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3D printed flexible sensor systems
A Digital Additive Manufacturing Approach to Make Printed Circuit Boards (PCBs)
Scalable printing of nanoelectronics and wireless sensors
Development of silver nanoparticle inks for printed electronicsSymposium Sessions | ||
Monday May 14 | ||
| 10:30 | Printed & Flexible Electronics | |
| 1:30 | Flexible Electronics | |
Tuesday May 15 | ||
| 10:30 | Printed Electronics | |
| 4:00 | Printed Electronics: Posters | |
Symposium Program | ||
Monday May 14 | ||
| 10:30 | Printed & Flexible Electronics | 251 B |
| Session chair: Mandakini Kanungo, Corning, Inc., US; Yiliang Wu, TE Connectivity, US | ||
| 10:30 | A Digital Additive Manufacturing Approach to Make Printed Circuit Boards (PCBs) (invited presentation) J. Yang, The University of Western Ontario, CA | |
| 10:55 | Printed Electronics in Consumer Electronics (invited presentation) K. Liao, DuPont Silicon Valley Technology Center, US | |
| 11:20 | XTPL Approach to Print Submicron Conductive Lines on Dielectric Substrates P. Kowalczewski, A. Wiatrowska, M. Dusza, M. Zięba, P. Cichoń, K. Fijak, F. Granek, XTPL SA, PL | |
| 11:40 | Low transmission loss flexible substrates using low Dk/Df polyimide adhesives T. Tasaki, Arakawa Chemical Industries, Ltd., JP | |
| 12:00 | Electrical characteristics of individual FeNiCo-Au core-shell nanowires integrated into microelectrodes on plastic substrate M. Beheshti, X. Geng, J. Choi, E. Podlaha-Murphy, S. Park, Louisiana State University, US | |
| 1:30 | Flexible Electronics | 251 B |
| Session chair: Yiliang Wu, TE Connectivity, US; Mandakini Kanungo, Corning, Inc., US | ||
| 1:30 | Flexible Hybrid Electronics Manufacturing: Enabling Electronics Out of the Box (invited presentation) P. Semenza, NextFlex, US | |
| 1:55 | 3D printed flexible sensor systems (invited presentation) W.S. Kim, Simon Fraser University, CA | |
| 2:20 | Flexible Mid-IR photonic chip for real-time and label-free chemical sensing P.T. Lin, Texas A&M University, US | |
| 2:40 | A Stretching/Bending-Insensitive Flexible Pressure Sensor with Carbon Nanotube-PDMS R. Zhang, Stevens Institute of Technology, US | |
| 3:00 | Textile-enable Flexible and Foldable Lithium-ion Batteries Z. Zheng, The Hong Kong Polytechnic University, HK | |
Tuesday May 15 | ||
| 10:30 | Printed Electronics | 251 B |
| Session chair: Chris Menzel, Fujifilm Dimatix, Inc., US | ||
| 10:30 | Electroninks: A Materials Centric Approach To Printed Electronics (invited presentation) M. LeMieux, Electroninks Inc., US | |
| 10:55 | Development of silver nanoparticle inks for printed electronics (invited presentation) Y. Wu, TE Connectivity, US | |
| 11:20 | 3D/4D-printed Smart Wireless Packages, Energy Harvesters, Sensors and Modules up to mmW for IoT, Smart Skins and Smart Cities Applications (invited presentation) E.M. Tentzeris, Georgia Institute of Technology, US | |
| 11:45 | Printing of Nano and Microscale Electronics and Sensors on Flexible and Rigid Substrates (invited presentation) A. Busnaina, Northeastern University, US | |
| 12:10 | 3D Micro-Extruded, Non-toxic Conductive Inks for Interconnection in Power Electronics Modules H.M. Cronin, M. Arnold, K. Mak, Z. Stoeva, DZP Technologies Ltd., UK | |
| 4:00 | Printed Electronics: Posters | Expo Hall |
| Design and fabrication of a highly bright flexible electroluminescent device B. Choi, H.K. Ryu, and S.K. Lee, DGIST, KR | ||
| Enzyme-modified surface of Schottky-gated IGZO TFT for glucose sensing J. Kaczmarski, M.A. Borysiewicz, A. Treichel, E. Kamińska, Institute of Electron Technology, PL | ||
| A Low-Cost Environmentally Friendly Approach to Create Tensilely Strained Ge Films on Si Substrates Y.S. Li, J. Ngyuen, California State University, US | ||
| Ultra-Low Power (ULP) Oven-Controlled Crystal Oscillator (OCXO) A. Dhuria, Bliley Technologies, US | ||
| Nanopatterned Stamp Fabrication for Metal-Assisted Chemical Imprinting of Silicon A. Sharstniou, S. Niauzorau, M. Gregory, B. Azeredo, ARIZONA STATE UNIVERSITY, US | ||
| Adaptive infrared-reflecting systems inspired by cephalopods C. Xu, G.T. Stiubianu, A.A. Gorodetsky, University of California, Irvine, US | ||
Printed and flexible electronics technologies will have a far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.
The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.
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