TechConnect World 2026 Program - Index of Affiliations

Affiliation	Day	Presenter(s)	Talk title
Brint Tech Corp	T2.576	K. Andersen	Brint Tech Corp.
Brookhaven National Laboratory	W2.221	C.-Y. Nam	Overcoming Challenges in Atomic Layer Deposition of Dielectric Films on 2D van der Waals Materials
Bruker	T4.483	B. Pittenger	Panelist
Bruker Corporation	W4.073	C. Phillips	Panelist
Bruker Corporation	W3.344	B. Pittenger, M. Ye, P. De Wolf	High-resolution imaging of Van der Waals materials with Torsional Resonance Dynamic Friction Microsc…
Bruker Nano	T2.464	C. Phillips, Q. Hu, C. Li, M. Wagner, P. De Wolf	A versatile Peak Force IR variation for correlative nanoscale chemical and mechanical AFM-IR
BryceTech	W2.771	J. David	Review Panelist
Bull City Venture Partners	T4.472	C. Lyerly Connell	Panelist