Multi3D fabricates a filled conductive polymeric (FCP) filament that can be 3D printed using low-cost FDM printers for proof-of-concept or low-volume functional electronics or leverage injection molding for high-volume manufacturing.
Primary Application Area: Materials & Manufacturing
Technology Development Status: Commercial Product
Technology Readiness Level: TRL 5
Organization Type: Small to Medium Enterprise
GOVT/EXTERNAL FUNDING SOURCES