JUNE 19-21, 2023
WASHINGTON, DC

AI TechConnect
 

AI for Advanced Materials Design

Submit your Poster Only Abstract - due March 31

Please first review the information for authors — abstract submission guidelines.

Symposium Co-Chairs

Shruti VenkatramShruti Venkatram
Materials Data Scientist
3M

Jan-Willem HandgraafJan-Willem Handgraaf
Senior Technical Product Manager
Siemens Digital Industries Software

Key Speakers

Nick JacksonGenerative Models for Synthetically Accessible Polymers
Nick Jackson
Assistant Professor, UIUC

 
Topics & Application Areas
  • AI, Modeling & Simulation for Materials Design
  • Materials Informatics
  • Machine Learning
  • Autonomous Research Approaches
  • Quantitative Structure Property Relationship (QSAR) Methods
  • Data Science
  • Other
 

Sponsor & Exhibitor Opportunities
 

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Sponsors & Partners
 
2022 SBIR/STTR AGENCY PARTNERS
SBIR/STTR Agency Partners