inc (Tap3d), US
AR/VR Experiences - Demonstration of Providers
11:00CHIPS Workforce Development Symposium and Student Leaders Conference Closing Remarks and Summary Discussion (SLC Participants Only)National Harbor 12
Session chair: Maria Fernanda Campa, National Nanotechnology Coordination Office, US
Topics & Application Areas
  • Heterogeneous integration and chiplet technology
  • SmartFab infrastructure for large scale data handling and more efficient operation
  • Emerging methods in metrology
  • Other
 

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