TechConnect World 2019
 

Abstract Submissions:

Submissions for the 2019 TechConnect World Innovation Conference, and for the following TechConnect Briefs volumes, will open on October 15th, 2018.

  • Informatics, Electronics and Microsystems: TechConnect Briefs 2019
  • Biotech, Biomaterials and Biomedical: TechConnect Briefs 2019
  • Materials for Energy, Efficiency and Sustainability: TechConnect Briefs 2019
  • Advanced Materials: TechConnect Briefs 2019
 
2018 Sponsors & Partners
2018 Sponsors & Partners