Sample preparation tools using novel scribing and cleaving technology
LatticeGear was founded on the premise that preparation of wafer and other substrates for further processing or inspection should be fast, clean and affordable. The LatticeAx, FlipScribe and FlexScribe, each with their unique features, full fill these objectives by scribing, indenting and/or cleaving. The dry mechanical processes eliminate the need for lubricants (water and oil), heat (lasers) that can often damage delicate materials, films and devices and are used by other sample preparation technologies. The patented LatticeAx mechanizes and systemizes the most common, basic manual scribe and cleave process practiced daily in laboratories using fingers and handheld tools. To cleave a sample, a weak point must first be created, typically by scribing and more uniquely by indenting, which is what the LatticeAx does, then the sample is cleaved by creating stress on the weak point. The device integrates indenting and cleaving into one tool and includes a platform for supporting a substrate, novel diamond indenter and cleaving mechanism. The patented FlipScribe uniquely scribes the backside of the sample, keeping the front side clean and damage free. The fast, clean, dry, accurate and repeatable process has transformed sample preparation in laboratories and fabs from a roadblock to a non-issue.