TechConnect World 2019
 

Printed & Flexible Electronics

Printed and Flexible Electronics

Submit Abstract - due May 10 »

Symposium Co-Chairs

Yiliang WuYiliang Wu
Principal Scientist
TE Connectivity

Mandakini KanungoMandakini Kanungo
Senior Research Scientist
Corning, Inc.

Key Speakers

YuHuang WangChallenges and Opportunities for Carbon Semiconductors-based Flexible Electronics
YuHuang Wang
Professor, Department of Chemistry and Biochemistry, University of Maryland

Larry JudovitsElectroactive Fluoropolymers for Printed Electronics
Larry Judovits
Principal Scientist, Arkema

Daniel SlepAdvanced processes in printed electronics and dielectric templating
Daniel Slep
Chief Technology Officer, ChemCubed

Denis CormierLow Cost Highly Conductive Printed Electronics Via Jetting of Molten Metal Droplets
Denis Cormier
Professor, Director of the Functional Printing Center, Rochester Institute of Technology

 

Symposium Sessions

Tuesday June 18

1:30Materials for Printed & Flexible Electronics
4:00Printed & Flexible Electronics: Posters

Wednesday June 19

10:30Printed & Flexible Electronics I
1:30Printed & Flexible Electronics II

Symposium Program

Tuesday June 18

1:30Materials for Printed & Flexible Electronics
Electroactive Fluoropolymers for Printed Electronics
L. Judovits, Arkema, Inc., US
Challenges and Opportunities for Carbon Semiconductors-based Flexible Electronics
Y.H. Wang, University of Maryland, US
A New Category of Transparent Conductive Films: Printed Carbon Nanotube Hybrids
D.J. Arthur, R. Prada Silvy, CHASM Advanced Materials, Inc., US
Barium strontium titanate nanocomposite dielectric inks with variable dielectric constants for printed electronics
O. Ranasingha, M. Haghzadeh, C. Armiento, A. Akyurtlu, University of Massachusetts – Lowell, US
High Electrical Conductivity, Facile Sintered, Copper Nano Particle Inks for Flexible Electronics and Additive Manufacture
K. Reed, Zero Valent Nano Metals, Inc, US
Silver Nanowire Transparent Conductive Films for Flexible Devices
H. Dai, M. Spaid, cambrios advanced materials, US
The Use of Thin Films of Boron Nitride Nanotubes in Printable Electronics
C. Paquet, Y. Martinez-Rubi, M. Genest, J. Guan, B. Simard, P.R.L. Malenfanta, National Research Council of Canada, CA
4:00Printed & Flexible Electronics: Posters
Highly Sensitive and Direction-Selective Strain Sensor with Carbon Nanotube Asterisk Structure
H. Lee, HANBAT NATIONAL UNIVERSITY, KR
Development of Organic Photovoltaic cells using meniscus solution shearing coating technology
H. Lee, K.T. Ampofo, D.S. Kim, Hanbat University, KR
Solvent-free Printing of Organic Semiconductor, Insulator, Metal, and Conductor Particles on Flexible Substrates
M. Sakai, Chiba University, JP
Flexible, Dopant Free a­Si:H Solar Cell
E. Ore, G. Amaratunga, University of Cambridge, UK
Flexographic Printing Process of Flexible Dielectric Substrate Based on a Highly Filled Thermoplastic Polymer for Printed Electronics
S. Deshmukh, S. Burbine, S. Banerjee, E. Keaney, E. Hajisaeid, A. Akyurtlu, C. Peters, M. Herndon, D. Rockosi, C. Lepont, C. Barry, J. Mead, University of Massachusetts Lowell, US
Efficient formation of single-particle thick microstructures by direct writing
Z. Rozynek, A. Magdziarz, CADENAS, PL
Formation of printable granular and colloidal chains through capillary effects and dielectrophoresis
Z. Rozynek, M. Han, F. Dutka, P. Garstecki, A. Józefczak, E. Lujten, Adam Mickiewicz University, PL

Wednesday June 19

10:30Printed & Flexible Electronics I
Wearable IoT Devices for Health Monitoring
G. Bhat, Y. Tuncel, S. An, U.Y. Ogras, Arizona State University, US
Resistive Pressure Sensor with Carbon Nanotube Electrodes towards Flexible Electronics Applications
A. Palumbo, R. Zhang, K. Yan, S. Chen, G. Hader, J. Chang, E.H. Yang, Stevens Institute of Technology, US
Ribbon Ceramic, Novel Form Factor Enabling Thermal Product Applications
J. Olenick, ENrG Incorporated, US
Self-Healable, Stretchable and Form Conforming Electrically Driven Light Sources
B.C.K. Tee, Y.J. Tan, National University of Singapore, SG
Processing and field-assisted assembly of colloidal conjugated polymers for flexible electronics
M.J. Sobkowicz, H. Pan, A. Yazdani, B.M. Budhlall, University of Massachusetts Lowell, US
1:30Printed & Flexible Electronics II
Low Cost Highly Conductive Printed Electronics Via Jetting of Molten Metal Droplets
D. Cormier, Rochester Institute of Technology, US
Digital Inkjet Printing of Electronic Circuity
D. Slep, ChemCubed, US
Preparation and Characterization of Flexible Polymeric Substrates for Printed Electronics
S. Burbine, S. Deshmukh, S.S. Banerjee, E. Keaney, C. Peters, M. Herndon, D. Rockosi, C. Lepont, C. Barry, J. Mead, Department of Plastics Engineering, University of Massachusetts, Lowell, US
One-step Inkjet Printing and Embedding Silver Nanowires for Stretchable Conductors
Q. Huang, K.N. Al-Milaji, Z. Li, H. Zhao, Virginia Commonwealth University, US
Chemical-Free Metal PDMS Thermal Bonding in Flexible Bio-Potential Electrode Fabrication
D. Koh, A. Wang, K.W. Oh, University at Buffalo, US
Low Cost Spray-coated Perovskite Solar Cells
L.I. Li, R. Ahmed, V. Suresh, R. Gopalakrishnan, University of Memphis, US

Organics, Printed, and Flexible Electronics technologies will have a far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries, biomedical devices, and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event

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Please first review the information for authors — abstract submission guidelines.

 

Topics & Application Areas

  • Organic Electronic Materials & Devices
  • Flexible Electronics Materials & Manufacturing
  • Printed Electronics Innovation & Applications
  • Flexible & Printed Sensors, Solar Cells, Battery, & Medical Devices
  • Novel Printing Technologies
  • Printed Electronics Packaging
  • Other
2019 Sponsors & Partners
 

SBIR/STTR Agency Partners:

SBIR/STTR Agency Partners