TechConnect World 2017
National SBIR/STTR Conference National Innovation Summit & Showcase Nanotech 2017

Printed & Flexible Electronics

Printed and Flexible Electronics

Symposium Chair

Mandakini KanungoMandakini Kanungo
Research and Technology
Corning, Inc.

Key Speakers

Gokce GulsoyPrinted Electronics: Towards more advanced functional coatings
Gokce Gulsoy
Senior Scientist, TE Connectivity

Michael RennAerosol Jet Printing of Flexible and Stretchable Hybrid Electronics
Michael Renn
CTO and Director of Advanced Applications Lab, Optomec, Inc.

Andy BehrBeyond Flexible - Next Generation Materials Enable Conformable Electronics
Andy Behr
Product and Business Development Manager, Panasonic Electronic Materials Division

David GundlachTBA
David Gundlach
Project Leader, National Institute of Standards and Technology

Anupama B KaulSolution-based Synthesis of 2D Layered Materials for Flexible and Printed Electronics Applications
Anupama B Kaul
AT&T Distinguished Professor, The University of Texas at El Paso

Larry JudovitsElectroactive Fluorinated Polymers
Larry Judovits
Principal Scientist, Arkema, Inc.

Symposium Sessions

Tuesday May 16

10:30Electronics Innovation Spotlights: Panasonic, LG, Energizer
1:30Materials for Flexible Electronics

Wednesday May 17

8:30Flexible Electronics Manufacturing
10:30Printed Electronics Innovations & Applications
1:30Inkjet Design, Materials & Fabrication
Advanced, Printed & Flexible Electronics: Posters

Symposium Program

Tuesday May 16

10:30Electronics Innovation Spotlights: Panasonic, LG, EnergizerNational Harbor 12
Session chair: Saeed Bagheri, University of Waterloo, CA
10:30Panasonic: Innovation Spotlights
I. Nydick, Panasonic, US
10:45LG: Innovation Spotlights
K. Patel, LG, US
11:00Energizer: Innovation Spotlight
E. Riley, Energizer, US
11:15Distributed multi-parameter fiber optic sensor for harsh environment sensing
H. Alemohammad, AOMS Technologies Inc., CA
11:22Electric Field Imaging System
D. Beals, NASA Langley Research Center, US
11:29Pristine Low-Cost Large-Area Graphene Sheets
G. Botte, Ohio University - Center for Electrochemical Engineering Research, US
11:36Electric Current and Magnetic Field Imaging System
C. Smith, Texas Tech University, US
11:43Graphene research and innovation
K. Hjelt, Chalmers Industrial Technology, SE
11:50Direct method to grow single and multilayer graphene on insulting substrate at wafer-scale in 1 min
A. Sumant, Center for Nanoscale Materials, Argonne National Laboratory, US
11:57Panasonic, LG, Energizer: Q&A
1:30Materials for Flexible ElectronicsPotomac 5
Session chair: Mandakini Kanungo, Corning, Inc., US
1:30Beyond Flexible - Next Generation Materials Enable Conformable Electronics (invited presentation)
A. Behr, Panasonic, US
1:55Solution-based Synthesis of 2D Layered Materials for Flexible and Printed Electronics Applications (invited presentation)
A.B. Kaul, University of Texas at El Paso, US
2:20Materials measurements for flexible and printed electronics (invited presentation)
D. Gundlach, NIST, US
2:45Direct imprinting of liquid silicon, vol. 4: pp. 174-177
T. Masuda, T. Shimoda, Japan Advanced Institute of Science and Technology, JP
3:05New Paradigms on Materials Synthesis and Additive Manufacturing of Flexible Electronics for Energy Applications, vol. 4: pp. 178-181
M.A. Torres Arango, K.A. Sierros, West Virginia University, US
3:25Silk biocomposites as flexible and biodegradable electrochemical sensors, vol. 4: pp. 190-193
R.K. Pal, V.K. Yadavalli, Virginia Commonwealth University, US
3:45Green strategies for the development of printable polymer based piezoresistive sensors
J. Oliveira, Universidade do Minho, PT

Wednesday May 17

8:30Flexible Electronics ManufacturingNational Harbor 13
Session chair: Mandakini Kanungo, Corning, Inc., US
8:30Aerosol Jet Printing of Flexible and Stretchable Hybrid Electronics (invited presentation)
M. Renn, Optomec, Inc., US
8:55Manufacturing of Polymeric Substrates and Materials for Roll to Roll Flexible Printed Materials and Additive Processes
J. Mead, C. Barry, A. Akyurtlu, M. Herndon, University of Massachusetts Lowell, US
9:15Introduction of a simple metal transfer method for fabricating flexible electrodes
D. Koh, A. Wang, P. Schneider, B. Bosinski, K.W. Oh, University at Buffalo, US
9:35The Electrochemical Printing Technique (EPT) for Flexible Electronics, vol. 4: pp. 182-185
I. Kadija, ECSI Fibrotools, US
9:55Manufacturing Method of Si Nanoparticles and Nanoink for Printed Electronics
E. Kim, Korea Institute of Energy Research(KIER), KR
10:30Printed Electronics Innovations & ApplicationsNational Harbor 13
Session chair: Mandakini Kanungo, Corning, Inc., US
10:30Printed Electronics: Towards more advanced functional coatings (invited presentation)
G. Gulsoy, TE Connectivity, US
10:55Electroactive Fluorinated Polymers (invited presentation)
L. Judovits, Arkema, Inc., US
11:20Metal Nanowires for Printed Electronics
B. Wiley, Duke Unviersity, US
11:40Aerosol Jet Printed Functional Nanoinks with High Reliability and Reconfigurability, vol. 4: pp. 186-189
X. Lan, E. Nguyen, A. Malingowski, V. Gambin, J. Tice, Northrop Grumman Aerospace Systems, US
12:00Printable and High Performance MnO2-based Energy Storage Devices, vol. 2: pp. 94-97
J. Qian, S.P. Lau, The Hong Kong Polytechnic University, HK
1:30Inkjet Design, Materials & FabricationPotomac 3
Session chair: Chris Menzel, Fujifilm Dimatix, Inc., US
1:30Printing smart and functional polymers for sensor and actuator applications (invited presentation)
S. Lanceros, BC Materials, ES
1:55Inkjet Printing of High Index Zirconia Nanocomposite Materials, vol. 4: pp. 137-140
M.D. Healy, P. Guschl, X. Wang, M. Weinstein, Pixelligent Technologies LLC, US
2:15One-dimensional simulation of drop breakup in inkjet, vol. 4: pp. 128-132
H. Jiang, H. Tan, Washington State University Vancouver, US
2:35Ink Design and Printability
B. Derby, Y. Liu, University of Manchester, UK
2:55Printed, Self-Powered, Wireless Sensor Platform for Future Smart Buildings (invited presentation)
P. Joshi, Oak Ridge National Laboratory, US
3:20Development of a Gold Nanoparticle Conductive Ink with a Relatively Low Sintering Temperature, vol. 4: pp. 141-144
S. Hamacher, B. Bachmann, A. Yakushenko, Forschungszentrum Jülich, DE
3:40Inkjet printing of carbon nanospheres, vol. 4: pp. 133-136
M. Orrill, D. Abele, N. Banek, M. Wagner, S. LeBlanc, The George Washington University, US
Advanced, Printed & Flexible Electronics: PostersPotomac Registration Hall
CarrICool – the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase, vol. 4: pp. 47-50
G. Janczyk, T. Bieniek, P.R. Bajurko, Instytut Technologii Elektronowej, PL
Novel Polymer Substrates for Printed Electronics by Continuous Extrusion
A. Panwar, J. Mead, C. Barry, C. Lepont, R. Vaghani, J. Desrochers, A. Akyirtlu, A. Dericioglu, SE. Hajisaeid, M. Haghzadeh, M. Herndon, D. Rockosi, University of Massachusetts Lowell, US
Three Operation Modes of 6T-SRAM Using 5nm-Node Multi-Vt FD-SOI MOSFETs
J-Y. Chen, S-H. Chen, M-H. Chiang, National Cheng Kung University, TW
Controlling the Interface-Size of Inorganic/Organic Semiconductors Heterojunction Nanowires for Perfect Performance Diodes
H. Liu, Institute of Chemistry,Chinese Academy of Sciences, CN
Improved adhesion between polyimide substrates and screen-printed copper electrodes by chemical treatment of substrate surface
C.H. Cho and Y.J. Choi, Sejong University, KR

Flexible electronics is an emerging technology with far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event.

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Platinum Sponsors
Lockheed Martin

Silver Sponsors
Park Systems
Penn State

Corporate Acceleration Partners
Church & Dwight
Eastman Chemical
Energizer Holdings Inc.
Lockheed Martin
Owens Corning
Sherwin Williams

Technology Development Partners
AirForce Technology Transfer
Business Sweden
Idaho National Laboratory
Innovate Hawaii
Iowa State University
Jefferson Lab
Kansas City National Security Campus
KYUNGPOOK National University
Lawrence Berkeley National Laboratory
New Jersey Innovation Institute
University of Buffalo NYSCEMI
Sandia National Laboratories
SungKyunKwan University
Texas Tech Research Commercialization
University Of Melbourne
University Of Minnesota
University Of Vermont
UCLA Technology Development Group
Vermont Department Economic Development
Vermont Technology Council

Supporting Partners
American Elements
Angel Capital Associates
Arrowhead Center
Asia Nano Forum
Diplomacy Matters
European Commission
European Cluster Collaboration Platform
Explore Nano
Graphene Council
Graphene Entrepreneur
Journal of Nanobiotechnology
Taylor Francis CRC
Texas Nanotech Initiative

TechConnect World 2017

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