Electronics & Microsystems

• Abraham (Abe) P. Lee, UC-Irvine, US
• Alex Balandin, University of California, Riverside, US
• Alexandra Wright-Gladstein, Ayar Labs, Inc., US
• Andrei Shkel, UC Irvine, US
• Aydogan Ozcan, UCLA, US
• Benjamin L. Miller, University of Rochester Medical Center, US
• Carl Meinhart, UC Santa Barbara, US
• Chongwu Zhou, USC, US
• Chris Harrison, Carnegie Mellon University, US
• Chris Menzel, Fujifilm Dimatix, Inc., US
• David Sinton, University of Toronto, Canada
• Dustin Banham, Ballard Power Systems, US
• Edmond Cretu, The University of British Columbia, US
• Edward Furlani, University at Buffalo (SUNY), US
• Eric MacDonald, Youngstown State University, US
• Gabriel M. Rebeiz, UC San Diego, US
• Gilles Lamant, Cadence Design Systems, US
• H. Tom Soh, Stanford University, US
• Jason Marsh, NextFlex, US
• Jason Rolland, Carbon, US

• Jenny Zhen Yu, California State Polytechnic University, Pomona
• Joseph Paradiso, MIT, US
• Kwang W. Oh, University at Buffalo (SUNY), US
• Lian-Mao Peng, Peking University, China
• Loucas Tsakalakos, GE Global Research, US
• Mandakini Kanungo, Corning, Inc., US
• Manish Chhowalla, Rutgers University, US
• Manos M. Tentzeris, Georgia Tech, US
• Martin Poitzsch, Aramco Research Center, US
• Melbs LeMieux, Electronics Inks, US
• Ritesh Agarwal, University of Pennsylvania, US
• Ronald A. Coutu, Marquette University, US
• Samuel Wadsworth, Aspect Biosystems Ltd., US
• Sung Jae Kim, Seoul National University, Korea
• William (Cy) Wilson, NASA Langley Research Center, US
• Woo Soo Kim, Simon Fraser University, Canada
• Yiliang Wu, TE Connectivity, US
• Zehra Parlak, Qatch, US