Printed & Flexible Electronics

Printed and Flexible Electronics

Symposium Chair

Mandakini Kanungo
Research and Technology
Corning, Inc.

Key Speakers

Printed Electronics: Towards more advanced functional coatings
Gokce Gulsoy
Senior Scientist, TE Connectivity

Aerosol Jet Printing of Flexible and Stretchable Hybrid Electronics
Michael Renn
CTO and Director of Advanced Applications Lab, Optomec, Inc.

Beyond Flexible - Next Generation Materials Enable Conformable Electronics
Andy Behr
Product and Business Development Manager, Panasonic Electronic Materials Division

TBA
David Gundlach
Project Leader, National Institute of Standards and Technology

Solution-based Synthesis of 2D Layered Materials for Flexible and Printed Electronics Applications
Anupama B Kaul
AT&T Distinguished Professor, The University of Texas at El Paso

Electroactive Fluorinated Polymers
Larry Judovits
Principal Scientist, Arkema, Inc.

Symposium Sessions
	Tuesday May 16
10:30	Electronics Innovation Spotlights: Panasonic, LG, Energizer
1:30	Materials for Flexible Electronics
	Wednesday May 17
8:30	Flexible Electronics Manufacturing
10:30	Printed Electronics Innovations & Applications
1:30	Inkjet Design, Materials & Fabrication
	Advanced, Printed & Flexible Electronics: Posters

Symposium Program
	Tuesday May 16

10:30	Electronics Innovation Spotlights: Panasonic, LG, Energizer	National Harbor 12
	Session chair: Saeed Bagheri, University of Waterloo, CA
10:30	Panasonic: Innovation Spotlights I. Nydick, Panasonic, US
10:45	LG: Innovation Spotlights K. Patel, LG, US
11:00	Energizer: Innovation Spotlight E. Riley, Energizer, US
11:15	Distributed multi-parameter fiber optic sensor for harsh environment sensing H. Alemohammad, AOMS Technologies Inc., CA
11:22	Electric Field Imaging System D. Beals, NASA Langley Research Center, US
11:29	Pristine Low-Cost Large-Area Graphene Sheets G. Botte, Ohio University - Center for Electrochemical Engineering Research, US
11:36	Electric Current and Magnetic Field Imaging System C. Smith, Texas Tech University, US
11:43	Graphene research and innovation K. Hjelt, Chalmers Industrial Technology, SE
11:50	Direct method to grow single and multilayer graphene on insulting substrate at wafer-scale in 1 min A. Sumant, Center for Nanoscale Materials, Argonne National Laboratory, US
11:57	Panasonic, LG, Energizer: Q&A

1:30	Materials for Flexible Electronics	Potomac 5
	Session chair: Mandakini Kanungo, Corning, Inc., US
1:30	Beyond Flexible - Next Generation Materials Enable Conformable Electronics (invited presentation) A. Behr, Panasonic, US
1:55	Solution-based Synthesis of 2D Layered Materials for Flexible and Printed Electronics Applications (invited presentation) A.B. Kaul, University of Texas at El Paso, US
2:20	Materials measurements for flexible and printed electronics (invited presentation) D. Gundlach, NIST, US
2:45	Direct imprinting of liquid silicon, vol. 4: pp. 174-177 T. Masuda, T. Shimoda, Japan Advanced Institute of Science and Technology, JP
3:05	New Paradigms on Materials Synthesis and Additive Manufacturing of Flexible Electronics for Energy Applications, vol. 4: pp. 178-181 M.A. Torres Arango, K.A. Sierros, West Virginia University, US
3:25	Silk biocomposites as flexible and biodegradable electrochemical sensors, vol. 4: pp. 190-193 R.K. Pal, V.K. Yadavalli, Virginia Commonwealth University, US
3:45	Green strategies for the development of printable polymer based piezoresistive sensors J. Oliveira, Universidade do Minho, PT
	Wednesday May 17

8:30	Flexible Electronics Manufacturing	National Harbor 13
	Session chair: Mandakini Kanungo, Corning, Inc., US
8:30	Aerosol Jet Printing of Flexible and Stretchable Hybrid Electronics (invited presentation) M. Renn, Optomec, Inc., US
8:55	Manufacturing of Polymeric Substrates and Materials for Roll to Roll Flexible Printed Materials and Additive Processes J. Mead, C. Barry, A. Akyurtlu, M. Herndon, University of Massachusetts Lowell, US
9:15	Introduction of a simple metal transfer method for fabricating flexible electrodes D. Koh, A. Wang, P. Schneider, B. Bosinski, K.W. Oh, University at Buffalo, US
9:35	The Electrochemical Printing Technique (EPT) for Flexible Electronics, vol. 4: pp. 182-185 I. Kadija, ECSI Fibrotools, US
9:55	Manufacturing Method of Si Nanoparticles and Nanoink for Printed Electronics E. Kim, Korea Institute of Energy Research(KIER), KR

10:30	Printed Electronics Innovations & Applications	National Harbor 13
	Session chair: Mandakini Kanungo, Corning, Inc., US
10:30	Printed Electronics: Towards more advanced functional coatings (invited presentation) G. Gulsoy, TE Connectivity, US
10:55	Electroactive Fluorinated Polymers (invited presentation) L. Judovits, Arkema, Inc., US
11:20	Metal Nanowires for Printed Electronics B. Wiley, Duke Unviersity, US
11:40	Aerosol Jet Printed Functional Nanoinks with High Reliability and Reconfigurability, vol. 4: pp. 186-189 X. Lan, E. Nguyen, A. Malingowski, V. Gambin, J. Tice, Northrop Grumman Aerospace Systems, US
12:00	Printable and High Performance MnO2-based Energy Storage Devices, vol. 2: pp. 94-97 J. Qian, S.P. Lau, The Hong Kong Polytechnic University, HK

1:30	Inkjet Design, Materials & Fabrication	Potomac 3
	Session chair: Chris Menzel, Fujifilm Dimatix, Inc., US
1:30	Printing smart and functional polymers for sensor and actuator applications (invited presentation) S. Lanceros, BC Materials, ES
1:55	Inkjet Printing of High Index Zirconia Nanocomposite Materials, vol. 4: pp. 137-140 M.D. Healy, P. Guschl, X. Wang, M. Weinstein, Pixelligent Technologies LLC, US
2:15	One-dimensional simulation of drop breakup in inkjet, vol. 4: pp. 128-132 H. Jiang, H. Tan, Washington State University Vancouver, US
2:35	Ink Design and Printability B. Derby, Y. Liu, University of Manchester, UK
2:55	Printed, Self-Powered, Wireless Sensor Platform for Future Smart Buildings (invited presentation) P. Joshi, Oak Ridge National Laboratory, US
3:20	Development of a Gold Nanoparticle Conductive Ink with a Relatively Low Sintering Temperature, vol. 4: pp. 141-144 S. Hamacher, B. Bachmann, A. Yakushenko, Forschungszentrum Jülich, DE
3:40	Inkjet printing of carbon nanospheres, vol. 4: pp. 133-136 M. Orrill, D. Abele, N. Banek, M. Wagner, S. LeBlanc, The George Washington University, US

	Advanced, Printed & Flexible Electronics: Posters	Potomac Registration Hall
	CarrICool – the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase, vol. 4: pp. 47-50 G. Janczyk, T. Bieniek, P.R. Bajurko, Instytut Technologii Elektronowej, PL
	Novel Polymer Substrates for Printed Electronics by Continuous Extrusion A. Panwar, J. Mead, C. Barry, C. Lepont, R. Vaghani, J. Desrochers, A. Akyirtlu, A. Dericioglu, SE. Hajisaeid, M. Haghzadeh, M. Herndon, D. Rockosi, University of Massachusetts Lowell, US
	Three Operation Modes of 6T-SRAM Using 5nm-Node Multi-Vt FD-SOI MOSFETs J-Y. Chen, S-H. Chen, M-H. Chiang, National Cheng Kung University, TW
	Controlling the Interface-Size of Inorganic/Organic Semiconductors Heterojunction Nanowires for Perfect Performance Diodes H. Liu, Institute of Chemistry,Chinese Academy of Sciences, CN
	Improved adhesion between polyimide substrates and screen-printed copper electrodes by chemical treatment of substrate surface C.H. Cho and Y.J. Choi, Sejong University, KR

Flexible electronics is an emerging technology with far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event.