Overheating is one of the biggest problems of electronic devices causing loss of performance and reduced lifetime. Introduction of smaller and more powerful electronic devices have made the electronic industry seek better thermal management strategies. The dissipation of heat during the operation is often facilitated by thermal interface materials (TIMs), which are placed between devices to heat sinks. Currently used TIMs include thermal greases, polymer-composites and solders. Limitations of these TIMs - such as low thermal conductivity in thermal greases and polymer composites, and thermally-induced stress failures due to high thermal expansion in solder TIMs – have led to failures in electronics. We are dedicated to developing novel TIMs to overcome these limitations For this purpose, we aim to develop and fabricate metal nanocomposite TIMs, involving integration of boron nitride nanosheets (BNNS), soft organic linkers, and copper matrix. The developed hybrid nanocomposites demonstrate an exceptional combination of thermal and mechanical properties (elastic modulus); over 210 W/(m K) and 20 GPa, respectively. The developed TIMs show a compatible thermal expansion, forming a mediation zone with low thermally-induced axial stress on the mating surfaces. Exceptional properties of the developed TIMs will enable enhanced efficiency in electronics cooling.
Primary Application Area: Materials, Chemical
Technology Development Status: Prototype
Technology Readiness Level: TRL 4
Vetted Programs/Awards: Our novel TIMs technology was recognized as an Innovation Award Winner at TechConnect World Conference in May 2018, Anaheim, California. We have successfully completed pilot-scale production stage and are planning to attend this event with a more market ready product.
Organization Type: Early-stage Startup (Seed)
Showcase Booth #: 1 Day
GOVT/EXTERNAL FUNDING SOURCES
External Funding to Date: As a technology commercialization start-up founded in April 2017, Incendium is currently operating on a seed funds and has been seeking external funds through SBIR path.