Cross-section thermal conductivity maps of die-attached composite materials

E. Ziade, M. Goni, S. Anagnostopoulos, I. Kapoglis, A. Schmidt
Boston University,
United States

Keywords: composites, thermal, conductivity


Composite materials are used in die attach applications since their mechanical properties can be tailored to minimize mechanical stress. In addition to stress relief, these materials need to transmit heat efficiently from the active die (i.e chip) to the heat sink. In this study we use Frequency Domain Thermoreflectance (FDTR) to obtain thermal property images of metal matrix composite films to study heat transfer across them. The thermal conductivity images show matrix material migration in some of these composite films, information that is not visible from the optical images.