Challenges and Opportunities in Printing Conductive Inks

Y. Wu
TE Connectivity,
United States

Keywords: flexible electronics


3-dimensional substrates has attracted extensive attention. It provides several advantages such as fast turn-around time for quick prototyping and facile device redesign, enabling the use of thinner substrates for light-weight devices, and potentially lower-manufacturing cost due to the reduced materials usage and reduced manufacturing steps. It is also a more environmentally friendly approach with less chemical waste generated during the manufacturing process, when compared to conventional electroplating or electroless plating. In this talk, a few examples will be presented to illustrate the challenges and opportunities in printing conductive inks. First, particle-free conductive ink based on palladium complex was printed and converted into Pd/PdO films as pH sensors. Linear super-Nernstian pH sensitivity up to 65 mV/pH in the pH range of 2-12 with a short response time was achieved.1 Secondly, inkjet printing silver nanoparticle inks as electrodes for transistor devices will be discussed. Challenges in wetting and de-wetting behaviors could be utilized to develop a self-assembly printing process. Defect-free transistor array with a small channel length (~15 m) and narrow distribution was demonstrated.2 Last, aerosol jet printing silver nanoparticle inks as antennas onto 3D surface will be given. Major challenges such as the RF efficiency, printing consistency, and adhesion to plastic substrate could be overcome to yield printed 3D antennas which are comparable to conventional counterparts. 1. Y. Qin, A.U. Alam, S. Pan, M.R. Howlader, R. Ghosh, P.R. Selvaganapathy, Y. Wu, M. J. Deen, Talanta, 2016, 146, 517-524. 2. J. Doggart, Y. Wu, P. Liu, S. Zhou, ACS Appl. Mater. Interfaces, 2010, 2, 2189-2192