The Hong Kong Polytechnic University, Hong Kong, HK, HK
Materials with colossal permittivity (CP) have shown great technological potential for advanced microelectronics and high-energy-density storage applications. Several types of CP materials have been studied. Still, it is challengeable to maximize their performance as they show drawbacks in two aspects: temperature/frequency dependent properties and high dielectric loss. In our work, original CP ceramic capacitors exhibited high-performance dielectric behaviors, including temperature and frequency stable CP value (10,000–100,000) and sufficiently low dielectric loss (0.03). These results indicate a high reliability of the capacitors. In addition, technology on ceramics were extended to multi-layer-structured ceramic/polymer composite films. Surface hydroxylated ceramic fillers, embedded in copolymer matrix achieved high dielectric constant up to 300 and exceptional low dielectric loss down to 0.04 over a broad frequency range, as well as a high energy density of 8.9 J/cm3 at breakdown field of 82 MV/m. Therefore, this composite film capacitors have great technological potential for many applications. In microelectronic systems, thin-film dielectric with high capacitance due to its minimal thickness and being located close to the microprocessor can reduce inductance. Thin-film capacitors can increase the capacitive density and drastically reduce the capacitor area, offering performance, volume, and cost advantages over discrete ceramic capacitors.
Primary Application Area: Materials, Chemical
Technology Development Status: Prototype
Technology Readiness Level: TRL 2
Organization Type: Academic/Gov Lab
Showcase Booth #: 523
GOVT/EXTERNAL FUNDING SOURCES