TechConnect aims to raise student and educator awareness from all backgrounds - community college, undergraduate, and graduate - across all regions about the semiconductor industry and associated career opportunities, in light of the $52 billion dollar investment by the US government in the CHIPS act. There will be various programs for students and educators to explore career pathways and opportunities related to expansion of a domestic semiconductor workforce to operate the new and expanded facilities as determined as critical to meeting the goals of the CHIPS Incentives program.
This program is supported by PMI, Princeton University.
Back to Top ↑Sessions |
| Monday June 17 |
10:30 | CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry |
1:30 | CHIPS Workforce Development Program: Career Panel Discussions |
3:30 | CHIPS Workforce Development Program: Registered Apprenticeships |
| Tuesday June 18 |
9:15 | CHIPS R&D - SmartFab |
10:45 | CHIPS R&D - Metrology |
12:00 | CHIPS Workforce Development Program Career Awareness Fair (12:00 - 6:00) |
4:00 | CHIPS R&D - Posters |
4:00 | Student Leaders Poster Session |
| Wednesday June 19 |
9:00 | XR for Semiconductor Workforce Development and Training |
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Program |
| Monday June 17 |
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10:30 | CHIPS Workforce Development Program: Tutorial on the Semiconductor Industry | Annapolis 3-4 |
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1:30 | CHIPS Workforce Development Program: Career Panel Discussions | Annapolis 3-4 |
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3:30 | CHIPS Workforce Development Program: Registered Apprenticeships | Annapolis 3-4 |
| Tuesday June 18 |
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9:15 | CHIPS R&D - SmartFab | Annapolis 3-4 |
| Session chair: Daniel Schmidt, IBM, US |
| DOE Nanoscale Science Research Centers Support of the Chips and Science Act J. Nelson, Sandia National Laboratories, US |
| SmartFab Data and Analytics - Challenges and Opportunities R. Baseman, IBM, US |
| From Lab to Fab: AI-Powered Metrology for High-Volume Manufacturing M.Y.-H. Kim, Gauss Labs Inc., US |
| Collaborative and Holistic AI driven process control software platform to accelerate IC Manufacturing J. Foucher, S. Martinez, H. Ozdoba, J. Baderot, A. Hallal, M. Jacob, S. Garrais, POLLEN Metrology Inc., US |
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10:45 | CHIPS R&D - Metrology | Annapolis 3-4 |
| Session chair: Alex Norman, Princeton University, US |
| The Last Light Source E.R. Hosler, xLight, Inc., US |
| Advanced plasma diagnostics for materials synthesis and processing applications Y. Raitses, Princeton Plasma Physics Laboratory, US |
| Characterizing Thermal Properties and Temperature-rise of High Frequency RF Transistors In-Operando at sub-50 nm Length Scales B.M. Foley, T. Bates, P.E. Hopkins, J.T. Gaskins, Laser Thermal Inc., US |
| Scaling Chiplet Integration Through Advances in Printed Interconnects N. Frick, Freescale LLC, US |
| Dendritic Identifiers as Digital Triggers in Microelectronics Manufacturing M.N. Kozicki, J. Joseph, Arizona State University and Densec ID, LLC, US |
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12:00 | CHIPS Workforce Development Program Career Awareness Fair (12:00 - 6:00) | Expo Hall BC |
| Princeton Plasma Physics Laboratory
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| Intel
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| Micron
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| Wolfspeed
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| Tokyo Electron
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| IBM
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4:00 | CHIPS R&D - Posters | Expo Hall BC |
| Advances in Thermal Metrology of Thin Films via Steady-State Thermoreflectance J.T. Gaskins, B.F. Foley, D.H. Olson, J.L. Braun, P.E. Hopkins, Laser Thermal, US |
| High-performance, power efficient storage device, on a base of NVDIMM for embedded systems I. Sharovar, Truememorytechnology LLC, US |
| Fabrication of Epsilon-near-zero Metamaterial with Anomalous Refraction A. Enriquez, M. Meretska, F. Capasso, Harvard University, US |
| Rugged SiC Device & Power Module Technology for Reliable Power Electronics A. Morgan, NoMIS Power, US |
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4:00 | Student Leaders Poster Session | Expo Hall BC |
| Polymeric layer-by-layer microcapsules containing iron oxide magnetic nanoparticles exposed to breast cancer cells: A viability study using tetrazolium-based (MTT) and calcein-AM assays M. Ashcroft, R. Swift, N. Habibi, Micro Nano Technology Education Center, US |
| Understanding Electronic Properties of Gold and Streptavidin-Conjugated Gold Nanoparticles for Use in Photothermal Cancer Medicine T. Nguyen, T.L. Sung, W.L. Yu, A. Ashcroft, M. Ashcroft, J. Ashcroft, Pasadena City College, US |
| Exploring the Performance of Convolutional Neural Networks for mRNA cancer vaccine 5’ UTR Design A. Yan, Mercer County Community College, US |
| Student Created AI-powered Digital Twin for Semiconductor Workforce Training I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Micro Nano Technology Education Center, US |
| Enhancing Microfabrication Education and Industry Readiness Leveraging the University of New Mexico’s Manufacturing Training and Technology Center Cleanroom Infrastructure M.W. Pleil, N. Jackson, University of New Mexico, US |
| Photonics Programs at Stonehill College: Bridging Education and Industry G. Gu, C. Schnitzer, R. Adams, J. Evora, V. Taylor, N. Vu, J. Wong, Stonehill College, US |
| Recyclable Nanocomposite Conductive Wire C. Fitton-Gillen, A. Rivera, C. Pazmino-Izquierdo, C. Li, Hudson County Community College, US |
| Generative AI-based Personalized Semiconductor Education using Extended Reality S. Salehi, P. Satam, E. Azimi, R. Straight, A. Salado, The University of Arizona, US |
| SemImmerse: Smart Immersive Training Ecosystem for Semiconductor Manufacturing E. Azimi, R. Lan, C. Wang, K. A. Knudson, T. Peterson, Z. Mutlu, University of Arizona, US |
| Surface Smoothing of Diamond by Atomic Layer Etching L. Stockl, R. Divan, N. Moldovan, S. Miller, L. Stan, A. Sumant, Rowan University, US |
| Designing a Sample Holder for Improved Instrument Sensitivity K. Lewis, D. Nimlos, S. Cushing, Pasadena City College, US |
| Locking the SUMO Switch: Utilization of De Novo Design and Molecular Dynamics Simulations to Create Novel Small Molecule Inhibitors of Rhes SUMOylation and Stability Analysis of Interacting Residues for Huntington's Disease B.N. Krishnan, North Creek High School, US |
| Synthesis of a novel hydrazone-based compound applied as a fluorescence turn-on chemosensor for iron (III) and a colorimetric sensor for copper (II) with antimicrobial, DFT and molecular docking studies. A. Adams, A.R. Sharmin, A.M. Patwary, E.G. William, K.M. Royhana, M.M. Mahmud, M.A. Haque, J. Uddin, and K. Morshin, Coppin State University, US |
| Wednesday June 19 |
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9:00 | XR for Semiconductor Workforce Development and Training | TBA |
| Session chair: Jared Ashcroft, Pasadena Community College, US |
9:00 | Co-designing Generative AI-powered Immersive Learning Experiences for Workforce Training R. Jha, C. Johnson, SimInsights Inc, US |
9:20 | Student Centered Undergraduate Research Experiences in Creating Virtual Digital Twin Cleanroom J. Ashcroft, I. Jha, A. Ashcroft, D. Kelley, J. Zhu, A. Rodriguez, A. Dong, F. Chen, K. Hong, G. Codina, Pasadena City College, US |
9:40 | How to overcome Reality's semiconductor self-identification, training and up-skilling challenges J. Spyres, Training All People, Inc (Tap3d), US |
10:00 | AR/VR Experiences - Demonstration of Providers
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