TechConnect World 2020
Co-Located with Nanotech 2020Co-Located with Nanotech 2020 SBIR/STTRSBIR/STTR AI TechConnectAI TechConnect
 

Advanced Materials

Join industry partners and applied research leadership accelerating the development and deployment of new material solutions into products and society.

Call for Poster Abstracts

Applied Research - due March 20

Call for Innovations

IP/Startup/SBIR - due Feb. 28


2020 Speakers & Chairs Include:

Loucas TsakalakosLoucas Tsakalakos
GE Global Research, US



Christopher Sims Christopher Sims
National Institute of Standards and Technology (NIST)



Helen Lentzakis Helen Lentzakis
Kruger Biomaterials Inc., US


Peter Bishop Peter Bishop
Johnson Matthey, UK



Samuel M. Stavis Samuel M. Stavis
NIST, US



Jim JohnstonJim Johnston
Victoria University of Wellington, NZ



Brent M Segal Brent M Segal
Lockheed Martin, US



Xindi YuXindi Yu
The Dow Chemical Company, US

Namiko YamamotoNamiko Yamamoto
Penn State University, US


Sanat K. Kumar Sanat K. Kumar
Columbia University, US


Christine E. Duval Christine E. Duval
Case Western Reserve University



Joamin Gonzalez-Gutierrez Joamin Gonzalez-Gutierrez
University of Leoben, Austria



Steven R. SopherSteven R. Sopher
JSP, US



YuanQiao RaoYuanQiao Rao
The Dow Chemical Company, US



Lou DadockLou Dadock
FUJIFILM Dimatix, Inc.


Robert Ryan,Robert Ryan,
Twining, Inc., US



Wendel Wohlleben Wendel Wohlleben
BASF SE, Germany



Jan-Steffen Niehaus Jan-Steffen Niehaus
Fraunhofer-Center for Applied Nanotechnology, Germany



Maksim ShivokhinMaksim Shivokhin
ExxonMobil


Ayse AsatekinWilliam L. Wilson
Harvard University, US




2500
S&T Speakers

250
Exhibitors

1000
Prospectors

2000
Innovators

2500
1-on-1 Meetings


2020 Speakers & Chairs Include:

  • Nicolas J. Alvarez, Drexel University
  • Wolfgang S. Bacsa, University of Toulouse, FR
  • Vikas Berry, University of Illinois at Chicago, US
  • Peter Bishop, Johnson Matthey, UK
  • Patrick Brant, Consultant, US
  • Vincent Bulone, University of Adelaide, Australia
  • Ishita Chakraborty, Stress Engineering Services, US
  • Jeannine M. Coburn, Worcester Polytechnic Institute, US
  • Lou Dadock, FUJIFILM Dimatix, Inc.
  • Phil Demokritou, Harvard School of Public Health, US
  • Tomasz Durakiewicz, US National Science Foundation
  • Christine E. Duval, Case Western Reserve University
  • Anne Fischer, DARPA, US
  • Aaron D. Franklin, Duke University, US
  • Susan Fullerton, University of Pittsburgh, US
  • Slade H Gardner, Big Metal Additive, Inc. US
  • Sean Garner, Corning
  • Geoffrey M. Geise, University of Virginia, US
  • Hossein Ghezel-ayagh, FuelCell Energy, Inc.
  • Aaron Gilad Kusne, NIST
  • Adam Goff, Luna Innovations, US
  • Yury Gogotsi, Drexel University, US
  • Bill Goldner, USDA Office of the Chief Scientist, US
  • Joamin Gonzalez-Gutierrez, University of Leoben, Austria
  • Pankaj Gupta, The Dow Chemical Company, US
  • Greg Haugstad, University of Minnesota, US
  • Donny Hanjaya-Putra, University of Notre Dame, US
  • Nanci Hardwick, MELD Manufacturing Corporation, US
  • Jingsong Huang, Oak Ridge National Laboratory, US
  • Sean Ireland, Fiberlean Technologies, US
  •  Michael Jakubinek, National Research Council Canada
  • Steven Jons, Dupont, US
  • Jim Johnston, Victoria University of Wellington, NZ
  • Mandakini Kanungo, Corning, Inc., US
  • Trevor Keel, Silver Institute, US
  • Peter Koenig, Procter & Gamble, US
  • Jan Kośny, UMass Lowell, US
  • Amishi Kumar, Program Manager, U.S. Department of Energy
  • Sanat K. Kumar, Columbia University, US
  • Thomas Alan Kwan, Unilever, US
  • Kock-Yee Law, Research and Innovative Solutions, US
  • Patrick Lee, University of Toronto, Canad
  • Helen Lentzakis, Kruger Biomaterials Inc., US
  • Thomas Li, NXP Semiconductor 
  • Corinne Lipscomb, 3M, US
  • Ying Liu, Cardiff University, UK
  • C. Rebecca Locker, ExxonMobil, US
  • Katharina Maisel, University of Maryland, US
  • Vasilios I. Manousiouthakis, UCLA, US
  •  Prantik Mazumder, Corning Research and Development Corporation
  • Kelsey McNeely, ExxonMobil, US
  • Joey Mead, UMass Lowell, US
  • Amanda Mills, N.C. State University, US
  • World L-S Nieh, U.S. Forest Service
  • Jan-Steffen Niehaus, Fraunhofer-Center for Applied Nanotechnology CAN, Germany
  • Len Pagliaro, Siva Therapeutics Inc., US
  • Kyoo-Chul (Kenneth) Park, Northwestern University, US
  • Olivier Pluchery, Sorbonne Université, FR
  • Martin Poitzsch, Aramco Research Center, US
  • Elena Polyakova, Graphene 3D Lab, Inc, US
  • YuanQiao Rao, The Dow Chemical Company, US
  • Julia Rashba-Step, Phosphorex, US
  • Joshua Robinson, Penn State University, US
  • Ryan Roeder, University of Notre Dame, US
  • Orlando Rojas, University of British Columbia, Canada
  • Rick Ross, 3M Company, US
  • Robert Ryan,  Twining, Inc., US
  • Subramanian Sankaranarayanan, Argonne National Laboratory, US
  • Mary Scott, UC Berkeley, US
  • Brent M Segal, Lockheed Martin, US
  • Maksim Shivokhin, ExxonMobil, US
  • Steven R. Sopher, JSP, US
  • Christopher M. Stafford, NIST, US
  • Samuel M. Stavis, NIST, US
  • Anirudha V. Sumant, Argonne National Laboratory, US
  • James M. Tour, Rice University, US
  • Loucas Tsakalakos, GE Global Research, US
  • Puneet Tyagi, AstraZeneca, US
  • Krassimir Velikov, Unilever, Netherlands
  • Siqun Wang, University of Tennessee, US
  • Wendel Wohlleben, BASF SE, Germany
  • Tak-Sing Wong, spotLESS Materials, US
  • Dalia Yablon, SurfaceChar LLC, US
  • Amir Yacoby, Harvard, US
  • Namiko Yamamoto, Penn State University, US
  • Brenton Young, AOSense, Inc., US
  • Xindi Yu, The Dow Chemical Company, US
  • Wei Xie, Form Energy Inc., US
  • Huolin Xin, UC Irvine, US
  • Meng Xue, Ingredion Incorporated, US
  • Maxim A Ziatdinov, Oak Ridge National Laboratory, US
  • Eitan Zeira, Nanocomp Technologies, US
2019 Sponsors & Partners
 

2019 SBIR/STTR Agency Partners:

SBIR/STTR Agency Partners