TechConnect World 2019
Co-Located with Nanotech 2019 SBIR/STTR Spring Defense TechConnect
Nanotech 2019
 

Advanced Materials for Engineering Applications

Advanced Materials for Engineering Applications

Early Abstracts due: December 14 (10% registration discount for early submissions)

Symposium Chair

Brent M  SegalBrent M Segal
Director of Research Science and Chief Technologist
Lockheed Martin

 

The TechConnect World Advanced Engineering Materials symposium will feature materials that are ready for commercial application. We will also spotlight new research and development: innovative and disruptive technologies, materials, and approaches that could provide game-changing increases in performance in engineering applications. Please submit an abstract and plan to join innovators from industry, academic and government laboratories around the world at this important event.

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.

 

Topics & Application Areas

  • Advanced Engineering Materials
  • Next Generation Alloys & Ceramics
  • Polymer Composites
  • Advanced Materials from Bio Sources
  • Advanced Coatings Technologies
  • Soft Matter & Colloids
  • Modeling, Informatics & Machine Learning in Materials Design
  • Other
 
2018 Sponsors & Partners
2018 Sponsors & Partners