TechConnect World 2020
Co-Located with Nanotech 2020 SBIR/STTR Spring AI TechConnect
 

Electronics & Microsystems

Join industry partners and applied research leadership accelerating the development and deployment of advanced electronics solutions into products and society.

Call for Abstracts

Applied Research - due Dec 13

Call for Innovations

IP/Startup/SBIR - due Dec 13


2020 Feature Speakers:

Yiliang Wu Yiliang Wu
TE Connectivity, US

Tse Nga (Tina) Ng Tse Nga (Tina) Ng
UCSD, US

Payel DasPayel Das
IBM, US

Kwang W. OhKwang W. Oh
University at Buffalo (SUNY), US

Bob WesterveltBob Westervelt
Harvard University, US

William (Cy) Wilson William (Cy) Wilson
NASA, US

Christopher HarrisonChristopher Harrison
Schlumberger, US

William L. WilsonWilliam L. Wilson
Harvard University, US

Mandakini Kanungo Mandakini Kanungo
Corning, Inc., US

Ronald A. CoutuRonald A. Coutu
Marquette University, US

Axel SchererAxel Scherer
Caltech, US

Ioannis (Yanni) Karampelas Ioannis (Yanni) Karampelas
FLOW-3D, US

Soojung Claire HurSoojung Claire Hur
Johns Hopkins University, US

Sarah TaoSarah Tao
Sanofi, US

Jeffrey ChalmersJeffrey Chalmers
The Ohio State University

Lou DadockLou Dadock
FUJIFILM Dimatix, Inc.



2500
S&T Speakers

250
Exhibitors

1000
Prospectors

2000
Innovators

2500
1-on-1 Meetings


2020 Key Speakers Include:

  • Anson W. K. Ma, University of Connecticut, US
  • Axel Scherer, Caltech, USĀ 
  • Bob Westervelt, Harvard University, US
  • Chris Menzel, Fujifilm Dimatix, Inc., US
  • Christopher Harrison, Schlumberger, US
  • Ioannis (Yanni) Karampelas, FLOW-3D, US
  • Jeffrey Chalmers, The Ohio State University, US
  • Kai Liu, Georgetown University, US
  • Kwang W. Oh, University at Buffalo (SUNY), US
  • Lou Dadock, FUJIFILM Dimatix, Inc.
  • Mandakini Kanungo, Corning, Inc., US
  • Payel Das, IBM, US
  • Ronald A. Coutu, Marquette University, US
  • Sarah Tao, Sanofi, US
  • Soojung Claire Hur, Johns Hopkins University, US
  • Tse Nga (Tina) Ng, UCSD, US
  • William (Cy) Wilson, NASA, US
  • William L. Wilson, Harvard University, US
  • Yiliang Wu, TE Connectivity, US
2019 Sponsors & Partners
 

2019 SBIR/STTR Agency Partners:

SBIR/STTR Agency Partners