TechConnect World 2026 Program - Index of Affiliations

Affiliation	Day	Presenter(s)	Talk title
Metacept, Inc.	W3.641	D. Smith	Company
MicroFAST Dx	T1.160	J. Zhou	MicroFAST Dx
MicroFAST Dx	Th1.362	M. Sun, H. Feng, J. Zhiguo Zhou	RapiSep: A Plasma Separator Enabling Rapid and Decentralized Blood Processing and Diagnostics
Miller Scientific Inc.	W3.148	S. D. Miller	Advanced Thermal Insulation via Engineered Ceramic and Carbon Fiber Compositions
Minerals Technologies, Inc	Th1.226	M.S. Donovan, R. Dickman	Novel Surface Modified Clay for PFAS Remediation in Groundwater
MIT	T1.022	W. Oliver	Quantum Computing 101: Foundations, Frontiers, and Future Impact
MIT	T2.491	W. Oliver	Modular Quantum Interconnects
MIT Lincoln Laboratory	W6.202	E. Doran, L. Cantley	Advanced Textile Systems from the Defense Fabric Discovery Center
Morgan State University	T3.243	B. Ozturk	NV-Diamond Based Brain Imaging and Compact Quantum Magnetometers
Motive Labs	T6.228	M. Roser, M. Becker, N. Rokhmanova	FlyBand Propulsion Performance ExoBoot: An Unpowered Exotendon-Integrated Combat Boot Platform Deliv…
Mussel Polymers, Inc.	W2.283	E. Anderson, J. Stieg, R. MacQueen, C. Crane	Wet-Applicable Coatings for Marine Protection: Leveraging Mussel-Inspired Polymers