Call for Student Leaders
Submissions closed
TechConnect, in partnership with the
NextTech Student Network and
affiliated student groups from across the country, is proud to announce
the 2024 Nano and Emerging Technologies Student Leaders Conference
co-located with the 2024 TechConnect World Innovation Conference and
2024 Nanotech Conference & Expo. The event will be held on June 17–19,
2024 at the Gaylord National Hotel & Convention Center, National Harbor,
MD.
The Student Leaders Conference brings together undergraduate nano
and emerging technologies student group representatives from across the
United States. This program is seeking out active student group leaders
in order to highlight undergraduate research and connect students with
entrepreneurs, industry leaders, venture capitalists, and
representatives of federal agencies funding research in emerging
technologies. Additionally, the Student Leaders Conference is an
opportunity for students to share best practices and network with
like-minded group leaders.
This year, the Student Leaders Conference is coordinating with the
CHIPS Act Workforce Development Programming at TechConnect to raise
awareness about the different career paths associated with the
semiconductor industry. Students will be surprised to learn that not all
“CHIPS” jobs are for electrical engineers! In addition to talks on what
the semiconductor industry is all about, students will have the
opportunity to explore career opportunities/training/internship at the
expo floor, and showcase their research during the poster session.
The Student Leaders Conference will also host a career panel
discussion with industry, government, and academics to explore the
different career paths beyond the semiconductor industry possible with a
STEM degree, a poster session, and a reception.
In its role to support the National Nanotechnology Initiative, the
National Nanotechnology Coordination Office is helping to establish the
NextTech Student Network. Student leaders from the network have designed
the conference in order to ensure the programming meets the needs of
these groups. Participation is welcome from student leaders in any
science, technology, and business domain.
2024 Emerging Technologies Student Leaders Conference Program
- Monday June 17, 2024
- Student Leaders Conference and CHIPS Workforce Development symposium (students only) welcome
- 10 am (after the keynote speaker)
- Career panel
- Tuesday June 18, 2024
- CHIPS symposium
- Poster session
- Wednesday June 19, 2024
- Recap of the conference and next steps
2024 Emerging Technologies Student Leaders Conference Program
Back to Top ↑Sessions |
| Monday June 17 |
| 10:30 | CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry |
| 1:30 | CHIPS Workforce Development Program: Career Panel Discussions |
| 3:30 | CHIPS Workforce Development Program: Registered Apprenticeships |
| Tuesday June 18 |
| 9:15 | CHIPS R&D - SmartFab |
| 10:45 | CHIPS R&D - Metrology |
| 12:00 | CHIPS Workforce Development Program Career Awareness Fair (12:00 - 6:00) |
| 3:00 | Rare Earths Panel: How Critical are Minerals to our Energy Security? |
| 4:00 | CHIPS R&D - Posters |
|
Program |
| Monday June 17 |
|
| 10:30 | CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry | Annapolis 3-4 |
|
| 1:30 | CHIPS Workforce Development Program: Career Panel Discussions | Annapolis 3-4 |
|
| 3:30 | CHIPS Workforce Development Program: Registered Apprenticeships | Annapolis 3-4 |
| Tuesday June 18 |
|
| 9:15 | CHIPS R&D - SmartFab | Annapolis 3-4 |
| Session chair: Daniel Schmidt, IBM, US |
| DOE Nanoscale Science Research Centers Support of the Chips and Science Act
J. Nelson, Sandia National Laboratories, US |
| SmartFab Data and Analytics - Challenges and Opportunities
R. Baseman, IBM, US |
| From Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing
M.Y.-H. Kim, Gauss Labs Inc., US |
| Collaborative and Holistic AI driven process control software platform to accelerate IC Manufacturing
J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, A. Hallal, M. Jacob, S. Garrais, POLLEN Metrology Inc., US |
|
| 10:45 | CHIPS R&D - Metrology | Annapolis 3-4 |
| Session chair: Alex Norman, Princeton University, US |
| The Last Light Source
E.R. Hosler, xLight, Inc., US |
| Advanced plasma diagnostics for materials synthesis and processing applications
Y. Raitses, Princeton Plasma Physics Laboratory, US |
| Characterizing Thermal Properties and Temperature-rise of High Frequency RF Transistors In-Operando at sub-50 nm Length Scales
B.M. Foley, T. Bates, P.E. Hopkins, J.T. Gaskins, Laser Thermal Inc., US |
| Scaling Chiplet Integration Through Advances in Printed Interconnects
N. Frick, Freescale LLC, US |
| Dendritic Identifiers as Digital Triggers in Microelectronics Manufacturing
M.N. Kozicki, J. Joseph, Arizona State University and Densec ID, LLC, US |
|
| 12:00 | CHIPS Workforce Development Program Career Awareness Fair (12:00 - 6:00) | Expo Hall BC |
|
| 3:00 | Rare Earths Panel: How Critical are Minerals to our Energy Security? | TBA |
| Session chair: Dawn Wellman, Rio Tinto |
|
| 4:00 | CHIPS R&D - Posters | Expo Hall BC |
| Advances in Thermal Metrology of Thin Films via Steady-State Thermoreflectance
J.T. Gaskins, B.F. Foley, D.H. Olson, J.L. Braun, P.E. Hopkins, Laser Thermal, US |
| High-performance, power efficient storage device, on a base of NVDIMM for embedded systems
I. Sharovar, Truememorytechnology LLC, US |
| Fabrication of Epsilon-near-zero Metamaterial with Anomalous Refraction
A. Enriquez, M. Meretska, F. Capasso, Harvard University, US |
| Rugged SiC Device & Power Module Technology for Reliable Power Electronics
A. Morgan, NoMIS Power, US |
|
| Back to Top |
