Nanotech 2021

OCTOBER 18-20, 2021

Printed & Flexible Electronics

Printed and Flexible Electronics

Symposium Co-Chairs

Yiliang WuYiliang Wu
Principal Scientist, R&D Manager
TE Connectivity

Mandakini KanungoMandakini Kanungo
Senior Research Scientist, Corning, Inc.

Key Speakers

Edsger SmitsPrinted sensors for vital sign monitoring
Edsger Smits
Senior Researcher, Holst Centre, Netherlands

Michael ShurMulti segment TFT Compact Model for Prediction Advanced TFT Applications in 6G and 3D integration
Michael Shur
Patricia W. and C. Sheldon Roberts Professor of Solid State Electronics, Rensselaer Polytechnic Institute

Organics, Printed, and Flexible Electronics technologies will have a far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries, biomedical devices, and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event

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2021 Symposium Sessions

Monday October 18

10:30Printed & Flexible Electronics: Devices & Applications
1:30Printed & Flexible Electronics: Materials & Processes

Tuesday October 19

1:303D Printing

Wednesday October 20

8:30Advanced Manufacturing Track Keynote
1:303D Printing Design

2021 Symposium Program

Monday October 18

10:30Printed & Flexible Electronics: Devices & ApplicationsWoodrow Wilson C
Session chair: Mandakini Kanungo, Corning Inc.
10:30Advances in Multi-Layer Conductive Ink-Jet Printing on Textiles
A. Mills, North Carolina State University, US
10:55Multi segment TFT Compact Model for Prediction Advanced TFT Applications in 6G and 3D integration
M.S. Shur, X. Liu, T. Ytterdal, Rensselaer Polytechnic Institute, US
11:20Dissolvable Tattoo Electronics for Biomedicine
H. Cheng, J. Meeks, Penn State University, US
11:40Printable copper electronics for high-temperature
S. Ren, SUNY - Buffalo, US
12:00Bridging the competence gap: Flexible Hybrid Electronics
M. Dyson, R. Collins, IDTechEx, UK
1:30Printed & Flexible Electronics: Materials & ProcessesWoodrow Wilson C
Session chair: Mandakini Kanungo, Corning Inc.
1:30Stretchable Dielectric Substrate Manufacturing for Printed Electronics
S. Deshmukh, E. Keaney, C. Barry, J. Mead, University of Massachusetts Lowell, US
1:50Printed sensors for vital sign monitoring
E. Smits, Holst Centre, NL
2:15Effect of different surface energy theories on substrates used in printed electronics
B.N. Altay, M. Sta, P.D. Fleming, N.R. Demarquette, S.G. Cloutier, Rochester Institute of Technology, US
2:35Lightweight and flexible printed organic-inorganic hybrid thin film photovoltaics with large grains
R. Miller, University of Vermont, US
3:05Phase-change photolithography: Rapid diffraction limited patterning of organic electronic materials
Z.I. Bedolla-Valdez, Z. Su, G. Gonal, T.L. Murrey, C.C. Cendra-Guinassi, A. Salleo, C. Grigoropoulos, A.J. Moulé, University of California Davis, US

Tuesday October 19

1:303D PrintingCamellia 1
Session chair: Nanci Hardwick, MELD. Manufacturing
1:30Ask the Editor – a Q&A Session on Additive Manufacturing
P. Zelinski, Additive Manufacturing, US
1:55Multi- Material / Modality / Scale / Axis: Realizing Multi-Functional Products with Next-Generation Additive Manufacturing Processes
C. Williams, Virginia Polytechnic Institute and State University, US
2:20Hierarchical Deep Learning Neural Network (HiDeNN)-AI for process design and performance prediction of additive manufacturing systems
W.K. Liu, Y. Lu, S. Saha, Z. Gan, X. Xie, H. Lin, J. Cao, Northwestern University, US
2:45The Strength of 3D Printed Electronics
K. Church, nScrypt Inc., US
3:10Multi-Axis Additive Manufacturing for Topology and Toolpath Optimization of Composite Structures
J.R. Kubalak, C.B. Williams, Virginia Tech DREAMS Lab, US
3:30Bayesian Networks Connecting Processing and Product Features in Additive Manufacturing
A. Malmberg, K. Chandra, A. Peterson, J. Mead, University of Massachusetts Lowell, US
3:50AM-CFD: a well-validated thermal-fluid simulator for additive manufacturing part qualification
Z. Gan, K.K. Jones, Y. Lu, X. Xie, S. Saha, S. Mojumder, W.K. Liu, Northwestern University, US
4:10Considerations for making the world's largest metal printer
N. Hardwick, MELD Manufacturing, US

Wednesday October 20

8:30Advanced Manufacturing Track KeynoteBaltimore 1
Session chair: Joey Mead, University of Massachusetts
8:30Reshaping Manufacturing in the Post-Pandemic Era: Where Additive Manufacturing Is Now
P. Zelinski, Additive Manufacturing, US
9:00NSF Advanced Manufacturing Program and Research Opportunities
K. Cooper, National Science Foundation, US
9:30Sustainable and Scalable Manufacturing of Microelectronics Using Directed Assembly of Nanomaterials
A. Busnaina, Northeastern University, US
1:303D Printing DesignMagnolia 3
Session chair: Slade Gardner, Big Metal Additive & Nanci Hardwick, MELD Manufacturing
1:30Full Scale DoD Metal Prototype Vehicles by Hybrid AM
S. Gardner, Big Metal Additive, US
1:55Integrated process-structure-property modeling framework and methods for process design and performance prediction of additively manufactured material systems
W.K. Liu, Z. Gan, S. Saha, C. Yu, O.L. Kafka, K.K. Jones, Y. Lu, Northwestern University, US
2:20Post-Process Superfinishing of Additively Manufactured Components for Next-Gen Space Application, pp. 27-30
N. Michaud, A. Diaz, REM Surface Engineering, US
2:40Development of a Framework for Component Repair Using Additive Manufacturing
M. Walluk, A. Luccitti, B. Hilton, B. Baker, K. DePalma, K. Sisak, P. Martin, Rochester Institute of Technology, US

Topics & Application Areas

  • Organic Electronic Materials & Devices
  • Flexible/Stretchable Electronics Materials & Manufacturing
  • Printed Electronics Innovation & Applications
  • Flexible & Printed Sensors, Solar Cells, Battery, & Medical Devices
  • Novel Printing Technologies
  • Printed Electronics Packaging
  • Other

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2021 TechConnect Sponsors & Partners