JUNE 19-21, 2023
WASHINGTON, DC

AI TechConnect
 

AI Innovations

AI Innovations

Call for Abstract - due March 31 »

Symposium Chair

Dalia YablonDalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

This symposium highlights developments in AI, machine learning, data analytics and robotics that will enable multiple application areas. These innovations will have broad impact - but they will revolutionize manufacturing, advanced materials, biomaterials, and drug design and development - the focus areas for this conference. Submit an abstract describing your contributions to this exciting field and plan to join us in Washington DC in June.

 

Call for Abstract - due March 31 »


Sponsor & Exhibitor Opportunities
 

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Sponsors & Partners
 
2022 SBIR/STTR AGENCY PARTNERS
SBIR/STTR Agency Partners