Printed Electronics and Sensors for challenging applications

S. Mukhopadhyay
Obsidian Advanced Manufacturing,
United States

Keywords: sensors, electronics, 3D printing


Using 3d printed techniques for electronics using standard inks and aerosol based techniques have presented major challenges. In this presentation we will discuss a new approach using non-equilibrium room temperature plasma based deposition which allows one to directly print metals and ceramics. Some of these ceramics, e.x. SiC or Zirconia fabrics work in high temperature and/or high stress environments. In particular the adhesion, conductivity of the printed circuits will be discussed relative to their bulk properties. Direct printing of circuits and sensors are also useful for antennas and RF devices as well as interconnects for cells and batteries and in fact printing conformal patterns will open up a whole new universe of potential applications beyond prototyping. Not having to engineer new inks for each application opens up the possibility of using wider materials palette for the engineer and materials scientist. The talk will present results of some of the circuits currently being printed as well the vision for future applications.