Fluidic circuits as a kinetic system for modulation of multiple hot spots as a thermally functional reactor

M.E. Alston, R. Barber
University of Nottingham,
United Kingdom

Keywords: thermal stress, Re scales, kinetic mixing, cooling power


The challenge in material science is our ability to evaluate heat flow within a material and monitor temperature with time. This research studies fluidic geometry as a reactor device aligned to elevated temperatures for enhanced cooling to specific multiple hot spot regions. To manage thermal stresses within a material by active management. Determined by modulating volumetric fluidic flows using configured circuits to multiple hot spot loading transfer. To regulate conductance point load characterised through fluxes in studying the effects on heat transport within an aluminium miniature device. Defined by a kinetic mixing strategy of unified heat dissipation within capillary hierarchical structures for real time response to conduct heat away from multiple heat sources as a function of Re regime scales. The characteristic aspect of the approach is to induce the mixing reaction rate as a turbulent kinetic system to fold the flow, re-direct the flow, stretch the flow and combine streams to disperse and dissipate thermal flow. The temperature dependence of the device is defined using; circuit channel geometry, fluidic thermal capture, and precise hydrodynamic control for increased cooling power in monitoring temperature heat loss to time through flow generation.