AI Innovations

Symposium Chair

Dalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

This symposium highlights developments in AI, machine learning, data analytics and robotics that will enable multiple application areas. These innovations will have broad impact - but they will revolutionize manufacturing, advanced materials, biomaterials, and drug design and development - the focus areas for this conference. Submit an abstract describing your contributions to this exciting field and plan to join us in Washington DC in June.

Call for Abstract - due March 31 »

Sponsor & Exhibitor Opportunities

Exhibit and Showcase

Become a Sponsor

Please contact: Denise Lee

Program Sectors