JUNE 17-19, 2024
WASHINGTON, DC    


Printed & Flexible Electronics

Printed and Flexible Electronics

Submit Abstract - due April 1 »

Please first review the information for authors — abstract submission guidelines.

Symposium Co-Chairs

Yiliang WuYiliang Wu
Director of Technology and Innovation
Colltech North America

Mandakini KanungoMandakini Kanungo
Senior Research Scientist
Corning, Inc.

 

2023 Key Speakers

Harvey ShiData-Driven Manufacturing of Hierarchical Functional Materials for Energy and Sensing Applications
Harvey Shi
Assistant Professor, Western University

Amandine YuAmandine Yu
Global Market Director
Colltech Group

 

Organics, Printed, and Flexible Electronics technologies will have a far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries, biomedical devices, and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event

 
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2023 Symposium Sessions

Tuesday June 20

4:00Printed & Flexible Electronics - Posters

Wednesday June 21

9:00Printed & Flexible Electronics

2023 Symposium Program

Tuesday June 20

4:00Printed & Flexible Electronics - PostersExpo Hall AB
Additive Manufacturing of Colloidal Nanocrystal Inks for In-Space Manufacturing of Advanced Sensors and Energy Harvesters
F. Rajabi Kouchi, N. McKibben, A. Briggs, J. Manzi, M. Busuladzic-Begic, I. Estrada, J. Eixenberger, T. Varghese, H. Subbaraman, D. Estrada, Boise State University, US
Functional Inks for Additive Manufacturing of Electronics
T. Kirscht, M. Marander, F. Liu, S. Jiang, Iowa State University, US

Wednesday June 21

9:00Printed & Flexible ElectronicsChesapeake B
Session chair: Yiliang Wu, CollTech North America, US
9:00Data-Driven Manufacturing of Hierarchical Functional Materials for Energy and Sensing Applications
H.T.H. Shi, Western University, CA
9:25How to Make Flexible Printed Circuits More Reliable
A. Yu, CollTech, US
9:50Process planning and development of a multi-axis, multi-material, multi-tool Electronic Packaging (3M3D) technique using Additive Manufacturing
S. Karam, S. Bilén, G. Manogharan, Penn State University, US
10:10Direct-Write Mask Free Fabrication of Quality 1D-2D Hybrid Nanomaterials on Supported or Suspended Platforms using Custom Inks and Chemical Vapor Deposition Synthesis.
I. Kuljanishvili, Saint Louis University, US
Topics & Application Areas
  • Organic Electronic Materials & Devices
  • Flexible/Stretchable Electronics Materials & Manufacturing
  • Printed Electronics Innovation & Applications
  • Flexible & Printed Sensors, Solar Cells, Battery, & Medical Devices
  • Novel Printing Technologies
  • Printed Electronics Packaging
  • Other
 

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SBIR/STTR AGENCY PARTNERS
SBIR/STTR Agency Partners