TechConnect World 2019
 

Printed & Flexible Electronics

Printed and Flexible Electronics

Early Abstracts due: December 14 (10% registration discount for early submissions)

Symposium Co-Chairs

Yiliang WuYiliang Wu
Principal Scientist
TE Connectivity

Mandakini KanungoMandakini Kanungo
Senior Research Scientist
Corning, Inc.

Key Speakers

YuHuang WangTube2: A Tube-in-a-Tube Architecture for Flexible Electronics
YuHuang Wang
Professor, Department of Chemistry and Biochemistry, University of Maryland

 

Organics, Printed, and Flexible Electronics technologies will have a far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries, biomedical devices, and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.

 

Topics & Application Areas

  • Organic Electronic Materials & Devices
  • Flexible Electronics Materials & Manufacturing
  • Printed Electronics Innovation & Applications
  • Flexible & Printed Sensors, Solar Cells, Battery, & Medical Devices
  • Novel Printing Technologies
  • Printed Electronics Packaging
  • Other
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