Innovation and commercialization Committees

Technical Program Co-Chairs

Founding Advisory Committee

Wolfgang Bacsa, University of Toulouse 
Lynn Foster, Z-Field Technologies LLC 
Lisa E. Friedersdorf, Office of Science and Technology Policy, The White House, US 
Srinivas Iyer, Los Alamos National Laboratory 

Alex Norman, Princeton University
Brent Segal, Lockheed Martin 
William (Cy) Wilson (retired), NASA Langley Research Center 
Xing Zhou, Nanyang Technological University, Singapore 

Organizing Committee

Babak Anasori, Purdue University, US
George Anthe, Sandia National Laboratories, US
Amir Asadi, Texas A&M, US
Nina Balke, North Carolina State University, US
Amay Banodkar, North Carolina State University, US
Crysten Blaby-Haas, Lawrence Berkeley National Laboratory, US
Pat Brant, ExxonMobil (retired), US
Robin Brigmon, Clemson University, US
Dave Calabro, ExxonMobil (retired), US
Kim Chaffin, Medtronic, US
Chih-Hao Chang, UT Austin, US
Sehoon Chang, Aramco Services Company, US
Marti Checa Nualart, Oak Ridge National Laboratory, US
Ravi Chilukuri, North Carolina State University, US
Babak Eslami, Widener University, US
Alison Fritz, National Energy Technology Laboratory, US
Christine Galib, Princeton University, US
Charles Geraci, NIOSH (Retired), US
Jon Greene, ITA International, US
Jan-Willem Handgraaf, Siemens Digital Industries Software, The Netherlands
Greg Haugstad, University of Minnesota, US
Matthew Hull, Virginia Tech, US
Santa Jansone-Popova, Oak Ridge National Laboratory, US
Jim Johnston, Victoria University of Wellington, New Zealand
Arun Kota, North Carolina State University, US
Xiaolin Li, Pacific Northwest National Laboratory, US
Susan Mackay, University of Maine, US

Noboyuki Matsuzawa, Panasonic, Japan
Will McNamara, Sandia National Laboratories, US
Jeffrey Moseley, University of California, Berkeley, US
Prakash Nallathamby, University of Notre Dame, US
Roger Narayan, North Carolina State University, US
Alex Norman, Princeton University, US
Kwang Oh, University at Buffalo (SUNY), US
Sehmus Ozden, Aramco Services Company, US
Andriy Palasyuk, Ames Laboratory, US
Zehra Parlak, Qatch Technologies, US
Jason Patrick, North Carolina State University, US
Zhe Qiang, University of Souther Mississippi, US
Carlos Quiroz, Sandia National Laboratories, US
Yuan Qiao Rao, The Dow Chemical Company, US
Richard Sheridan, Duke University, US
Maksim Shivokhin, ExxonMobil, US
Christopher Sims, National Institute of Standards and Technology, US
Steve Sopher, JSP, US
Erik Spoerke, Sandia National Laboratories, US
Roy Stillwell, NearWave, US
Anirudha Sumant, Argonne National Laboratory, US
Halil Tekinalp, Oak Ridge National Laboratory, US
He Ting, Edwards Lifesciences, United States
Abraham Vazquez-Guardado, North Carolina State University, US
Meng Wang, University of Pittsburgh, US
Michael Webb, Princeton University, US
Thaiesha Wright, University of California, Los Angeles, US
Dalia Yablon, SurfaceChar LLC, US
Helen Zha, Rensselaer Polytechnic Institute, US

Review Committee

Babak Anasori, Purdue University, US
George Anthe, Sandia National Laboratories, US
Amir Asadi, Texas A&M, US
Wolfgang Bacsa, University of Toulouse, France
Nina Balke, North Carolina State University, US
Amay Banodkar, North Carolina State University, US
Crysten Blaby-Haas, Lawrence Berkeley National Laboratory, US
Pat Brant, ExxonMobil (retired), US
Robin Brigmon, Clemson University, US
Dave Calabro, ExxonMobil (retired), US
Kim Chaffin, Medtronic, US
Chih-Hao Chang, UT Austin, US
Sehoon Chang, Aramco Services Company, US
Marti Checa Nualart, Oak Ridge National Laboratory, US
Ravi Chilukuri, North Carolina State University, US
Babak Eslami, Widener University, US
Alison Fritz, National Energy Technology Laboratory, US
Christine Galib, Princeton University, US
Charles Geraci, NIOSH (Retired), US
Shubhodeep Goswami, GE Global Research, US
Jon Greene, ITA International, US
Johannes Hachman, University at Buffalo, SUNY, US
Jan-Willem Handgraaf, Siemens Digital Industries Software, The Netherlands
Greg Haugstad, University of Minnesota, US
Ting He, Edwards Life Sciences, US
Andreas Hieke, Stanford University, US
Matthew Hull, Virginia Tech, US
Santa Jansone-Popova, Oak Ridge National Laboratory, US
Jim Johnston, Victoria University of Wellington, New Zealand
Alamgir Karim, University of Houston, US
Arun Kota, North Carolina State University, US
Matthew Laudon, TechConnect Division, ATI, US
Patrick Lee, University of Toronto, Canada
Yuhan Lee, Harvard Medical School, US
Xiaolin Li, Pacific Northwest National Laboratory, US
Qilin Li, Rice University, US

Susan Mackay, University of Maine, US
Noboyuki Matsuzawa, Panasonic, Japan
Will McNamara, Sandia National Laboratories, US
Moein Moghimi, Newcastle University, United Kingdom
Jeffrey Moseley, University of California, Berkeley, US
Prakash Nallathamby, University of Notre Dame, US
Roger Narayan, North Carolina State University, US
Alex Norman, Princeton University, US
Kwang Oh, University at Buffalo (SUNY), US
Sehmus Ozden, Aramco Services Company, US
Andriy Palasyuk, Ames Laboratory, US
Zehra Parlak, Qatch Technologies, US
Jason Patrick, North Carolina State University, US
Martin Poitzsch, Aramco Services Company (Retired), US
Zhe Qiang, University of Souther Mississippi, US
Carlos Quiroz, Sandia National Laboratories, US
Yuan Qiao Rao, The Dow Chemical Company, US
Bart Romanowicz, TechConnect Division, ATI, US
Robert Rudd, Lawrence Livermore National Laboratory, US
Neeraj Sharma, 3M Corporate Research Laboratory, US
Richard Sheridan, Duke University, US
Maksim Shivokhin, ExxonMobil, US
Christopher Sims, National Institute of Standards and Technology, US
Steve Sopher, JSP, US
Erik Spoerke, Sandia National Laboratories, US
Roy Stillwell, NearWave, US
Anirudha Sumant, Argonne National Laboratory, US
Halil Tekinalp, Oak Ridge National Laboratory, US
Abraham Vazquez-Guardado, North Carolina State University, US
Meng Wang, University of Pittsburgh, US
Michael Webb, Princeton University, US
William (Cy) Wilson, NASA Langley Research Center, US
Thaiesha Wright, University of California, Los Angeles, US
Dalia Yablon, SurfaceChar LLC, US
Helen Zha, Rensselaer Polytechnic Institute, US

JOIN A COMMITTEE

If you have interest in serving on a committee, please contact Jennifer Rocha jrocha@techconnect.org.