TechConnect World 2019
 

Materials Characterization & Imaging

Nanoscale Materials Characterization

Early Abstracts due: December 14 (10% registration discount for early submissions)

Symposium Co-Chairs

Greg  HaugstadGreg Haugstad
Technical Staff Member & Director, Characterization Facility (CharFac)
University of Minnesota

Dalia YablonDalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

Pierre PaninePierre Panine
Senior Scientist
Xenocs SA, France

Key Speakers

Igor SokolovNovel Multidimensional Imaging of Surfaces with Atomic Force Microscopy.
Igor Sokolov
Professor, Tufts University

Alex NormanAlex Norman
Senior Scientific Associate
Ingredion Incorporated

Alan SchwartzmanAlan Schwartzman
Research Scientist
Massachusetts Institute of Technology

Keith BrownKeith Brown
Assistant Professor
Boston University

Scott BartonScott Barton
Xenocs, France

Dalia YablonDalia Yablon
Technical Program Chair
TechConnect World Innovation Conference

 

This year's symposium will focus on application of nanoscale characterization to a variety of industries. This emphasis includes both areas of new method development as well as industry-specific application where characterization has led to deeper understanding and/or innovation in processes and fundamental sciences.

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.

 

Topics & Application Areas

  • Characterization & Imaging for Health Care/Biomedical Materials
  • Characterization & Imaging for Food Materials
  • Characterization & Imaging for Photonic Materials & Devices
  • Characterization & Imaging for Pharmaceutical Materials
  • Materials Characterization & Imaging for Energy & Sustainability
  • Materials Characterization & Imaging for Lubricity/Friction Reduction
  • Special Methods Session: Multimodal Scanning Probe Microscopy
  • Innovations in Nanomaterials Characterization
  • Other
2018 Sponsors & Partners