| Affiliation | Day | Presenter(s) | Talk title |
|---|
|
| fabric8labs | W2.148 | I. Winfield, T. Ouradnik, M. Matthews | Metal 3D Printing Using Electrochemical Additive Manufacturing, Revolutionizing the Electronics Indu… |
| Fabrisonic LLC | T4.304 | M. Norfolk | Embedding Sensors via Metal 3D Printing |
| Fabrisonic LLC | T4.222 | P. Bahn, M. Norfolk | Solid State Metal 3D Printing for Space |
| Falconwood Inc./US Navy | M2.428 | M. Schweitzer | Review Panelist |
| Falconwood Inc./US Navy | M2.526 | M. Schweitzer | Review Panelist |
| Faraday 1867 Holdings LLC | W1.025 | S. Samoilenkov | High temperature superconductors as the key material for compact fusion: scale up challenges and inv… |
| Faradyne Power | T2.263 | B. Nicholls | Production of Turbostratic Graphene from Biomass to Improve Safety and Performance of Lithium-Ion Ba… |
| FHT | M8.222 | B. Sullivan, M. Merwin, J. Beaudry, Y. Sahoo | Rapid R2R Prototyping of Novel Technologies |
| FiteBac Woundcare LLC | W2.386 | M. Etchells | Advanced Wound Healing |
| Flawless Photonics Inc. | M4.435 | M. Vestel | Revolutionizing Space Manufacturing: Sharing Insights from the Breakthroughs in Optical Glass Fabric… |
| FORMING GmbH | M4.087 | S. Mueller, S. Gall, R. Nitschke, A. Goraieb | Extrusion of BeTi Beryllides from powder |
| FORMING GmbH | M4.122 | S. Mueller, S. Gall, R. Nitschke, F. Gensch | High-precision magnesium microtubes for stents with improved mechanical properties |
| Forward Edge-AI, Inc. | M4.511 | E. Adolphe | Isidore - A Low Cost, High Throughput, Quantum Resistant Space Encryptor |
| framergy, Inc. | T2.444 | R. Ozdemir | A Novel Advanced Manufacturing Pathway for Direct Incorporation of Metal-Organic Frameworks in Polymeric Sponges |
| Fraunhofer CAN | M2.161 | J. Niehaus, S. Becker, T. Jochum | How to increase the energy efficiency of a LCD by the use of a quantum dot enhancement film emitting… |
| Fraunhofer CAN | M2.164 | S. Becker, E. Salikhova, J.S. Niehaus | Synthesis of NIR quantum dots and their application |
| Freescale LLC | W2.341 | N. Frick | Scaling Chiplet Integration Through Advances in Printed Interconnects |
| Fusion Industry Association | T2.102 | A. Holland | Building a fusion energy supply chain - results of the FIA 2024 Supply Chain Report |
