Advanced Materials

• William (Cy) Wilson, NASA Langley Research Center, US
• Aaron Stebner, Colorado School of Mines,
• Abhishek (A) Shrivastava, The Dow Chemical Company, US
• Ahmed Busnaina, Northeastern University, US
• Alexandra Wright-Gladstein, Ayar Labs, Inc.
• Anirudha V. Sumant, Argonne National Laboratory, US
• Anton Köck, Material Center Leoben (MCL), Austria
• Arun Kota, Colorado State University, US
• Bengt Fadeel, Karolinska Institutet, Sweden
• Bjorn Petter Jelle, Norwegian University of Science and Technology
• Bryan Koene, Luna Innovations, US
• C. Rebecca Locker, ExxonMobil Research and Engineering, US
• Chongwu Zhou, USC, US
• Chuck Geraci, National Institute for Occupational Safety & Health, US
• Dalia Yablon, SurfaceChar LLC, US
• David S Simmons, University of Akron, US
• David Skuse, FiberLean Technologies ltd, US
• Alex Balandin, University of California, Riverside, US
• Elena Polyakova, Graphene 3D Lab, Inc, US
• Greg Haugstad, University of Minnesota, US
• Harjit Singh, Brunel University London, UK
• Hasan Uludag, University of Alberta, Canada
• Jan Kosny, Fraunhofer Center for Sustainable Energy Systems CSE, US
• Jan-Steffen Niehaus, CAN Center for Applied Nanotechnology, Germany
• Jason Rolland, 3D Carbon, US
• Jason Weiss, Oregon State University
• Jeff Meinhardt, GE Aviation, US
• Jim Johnston, Victoria University of Wellington, New Zealand
• Jindřich Henry Kopeček, University of Utah, US
• Jo Anne Shatkin, Vireo Advisors, US
• Joel Wallecan , Cargill
• Johan Pluyter, S. C. Johnson, US
• Johannes Hachmann, University of Buffalo, US
• Sven Mumme, Envelope Technology Manager, Building Technologies Office, US Department of Energy
• Ken MacKenzie, Victoria University of Wellington, New Zealand
• Kevin Kjoller, Anasys Instruments, US

• Kock-Yee Law, Research and Innovative Solutions, US
• Krassimir Velikov, Unilever, Netherlands
• Lian-Mao Peng, Peking University, China
• Loucas Tsakalakos, GE Global Research, US
• Maksym Kovalenko, ETH Zurich, Switzerland
• Mandakini Kanungo, Corning, Inc., US
• Manish Chhowalla, Rutgers University, US
• Mansoor M. Amiji, Northeastern University, US
• Marcius Extavour, Xprize, US
• Mark E. Davis, California Institute of Technology, US
• Matt Carr, Algae Biomass Organization, US
• Matt Lucas, University of California, Berkeley
• Melbs LeMieux, Electronics Inks, US
• Michael Z. Hu, Oak Ridge National Laboratory, US
• Phil Demokritou, Harvard School of Public Health, US
• Pierre Panine, Xenocs SA, France
• Prakash Nallathamby, Univ of Notre Dame, US
• Prithwiraj Maitra, Johnson and Johnson, US
• Rick Ross, 3M Company, US
• Ritesh Agarwal, University of Pennsylvania, US
• Robert K. Prud'homme, Princeton University, US
• Robert Ryan, Twining, Inc., US
• Ronald A. Coutu, Marquette University, US
• Sally Tinkle, IDA/Science and Technology Policy Institute, US
• Samuel Wadsworth, Aspect Biosystems Ltd., US
• Sang-Young Lee, UNIST, Korea
• Sanyogitta Puri, AstraZeneca, UK
• Sean Ireland, Fiberlean Technologies Ltd, US
• Slade H Gardner, Big Metal Additive, Inc, US
• Sung Park, Molecular Vista, US
• Terrance Barkan, Graphene Council, US
• Thomas E. Twardowski, Integra Life Sciences Corporation, US
• Trevor Keel, Material Value, United Kingdom
• Vuk Uskokovic, The University of Illinois at Chicago, US
• Wendel Wohlleben, BASF SE, Germany
• Wolfgang S. Bacsa, University of Toulouse, France
• World L-S Nieh, U.S. Forest Service
• Yanyun Zhao, Oregon State University
• Yiliang Wu, TE Connectivity, US
• YuanQiao Rao, The Dow Chemical Company, US