Stanford University

United States

Peel-and-Stick Process: Fabrication process for thin film electronics on universal substrates.

Instrumentation & Manufacturing


The invention, water-assisted transfer printing method, is to transfer electronic devices that is prefabricated on rigid, opaque and brittle Si wafers onto diverse non-conventional substrates,including paper, plastics, tapes, glasses, and metal foils, thereby impact a range of technologies, such as flexible displays, solar cells, and bio-integrated electronics.