TechConnect World 2020
Co-Located with Nanotech 2020Co-Located with Nanotech 2020 SBIR/STTRSBIR/STTR AI TechConnectAI TechConnect
 

Printed & Flexible Electronics

Printed and Flexible Electronics

Symposium Co-Chairs

Yiliang WuYiliang Wu
Principal Scientist, R&D Manager
TE Connectivity

Mandakini KanungoGlass Light Guide Plate with Lenticular and Lenticular Extraction Features
Mandakini Kanungo
Senior Research Scientist, Corning, Inc.

Key Speakers

Tse Nga (Tina) NgFlexible Organic Sensors for Biomechanical Measurements
Tse Nga (Tina) Ng
Associate Professor, University of California San Diego

Sean GarnerFlexible Glass Applications & Process Scaling
Sean Garner
Senior Research Associate, Corning Inc.

Ananth DodabalapurThin-Film Transistors and the Flexible Electronics
Ananth Dodabalapur
Motorola Regents Chair Professor, Electrical and Computer Engineering, The University of Texas at Austin

Edsger SmitsEdsger Smits
Senior Researcher
Holst Centre, Netherlands

Khershed P. CooperMaterials and Manufacturing Challenges in Flexible Hybrid Electronics
Khershed P. Cooper
Program Director, Advanced Manufacturing Program, National Science Foundation

Organics, Printed, and Flexible Electronics technologies will have a far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries, biomedical devices, and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event

 
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Symposium Sessions

Monday June 29

10:30Printed & Flexible Electronics
1:30Printed & Flexible Electronics

Tuesday June 30

4:00Printed Flexible Electronics - Posters

Symposium Program

Monday June 29

10:30Printed & Flexible Electronics
Session chair: Mandakini Kanungo, Corning, Inc., US; Yiliang Wu, TE Connectivity, US
Thin-Film Transistors and the Flexible Electronics
A. Dodabalapur, The University of Texas at Austin, US
Flexible Organic Sensors for Biomechanical Measurements
T.N. Ng, University of California, San Diego, US
Printed sensors for vital sign monitoring
E. Smits, Holst Centre / TNO, NL
Printed Electronics and Sensors for challenging applications
S. Mukhopadhyay, Obsidian Advanced Manufacturing, US
The effect of different calculation methods on surface free energy of substrates used in printed electronics and the solution based on the laws of thermodynamics
B.N. Altay, P.D. Fleming, M. Bolduc, S.G. Cloutier, Western Michigan University, US
1:30Printed & Flexible Electronics
Session chair: Yiliang Wu, TE. Connectivity, US, Mandakini Kanungo, Corning, Inc., US
Materials and Manufacturing Challenges in Flexible Hybrid Electronics
K. Cooper, National Science Foundation, US
Flexible Glass Applications & Process Scaling
S. Garner, Corning, Inc., US
Bridging the competence gap: Flexible Hybrid Electronics
M. Dyson, K. Ghaffarzadeh, IDTechEx, UK
Redefining the make and use of Anisotropic Conductive Films for hybrid and flexible electronics.
L. Morten, CondAlign AS, NO
Conformal Printed High Temperature Electronics
S. Ren, University at Buffalo SUNY, US
Phase-change photolithography: Rapid diffraction limited patterning of organic electronic materials
Z.I. Bedolla-Valdez, Z. Su, G. Gonal, T.L. Murrey, C.C. Cendra-Guinassi, A. Salleo, C. Grigoropoulos, A.J. Moulé, University of California, Davis, US

Tuesday June 30

4:00Printed Flexible Electronics - Posters
Roll Printed and Roll Imprinted Flexible Transparent Conductive Films
J. Jo, K-Y Kim, Y-S Jang, P.W. Park, Korea Institute of Machinery and Materials(KIMM), KR
Development of precise tension and force control technology for 1200mm wide roll-to-roll nanoimprint system
K-Y Kim, S. Kwon, Y. Jang, J. Jo, Y-M Choi, S-H Lee, Korea Institute of Machinery & Materials, KR
Powerless Flexible Silicon Carbide Nanowire-Nanowire Junction Ultraviolet Photodetector via Direct Transfer Method
M.S. Onder, K. Teker, Istanbul Sehir University, TR
Stretchable Dielectric Substrate Manufacturing for Printed Electronics
S. Deshmukh, E. Keaney, C. Barry, J. Mead, University of Massachusetts Lowell, US
Large-scale uniform inkjet-printed perovskite solar cells
W.J. Jeong, G. Oh, B.M. Weon, Sungkyunkwan University, KR
Organic light emitting diodes on flexible substrates as food-sensors
M. Vasilopoulou, Institute of Nanoscience and Nanotechnology, National Center for Scientific Research DEMOKRITOS, GR
Manufacturing Method of Repeatedly Attachable Sticker-type Flexible Energy Storage Devices for Wearable Electronics
H. Yoon, Korea Institute of Energy Research, KR
2020 Sponsors & Partners
 

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