CondAlign’s technology can be adapted to produce a range of anisotropic conductive films (ACFs) with different material properties such as flexibility, stickiness and transparency. The technology uses an electric field to structure and align particles in a liquid polymer matrix. The matrix is then cured, locking the particles into their aligned positions resulting in an ACF. The particle type and amount impact the conductive properties of the film, for instance whether electrical or thermal conductivity is realized. The particle alignment enables a tenfold reduction of particle content compared to traditional conductive products. CondAlign has demonstrated production of films with a wide range of different parameters. It is demonstrated in roll-to-roll production, making the process scalable and cost effective. This enables CondAlign to develop materials from lab-scale to pilot production together with the customers. The process is material-independent, and one option is to make heat conductive films for use as thermal interface materials, enhancing heat transfer in electronic hardware. These films can have superior wettability, due to reduced particle loading, allowing the polymers to retain their initial properties. This results in efficient heat transfer away from crucial components, allowing further miniaturization, improving performance, reliability and lifetime of the hardware.
Primary Application Area: Materials, Chemical
Technology Development Status: Proven Manufacturability
Technology Readiness Level: TRL 5
Vetted Programs/Awards: 2016 & 2018 TechConnect Innovation Award
Organization Type: Mid-stage Startup (A or B)
Showcase Booth #: 18
GOVT/EXTERNAL FUNDING SOURCES
External Funding to Date: Since 2012, CondAlign has been funded by its majority owner, the Norwegian NIK III venture fund.