TechConnect World 2025 Program - Index of Affiliations

Affiliation	Day	Presenter(s)	Talk title
Federal University of Piaui	T4.463	A.O. Lobo	Cryo(bio)printing to produce scaffolds for hard tissue engineering
Federal University of Piauí	T4.466	F.R. Marciano	Advances in surface treatments for biomedical applications
FIPR Institute, Florida Poly	T4.346	P. Zhang, H. Liang, A. Medley, T. Levitskaia, R. R…	Improving the Economics of REE Recovery from Phosphogypsum by Generating High-Value Coproducts
Foi Group LLC	T2.662	D. Munson	EMP proof power system
Folia Materials Inc	M2.383	T.A. Dankovich, J.S. Levine	Novel paper-based packaging for food crisping applications in microwave heating
Fonon Technologies	M8.262	B. Lee	Bulk-To-Shape™ (BTS™) Transformational Technology
Fraunhofer IAP-CAN	M2.502	J. Niehaus	Novel Applications of Quantum Dots - The Next Wave of Innovative Products Powered by Quantum Effects