TechConnect World 2018
 

Electronics & Microsystems

Submit your Abstracts: Due December 8th. Select the most appropriate symposium from the technical program listing and submit an abstract describing your research. Our distinguished Program Review Committee will consider your work for oral or poster presentation at the conference, and for inclusion in TechConnect Briefs open-access journal.

Join industry partners and applied research leadership accelerating the development and deployment of advanced electronics solutions into products and society.


2017 Featured Speakers:

 Mandakini KanugoMandakini Kanugo
Xerox Innovation Group



Chris MenzelChris Menzel
Fujifilm Dimatix, Inc.


Aram ChungAram Chung
Rensselaer Polytechnic Institute (RPI)



Jeff Tza-Huei WangJeff Tza-Huei Wang
Johns Hopkins University


Jean BerthierJean Berthier
CEA-LETI-Minatec, France



Edward FurlaniEdward Furlani
University at Buffalo (SUNY)



Kwang W. OhKwang W. Oh
University at Buffalo (SUNY)



Richard B. FairRichard B. Fair
Duke University


Baratunde A. ColaBaratunde A. Cola
Carbice Nanotechnologies, Inc



Alex AdronovAlex Adronov
McMaster University, Canada



Jonathan SpanierJonathan Spanier
Drexel University

Radislav A. PotyrailoRadislav A. Potyrailo
GE Global Research, US



Kenneth J. LohKenneth J. Loh
University of California, San Diego

Martin E. PoitzschMartin E. Poitzsch
Aramco Research Center



William (Cy) WilsonWilliam (Cy) Wilson
NASA Langley Research Center



Dorothy F. FarrellDorothy F. Farrell
National Cancer Institute

Murat GuvendirenMurat Guvendiren
New Jersey Institute of Technology (NJIT)


Robert CelottaRobert Celotta
NIST Center for Nanoscale Science and Technology


HaugstadGreg Haugstad
University of Minnesota



Ryan WagnerRyan Wagner
National Institute of Standards and Technology


Pierre PaninePierre Panine
Xenocs SA, France


Dalia YablonDalia Yablon
SurfaceChar LLC


Baratunde A. ColaBaratunde A. Cola
Carbice Nanotechnologies, Inc



Sindy KY TangSindy KY Tang
Stanford University



2017 Key Speakers Included:

  • Aerojet
  • Alex Adronov, McMaster University, Canada
  • Andy Behr, Panasonic
  • Aram Chung, Rensselaer Polytechnic Institute (RPI)
  • Baratunde A. Cola, Carbice Nanotechnologies, Inc
  • Chris Menzel, Fujifilm Dimatix, Inc.
  • Chris Skinner, Owens Corning
  • Eastman
  • Edward Furlani, University at Buffalo (SUNY)
  • Elisabeth (Sabeth) Verpoorte, University of Groningen, The Netherlands
  • Gokce Gulsoy, TE Connectivity
  • Harish Bhaskaran, Bodle Technologies Limited, UK
  • Ian Simmons, Magna International
  • Jean Berthier, CEA-LETI-Minatec, France
  • Jeff Tza-Huei Wang, Johns Hopkins University
  • Jonathan Spanier, Drexel University
  • Kwang W. Oh, University at Buffalo (SUNY)
  • David Gundlach, NIST
  • Loucas Tsakalakos , GE Global Research
  • Mandakini Kanungo, Corning, Inc.
  • Michael Renn, Optomec
  • Misha Itkis, UCR
  • Patrick Tabeling, CNRS, France
  • Pooran C. Joshi, Oak Ridge National Laboratory
  • Ray Chen, Omega Optics Inc.
  • Richard B. Fair, Duke University
  • Roger England, Cummins
  • Ronald A. Coutu, Wright-Patterson Air Force Base
  • Sarah Bergbreiter, Maryland Robotics Center
  • Senentxu Lanceros, BC Materials
  • Sikorsky
  • Wayne Hiebert, National Institute for Nanotechnology (NINT), Canada

 
2017 Sponsors & Partners
2017 Sponsors & Partners

TechConnect World 2018

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