"Quilt Packaging" Microchip Interconnect Technology
Indiana Integrated Circuits, LLC, IN, United States
Quilt Packaging (QP) is a direct edge-interconnect technology that enables on-chip like performance between chips made from different processes or materials. QP has demonstrated sub-micron alignment accuracy and demonstrated chip-to-chip insertion loss of less than 1dB across the entire bandwidth from DC to 220 GHz.
Primary Application Area: Electronics, Sensors & Communications
Technology Development Status: Proven Manufacturability
Technology Readiness Level: TRL 4
FIGURES OF MERIT
Value Proposition: The value proposition of Quilt Packaging is that it enables different chips to be integrated into one unit that performs as if were a single chip to begin with. This means significant cost, power & latency reductions while simultaneously enabling game-changing system performance.
Organization Type: Mid-stage Startup (A or B)
Showcase Booth #: 20M - 20T
GOVT/EXTERNAL FUNDING SOURCES
Government Funding/Support to Date: Indiana Integrated Circuits, LLC has successfully executed Phase I SBIR programs for Air Force and NASA, as well as an R&D program funded by another US Government Agency. Applications explored included GaAs-based large format arrays, InP-Si heterogeneous integration for microwave systems, and satellite imaging applications.
Primary Sources of Funding: Angel, Friends, Family, Corporate Partner
Looking for: Both Funding and Development Partners