TechConnect World 2019
 

Materials Modeling, Informatics & Machine Learning

Informatics, Modeling, and Simulation

Poster/Paper Abstracts due: March 8

Symposium Co-Chairs

Rick RossRick Ross
Senior Research Chemist
3M Company

Peter KoenigPeter Koenig
Group Head
Procter & Gamble

Key Speakers

Newell WashburnLearning from Small Data: Optimization of Complex Material Systems with Hierarchical Machine Learning
Newell Washburn
Associate Professor, Carnegie Mellon University; President, Ansatz AI

Chi ChenGraph Networks as a Universal Machine Learning Framework for Molecules and Crystals
Chi Chen
Postdoctoral Researcher, University of California, San Diego

Huan TranPolymer Genome: An Informatics Platform for Rational Polymer Design
Huan Tran
Research Scientist, Georgia Institute of Technology

 

The Informatics, Modeling and Simulation symposium provides a comprehensive forum for the multidisciplinary materials design, modeling, simulation, and informatics communities. You are invited to submit on topics ranging from applications-focused theoretical developments to industry applications and case studies.

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.

 

Topics & Application Areas

  • Modeling, Informatics & Machine Learning in Materials Design
  • Multiscale Modeling of Advanced Materials
  • Molecular Modeling
  • Novel Modeling Methods & Theory
  • Modeling & Simulation of Polymer Nanostructures
  • Modeling Catalytic Surfaces & Reactions
  • Modeling & Simulation of Microsystems
  • MEMS & Circuit Modeling
  • Other
2019 Sponsors & Partners
 

SBIR/STTR Agency Partners:

SBIR/STTR Agency Partners