TechConnect Innovation Program

TBDB (Temporary Bonding and De-Bonding) for fabricating flexible AMOLED

EnSilTech Corporation, California, United States

TECHNOLOGY SUMMARY

In TBDB GO(Graphene Oxide)layer is deposited between glass and flexible PI films. During fabrication of AMOLED devices GO layer should be bonded to the PI films and glass substrate. After fabricating AMOLED devices, flexible PI films are lifted off mechanically from the glass substrate on which GO layer is deposited.

Primary Application Area: Instrumentation & Manufacturing

Technology Development Status: Prototype

Technology Readiness Level:

FIGURES OF MERIT

Value Proposition:

SHOWCASE SUMMARY

Organization Type: Early-stage Startup (Seed)

Showcase Booth #: 904

Website: www.ensiltech.com

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date: