TechConnect World 2020
Co-Located with Nanotech 2020Co-Located with Nanotech 2020 SBIR/STTRSBIR/STTR AI TechConnectAI TechConnect
 

Technical Program Co-Chairs


Matthew Laudon, TechConnect
Bart Romanowicz, TechConnect
Fiona Case, TechConnect
Dalia Yablon, TechConnect

2020 Organizing Committee

Samiul Amin, Manhattan College
Thomas Anchordoquy, University of Colorado
Wolfgang S. Bacsa, University of Toulouse, France
Keith Brown, Boston University
Elizabeth Burton, California Institute for Energy and Environment, UC Berkeley
Ishita Chakraborty, Stress Engineering Services
Jeannine Coburn, Worcester Polytechnic Institute
Fiona Case, TechConnect
Ronald A. Coutu, Marquette University
Payel Das, IBM T.J. Watson Research Center
Philip Demokritou, Harvard School of Public Health
Eric Gale, Harvard Medical School
Slade H Gardner, Big Metal Additive, Inc.
William Goldner, U.S. Department of Agriculture
Imre Gyuk, U.S. Department of Energy
Nanci Hardwick, MELD Manufacturing Corporation
Greg Haugstad, University of Minnesota
Sean Ireland, Fiberlean Technologies Ltd.
Jim Johnston, Victoria University of Wellington, New Zealand
Steven Jons, Dupont
Mandakini Kanungo, Corning, Inc.
Ioannis Karampelas, Flow-3D
Trevor Keel, Material Value
Peter Koenig, Procter & Gamble
John Kopasz, Argonne National Laboratory
Jan Kośny, University of Massachusetts, Lowell
Kock-Yee Law, Research and Innovative Solutions
Rebecca Locker, Modern Meadow
Joey Mead, University of Massachusetts, Lowell
Chris Menzel, Fujifilm Dimatix, Inc.
Ron Munson, Cogentiv Solutions LLC
Prakash D. Nallathamby, Notre Dame University
World L-S Nieh, U.S. Forest Service
Jan-Steffen Niehaus, Fraunhofer-Center for Applied Nanotechnology CAN, Germany
Alex Norman, Modern Meadow
Kwang W. Oh, University at Buffalo (SUNY)
Jenifer Gomez Pastora, The Ohio State University
Johan Pluyter, Pluyter Consulting, LLC
Martin Poitzsch, Aramco Services Company
Elena Polyakova, Graphene 3D Lab, Inc.
Cassidy Pomeroy-Carter, Vireo Advisors, US
YuanQiao Rao, The Dow Chemical Company
Rick Ross, 3M Company
Robert Ryan, Twining, Inc.
Brent M Segal, Lockheed Martin
Maksim Shivokhin, ExxonMobil
Christopher Sims, National Institute of Standards and Technology
Anirudha V. Sumant, Argonne National Labs
Sarah Tao, Sanofi
Loucas Tsakalakos, GE Global Research
Thomas E. Twardowski, Thomas Jefferson University
Scott Twary, Los Alamos National Laboratory
Puneet Tyagi, AstraZeneca
Krassimir Velikov, Science Leader at Unilever, Netherlands
Thomas J. Webster, Northeastern University
Robert Westervelt, Harvard University
William (Cy) Wilson, NASA Langley Research Center
William L. Wilson, Harvard University
Wendel Wohlleben, BASF SE, Germany
Yiliang Wu, TE Connectivity
Dalia Yablon, SurfaceChar LLC
Xindi Yu, The Dow Chemical Company
Xing Zhou, Nanyang Technological University, Singapore
Steven Zullo, National Institute of Biomedical Imaging and Bioengineering NIH

2019 Review Committee

Frank Abdi, AlphaSTAR Corp.
Wade Adams, Rice University
I. Yucel Akkutlu, Texas A&M University
Emilio Alarcon, University of Ottawa,Canada
Evangelyn Alocilja, Michigan State University
Mohamed Ansari, Universiti Tenaga Nasional Kajang, Malaysia
Thomas Anchordoquy, University of Colorado
Wolfgang S. Bacsa, University of Toulouse, France
Stephen Bart, TDK/InvenSense SSBC
Osman Basran, Purdue University
Massimo Bertino, Virginia Commonweath University
Gregory R. Bogart, Sandia National Laboratories
Samuel Brunner, EMPA, Switzerland
Elizabeth Burton, California Institute for Energy and Environment, UC Berkeley
Noor Butt, Preston University, Pakistan
Willard (Bill) Capdevielle, Oil Patch Engineering, PLLC
Martin Case, Johnson & Johnson
Fiona Case, TechConnect
Chang-Hwan Choi, Stevens Institute of Technology
Ronald A. Coutu, Marquette University
Zheng Cui, Suzhou Institute of Nanotech, CAS, China
Philip Demokritou, Harvard School of Public Health
Mauris DeSilva, 3D PARS
Jennifer Donahue, Croda, Inc.
Alison Elder, University of Rochester
Bengt Fadeel, Karolinska Institute, Sweden
Jeffrey Fagan, National Institute of Standards & Technology
Antoine Fécant, IFP Energies nouvelles, France
Joe Fox, Ashland Inc.
Victor Frenkel, University of Maryland School of Medicine, United States
Slade H Gardner, Big Metal Additive, Inc.
Dariusz Gawin, Technical University of Łodz, Poland
Nick Geithner, Duke University
Chuck Geraci, National Institute for Occupational Safety and Health
Valeriy V. Ginzburg, The Dow Chemical Company
Shubhodeep Goswami, GE Global Research
Imre Gyuk, U.S. Department of Energy
Bahman Habibzadeh, US Department of Energy
Johannes Hachman, University at Buffalo, SUNY
Mark Hanning-Lee, Design West Technologies, Inc.
Greg Haugstad, University of Minnesota
Michael Helmus, Consultant
Andreas Hieke, Stanford University
Donna Lee Ho, U.S. Department of Energy
Sean Ireland, Fiberlean Technologies Ltd.
Swathi Iyer, Naval Research Laboratory
Bjorn Petter Jelle, SINTEF Building & Infrastructure / Norwegian Univ of Sci & Tech, Norway
Rhamesh Jha, Los Alamos National Laboratory
Jim Johnston, Victoria University of Wellington, New Zealand
Steven Jons, Dupont
Larry Judovits, Arkema, Inc.
Mandakini Kanungo, Corning, Inc.
Matthew Kapelewski, ExxonMobil Research and Engineering
Ioannis Karampelas, University at Buffalo (SUNY)
Bryan Koene, Luna Innovations
Peter Koenig, Procter & Gamble
John Kopasz, Argonne National Laboratory, United States
Jan Kośny, Fraunhofer Center for Sustainable Energy Systems CSE
Jana Kukutschova, Technical University Ostrava, Czech Republic
Raj Kumar, ASM America
James Lamb III, Brewer Science
Kock-Yee Law, Research and Innovative Solutions
Sang-Young Lee, Ulsan National Institute of S&T, South Korea
W. Matthew Leevy, University of Notre Dame
Martin E. Leser, Nestlé Research Center Lausanne, Switzerland
Thomas Fengyuan Li, NXP Semiconductors
Rebecca Locker, Modern Meadow
Kenneth Loh, University of California, San Diego"
Matthew Lucas, Center for Carbon Removal
Ji Ma, Qualcomm/Pixtronix
Gedi Mainelis, Rutgers University
Prithwiraj Maitra, Johnson and Johnson
Anil Mane, Argonne National Laboratory
Jeffrey McCutcheon, University of Connecticut
Chris Menzel, Fujifilm Dimatix, Inc.
Meyya Meyyappan, NASA Ames Research Center
Moein Moghimi, Newcastle University, United Kingdom
Ron Munson, Cogentiv Solutions LLC
Prakash D. Nallathamby, Notre Dame University
Chang-Yong Nam, Brookhaven National Laboratory
Dinkar Nandwana, ASM America
World L-S Nieh, U.S. Forest Service
Jan-Steffen Niehaus, Fraunhofer-Center for Applied Nanotechnology CAN, Germany
Greg Nordin, Brigham Young University
Alex Norman, Modern Meadow
Kwang W. Oh, University at Buffalo (SUNY)
Ravi Pillai, Symrise AG
Karsten Pinkwart, Karlsruhe University of Applied Sciences, Germany
Johan Pluyter, Pluyter Consulting, LLC
Martin Poitzsch, Aramco Services Company
Elena Polyakova, Graphene 3D Lab, Inc.
YuanQiao Rao, The Dow Chemical Company
Rick Ross, 3M Company
Robert Rudd, Lawrence Livermore National Laboratory
Robert Ryan, Twining, Inc.
Maggie Scully, National Cancer Institute, NIH
Neeraj Sharma, 3M Corporate Research Laboratory
Brent M Segal, Lockheed Martin
Jo Anne Shatkin, Vireo Advisors
Wu-Sheng Shih, Brewer Science Inc.
Ginger Sigmon, Energy Frontier Research Center
Dmitri Simberg, University of Colorado
Emilie J Siochi, NASA Langley Research Center
Aaron Stebner, Colorado School of Mines
Anirudha V. Sumant, Argonne National Labs
Sally Tinkle, IDA/Science and Technology Policy Institute
Loucas Tsakalakos, GE Global Research
Thomas E. Twardowski, Twardowski Scientific
Scott Twary, Los Alamos National Laboratory
Hasan Uludag, University of Alberta, Canada
Vuk Uskokovic, University of Illinois at Chicago
Krassimir Velikov, Science Leader at Unilever, Netherlands
Erika Vreeland, Consultant
Thomas J. Webster, Northeastern University
Scott Williams, Rochester Institute of Technology
William (Cy) Wilson, NASA Langley Research Center
William L. Wilson, Harvard University
Wendel Wohlleben, BASF SE, Germany
Yiliang Wu, TE Connectivity
Dalia Yablon, SurfaceChar LLC
Jun Yang, The University of Western Ontario, Canada
Jenny Zhen Yu, California State Polytechnic University
Guoan Zheng, University of Connecticut
Steven Zullo, National Institute of Biomedical Imaging and Bioengineering (NIBIB)/NIH

Conference Operations Manager

Sarah Wenning, NSTI & TechConnect Group, USA

2019 Sponsors & Partners
 

2019 SBIR/STTR Agency Partners:

SBIR/STTR Agency Partners