JUNE 13-15, 2022
WASHINGTON, DC
VIEW PROGRAM BY SECTOR
KEY SPEAKERS INCLUDE
Scott Broderick University at Buffalo - SUNY
Richard Ross 3M Company
Corinne Lipscomb 3M
Jan-Willem Handgraaf Siemens Digital Industries Software
Stefan Jaeger NLM/NIH
Alex Belianinov Sandia National Laboratories
Dalia Yablon TechConnect World Innovation Conference
Ranjani Theregowda Material Innovation Initiative
Sean Ireland Fiberlean Technologies Ltd.
World L-S Nieh U.S. Forest Service
Andy Baumann U.S. Food and Drug Administration
Jeannine Coburn Worcester Polytechnic Institute
Ilana Goldberg NIH/NIBIB
Vince Beachley Rowan University
Eric Gale Harvard Medical School
Prakash Nallathamby Notre Dame University
Marina Dobrovolskaia NIH
Thomas Anchordoquy University of Colorado
Puneet Tyagi AstraZeneca
Steve Zullo National Institute of Biomedical Imaging and Bioengineering
Gozde Durmus Stanford University
Ebrahim Mostafavi Stanford University
David Medina Cruz Syncell
Anderson Lobo Universidades Federal do Piaui
Nicole Bassous Harvard University
Thomas Webster Interstellar Therapeutics
Christopher Sims National Institute of Standards and Technology
Ronald Coutu Marquette University
William "Cy" Wilson NASA Langley Research Center
Lydia Sohn University of California, Berkeley
Marina Leite University of California, Davis
Loucas Tsakalakos L3Harris Technologies, Inc.
Mandakini Kanungo Corning, Inc.
Yiliang Wu TE Connectivity
Michelle Lampa M2 Lasers
Alexey Gorshkov Joint Quantum Institute
Sella Brosh NVision Imaging
Piotr Kulczakowicz Quantum Startup Foundry
Loucas Tsakalakos L3Harris Technologies, Inc.
Kambiz Safinya Visuray
Yuhan Lee Harvard Medical School
Xin Zhang Boston University
Martin Poitzsch Aramco Services Company
Imre Gyuk U.S. Department of Energy
Erik Spoerke Sandia National Laboratories
Bryan Pivovar National Renewable Energy Laboratory
Debbie Myers Argonne National Laboratory
Nagappan Ramaswamy General Motors Corporation
John Kopasz Argonne National Laboratory
Kyle Sword NSG Pilkington
Bjørn Petter Jelle NTNU
Bohumil Kasal Fraunhofer Institute of Wood Research
Harjit Singh Brunel University London
Jan Kosny University of Massachusetts, Lowell
Robert Ryan Twining, Inc.
Srikanth Pilla Clemson University
Patrick Lee University of Toronto
Matt Kweon ExxonMobil
Joamin Gonzalez-Gutierrez Luxembourg Institute of Science and Technology (LIST)
Maksim Shivokhin ExxonMobil
Samiel Amin Manhattan College
Johann Pluyter Pluyter Consulting, LLC
Yuanqiao Rao The Dow Chemical Company
Mandakini Kanungo Corning, Inc.
Yiliang Wu TE Connectivity
Jason Killgore NIST
Slade Gardner Big Metal Additive, Inc.
Nanci Hardwick MELD Manufacturing Corporation
Prakash Balan National Science Foundation
Joey Mead University of Massachusetts, Lowell
Chris Menzel Fujifilm Dimatix, Inc.
Kwang Oh University at Buffalo (SUNY)
Samuel Sia Columbia University
Thomas Cubaud Stony Brook University
Gregory Cooksey National Institute of Standards and Technology
Sam Stavis National Institute of Standards and Technology
Mark Swihart University at Buffalo, SUNY
Jon Veinot University of Alberta
Jim Johnston Victoria University of Wellington
Wolfgang Bacsa University of Toulouse
Jingsong Huang Oak Ridge National Laboratory
Huaping Li Atom Inc.
Craig Green Carbice
Karen Winey University of Pennsylvania
Kenan Song Arizona State University
Xindi Yu The Dow Chemical Company
Kun Fu University of Delaware
Liangbing Hu University of Maryland
Dhimiter Bello University of Massachusetts, Lowell
Philip Demokritou Harvard School of Public Health
Deep Jariwala University of Pennsylvania
Elena Polyakova Graphene Laboratories, Inc.
Anirudha Sumant Argonne National Laboratory
Arzu Colak clarkson university
Bede Pittenger Bruker Nano
Jason Killgore NIST
Liang Gong 3M Company
Greg Haugstad University of Minnesota
Alex Norman Modern Meadow
Dalia Yablon TechConnect World Innovation Conference
Chris Sims National Institute of Standards and Technology
Igor Sokolov Tufts University
Mauro Sardela Universitiy of Illinois at Urbana Champaign
Jerry Hunter University of Wisconsin-Madison
Babak Eslami Widener
Valeriy Ginzburg VVG Physics Consulting
Jan-Willem Handgraaf Siemens Digital Industries Software
Richard Ross 3M Company
$3.5B
Tech Funding
250
Exhibitors
1000
Prospectors
2000
Innovators
2500
1-on-1 Meetings
"TechConnect World is an excellent opportunity to meet all key innovation players and stakeholders all in one place — at the premier innovation commercialization and networking event in the US.
BASF
"TechConnect is unique in specifically bringing together the creators of breakthrough technologies with corporations who can help commercialize, adopt, buy, re-sell and invest in those technologies"
Atrium Capital
"We come back to TechConnect World because they provide us the opportunity to meet top innovators across many technology areas all in one location."
Lockheed Martin
2022 SBIR/STTR AGENCY PARTNERS
Produced by: 