Join industry partners and applied research leadership accelerating the development and deployment of artificial intelligence into products and society.

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Speakers and Chairs Include:

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2024 Sector Program - AI Innovation

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	Monday June 17
8:30	TechConnect World Innovation Conference - Plenary Keynotes
10:30	TechConnect Innovation Spotlights: AI, Data, Cyber, Software I
11:30	TechConnect Innovation Spotlights II: AI, Data, Cyber, Software
3:30	AI-Accelerated Materials Design and Deployment Town Hall - Materials Genome Initiative (MGI)
4:00	TechConnect Innovation Showcase Reception, Poster Session I (4:00 - 6:00)
	Tuesday June 18
8:00	TechConnect Keynote Program
9:00	CHIPS R&D - SmartFab
9:15	Advanced Manufacturing Innovation
12:00	TechConnect World, SBIR/STTR Pavilion, and EPA P3 Exhibit Hall Opens
1:30	AI Modeling & Simulation
4:00	TechConnect Innovation Showcase Reception, Poster Session 2 (4:00 - 6:00)
	Wednesday June 19
8:30	DOD Cybersecurity Compliance for Contractors (Additional Registration Required)
9:00	AI Innovations
9:00	TechConnect Innovation Spotlights: AI, Data, Cyber, Defense
Program
	Monday June 17
8:30	TechConnect World Innovation Conference - Plenary Keynotes	Maryland C
	Session chair: Jennifer Rocha, Dalia Yablon, Matthew Laudon, TechConnect ATI, US
	TechConnect Overview: Connecting Research, Accelerating Innovation M. Laudon, J. Rocha, D. Yablon, TechConnect ATI, US
	Durable, Affordable and Scalable Carbon Removal using the Engineered Storage of Biomass H. Murnen, Graphyte, Inc., US
	Scalable Production of Hierarchical Carbon-Based Aerogel Materials for Filtration Applications C. Arnold, Princeton University, US
	How SBA is Enabling the Future D. Syed, U.S. Small Business Administration, US
10:30	TechConnect Innovation Spotlights: AI, Data, Cyber, Software I	Maryland 3
	Session chair: Jennifer Rocha, TechConnect ATI, US
	BILT 3D Immersive Interactive Instructions A. Qureshi, BILT Incorporated, US
	edgeCore - Data Twin Solution Driving Actionable Enterprise Decision Making and AI/ML Adoption J. Jarman, Edge Technologies, US
	The Walacor Platform L. George, Walacor, US
	A Method of Mechanochemically-Assisted Extraction of Lithium from α-Spodumene and Other Hard-rock Minerals C. Forney, Ames National Laboratory/Iowa State University Research Foundation, US
	Generative AI Requirements Development S. O'Neill, Iris Technology Corp, US
	Review Panelist J. Fanelli, Navy CIO, US
	Review Panelist M. Schweitzer, Falconwood Inc./US Navy, US
	Review Panelist K. Mish, ManTech, US
	Review Panelist P. Staszak, Boeing, US
	Review Panelist R. Hatcher, Phoenix Semiconductor Corporation, US
11:30	TechConnect Innovation Spotlights II: AI, Data, Cyber, Software	Maryland 3
	Session chair: Jennifer Rocha, TechConnect ATI, US
	OPERA - Operational Process Efficiency and Resource Analytics J. Beyle, SC Tech, US
	SkyPro - Data Augmentation for Rapid Automatic Target Recognition N. Kriplani, Vadum Inc., US
	CENTRAL SPIRAL A. Serna, C SPIRAL LLC, US
	SmartCoil - the first real-time monitoring system for AHU Coils J. Seippel, Sensible, Inc., US
	Review Panelist J. Fanelli, Navy CIO, US
	Review Panelist M. Schweitzer, Falconwood Inc./US Navy, US
	Review Panelist P. Staszak, Boeing, US
	Review Panelist R. Hatcher, Phoenix Semiconductor Corporation, US
3:30	AI-Accelerated Materials Design and Deployment Town Hall - Materials Genome Initiative (MGI)	Annapolis 3-4
	Artificial intelligence (AI) has the potential to revolutionize the way we design, develop, and deploy new materials. This town hall will bring together industry leaders to discuss priorities and strategies for harnessing AI to accelerate materials innovation. Join us for a lively discussion on topics such as autonomous R&D, AI-enabled exploration of the vast materials design space, and opportunities for collaboration among industry, government, and academia.
	Session chair: Lisa E. Friedersdorf, Office of Science and Technology Policy, US
	Moderator B. Segal, Lockheed Martin, US
	Panelist L. Lee, IBM Research (Zürich), CH
	Panelist S. Arturo, Dow, US
	Panelist C. Boswell-Koller, National Science Foundation, US
	Panelist E. Breckenfeld, NVIDIA, US
4:00	TechConnect Innovation Showcase Reception, Poster Session I (4:00 - 6:00)	Expo Hall BC
	Tuesday June 18
8:00	TechConnect Keynote Program	Maryland C
	Session chair: Jennifer Rocha, TechConnect ATI, US
	SBA Growth Accelerator Competition B. Sickler, Office of Investment & Innovation, U.S. Small Business Administration, US
	Advanced Manufacturing in Space - Catalyst Community Launch M. Laudon, TechConnect ATI, US
	ATI Catalyzing National Innovation P. Dudley, Advanced Technology International (ATI), US
	Commercial Space Office (COMSO) and the recently signed DoD and USSF Commercial Space Strategies J. Leader, U.S. Space Force, US
	In-Space Manufacturing as a Profitable and Investable Business R. Roettgen, E2MC Ventures, CH
9:00	CHIPS R&D - SmartFab	National Harbor 12
	Session chair: Daniel Schmidt, IBM, US
	DOE Nanoscale Science Research Centers Support of the Chips and Science Act J. Nelson, Sandia National Laboratories, US
	SmartFab Data and Analytics - Challenges and Opportunities R. Baseman, IBM, US
	From Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing M.Y.-H. Kim, Gauss Labs Inc., US
	Collaborative and Holistic AI driven process control software platform to accelerate IC Manufacturing J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, A. Hallal, M. Jacob, S. Garrais, POLLEN Metrology Inc., US
9:15	Advanced Manufacturing Innovation	Chesapeake 1
	Session chair: Slade Gardner, Big Metal Additive, US
	Optimizing Graphene-Metal Composites Manufacturing Through Laser Photothermal Processing Modeling and Computation D. Espinoza, D. Coren, D. Colmanarez, P. Kang, M.A. Khan, George Mason University, US
	AI-assisted feedback to sheet metal stamping processes for automotive applications W. Halsey, D. Pokkalla, V. Paquit, R. Davies, L. Huang, A. Ilinich, W. Wu, K. Murali, L. Huang, K. Kannan, K. Li, S. Dev, S. Kim, Oak Ridge National Laboratory, US
	Quantum Cyber Trust Anchor: Authenticating and Tracking Physical Components M. Maasberg, I. Taylor, L.G. Butler, U.S. Naval Academy, US
	Defect Detection in ISC Cylinder Using Spoof Plasmon Polaritons W. Wilson, E. Tucker, NASA Langley Research Center, US
	The Electronic Alchemy eforge: An Innovation in the Multi-material 3D Printing of Functional Electronics C.M. Glenn, W. Chan, M. Whitely, L. Lassiter, Morningbird Space, US
	Digital Manufacturing for Production: Exploring Applications from Copper to Crowns M. Strobel, Quantica, DE
12:00	TechConnect World, SBIR/STTR Pavilion, and EPA P3 Exhibit Hall Opens	Expo Hall BC
1:30	AI Modeling & Simulation	Chesapeake C
	Session chair: Jan-Willem Handgraaf, Siemens, NL
	Towards chemical foundation models for digital prediction of experimental measurements E. Annevelink, Physics Inverted Materials, US
	Utilizing Genetic Algorithms for Autonomous RF FEM Simulation & Optimization V. Gjokaj, NuPhotonics LLC, US
	Leveraging Physics-Based Simulations and Machine Learning to Identify Promising Formulations for Materials Science Applications A.K. Chew, M.A.F. Afzal, A. Chandrasekaran, M.D. Halls, Schrödinger, US
	When Can We Ignore Missing Data in Model Training? C. Zhen, A. Singh, A. Termehchy, Oregon State University, US
	Analyzing and optimizing CO2 geothermal energy production utilizing artificial intelligence – a deep basin approach K. Katterbauer, A. Alhashboul, H. Chen, A. Yousef, Saudi Aramco, SA
	Common Data Model to Rapidly Certify AM Parts with Reduced Inspection Leveraging AI / ML D. Reed, J. Shah, W. Sobol, T. Kirk, A. Kitt, MxD USA, US
4:00	TechConnect Innovation Showcase Reception, Poster Session 2 (4:00 - 6:00)	Expo Hall BC
	Wednesday June 19
8:30	DOD Cybersecurity Compliance for Contractors (Additional Registration Required)	Maryland 5
9:00	AI Innovations	Chesapeake C
	Session chair: Jan-Willem Handgraaf, Siemens, NL
	SPOC: A novel high-throughput screening platform that generates kinetic binding data for biological validation of AI-designed monoclonal antibodies to SARS-CoV-2 B. Takulapalli, C. Agu, R. Cook, W. Martelly, L. Gusghari, INanoBio Inc., US
	Autonomous Intelligent Architecture—Preliminary Results T.A. Duong and Q.D. Duong, Adaptive Computation LLC, US
	Robust Defect Detection for Binder Jet 3D Printing with Semi-Siamese Neural Networks Y. Niu, University of Connecticut, US
	AI-driven CO2 injection performance optimization for saline aquifers – Overcoming injection challenges for optimal CO2 sequestration K. Katterbauer, A. Alhashboul, H. Chen, A. Yousef, Saudi Aramco, SA
	Development of active prior learning system for experimental education using metaverse-based AI virtual human (Ailey) J. Oh, S.-H. Park, Soongsil University, KR
9:00	TechConnect Innovation Spotlights: AI, Data, Cyber, Defense	Maryland 3
	Session chair: Jonathan Jakischa, TechConnect/ATI, US
	Scaling Chiplet Integration Through Advances in Printed Interconnects N. Frick, Freescale LLC, US
	PolyMaterials App, LLC M. Ram, PolyMaterials App, LLC, US
	Lighthouse Avionics T. Bair, Lighthouse Avionics, US
	ENF Products, LLC M. Khandaker, ENF Products, LLC, US
	The M1 Platform for Automating Actions across Infrastructure Systems G. Scott, Service Robotics & Technologies, Inc., US
	Energy Prediction for Intelligent and efficient Command and Control S. Haag, Exergi Predictive, US
	The Quantum Entanglement Detection Array with IoT Sensors (QEDA-IS) N. Abhimitra, Arch Systems, LLC, US
	Review Panelist C. Owens, Lockheed Martin, US
	Review Panelist M. Ryan, ATI, US
	Review Panelist TBA, Northrop Grumman, US
	Review Panelist J. Bindra, University of Ottawa, CA
	Review Panelist J. Blumenau, AAR Corporation, US
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SPONSORS & PARTNERS

 

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SBIR/STTR AGENCY PARTNERS

 

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