TechConnect World 2018
 

Accelerating emerging innovation into industry application.

Abstracts & Innovations • Due December 8

Applied Research

Present and publish your work and align with industry technology needs.

Submit Abstract

Due Jan. 19

Commercialization

Pitch your innovation to industry, investment, and government prospectors.

Submit Innovation

Due Feb. 02

Business-To-Business

Connect with global OEMs and end-users seeking emerging products.

Sponsored Speaking

 
 

$2.5B
Tech Funding

250
Exhibitors

1000
Prospectors

2000
Innovators

2500
1-on-1 Meetings


Speaker Highlights:

Andrea Belz
Andrea Belz
University of Southern California, US
Paul S. Weiss
Paul S. Weiss
University of California, Los Angeles, US
Katherine Jungjohann
Katherine Jungjohann
Sandia National Lab, US
Philip Demokritou
Philip Demokritou
Harvard School of Public Health, US
C. Rebecca Locker
C. Rebecca Locker
ExxonMobil Research & Engineering, US
Martin E. Leser
Martin E. Leser
Nestlè Research Center, Switzerland
Prithwiraj Maitra
Prithwiraj Maitra
Johnson & Johnson, US

Tracy L. Albers
Tracy L. Albers
Prototype & Manufacturing, US
Susan Donaldson
Susan Donaldson
General Electric, US
Mandakini Kanugo
Mandakini Kanugo
Corning, Inc., US
Maggie Scully
Maggie Scully
National Cancer Institute, US
Sung Jae Kim
Sung Jae Kim
Seoul National University, KR
 Sanyogitta Puri,
Sanyogitta Puri
AstraZeneca, UK
Gabriel M. Rebeiz
Gabriel M. Rebeiz
University of California, San Diego, US
YuanQiao Rao
YuanQiao Rao
The Dow Chemical Company, US
Mansoor M. Amiji
Mansoor M. Amiji
Northeastern University, US
Peter Scheuer
Peter Scheuer
Honeywell, US
Andria Wilson
Andria Wilson
Department of Energy, US
Sang-Young Lee
Sang-Young Lee
UNIST, KR
Anton Köck
Anton Köck
Materials Center Leoben Forschung, Germany
Katherine Price Hoelschler
Katherine Price Hoelschler
Schumberger, US
Thomas Anchordoquy
Thomas Anchordoquy
University of Colorado School of Pharmacy, US
Jim Johnston
Jim Johnston
Victoria University of Wellington, New Zealand
Elizabeth Burton
Elizabeth Burton
University of California, Berkeley, US
Sara Brenner
Sara Brenner
SUNY Poly, US
Chris Menzel
Chris Menzel
Fujifilm Dimatix, US
Jan-Steffen Niehaus
Jan-Steffen Niehaus
Center for Applied Nanotechnology, Germany
Aydogan Ozcan
Aydogan Ozcan
UCLA Howard Hughes Medical Institute, US
Loucas Tsakalakos
Loucas Tsakalakos
GE Global Research, US
Elena Polyakova
Elena Polyakova
Graphene 3D Lab, US
Robert K. Phud'homme
Robert K. Phud'homme
Princeton University, US
Victor Frenkel
Victor Frenkel
University of Maryland School of Medicine, US
Krassimir Velikov
Krassimir Velikov
Unilever, The Netherlands
Ahmed Busnaina
Ahmed Busnaina
Northeastern University, US
Michele L. Ostraat
Michele L. Ostraat
Aramco Services Company, US
Ronald A. Coutu
Ronald A. Coutu
Marquette University, US
Baoxia Mi
Baoxia Mi
University of California, Berkeley, US
Jenna Rickus
Jenna Rickus
Purdue University, US
Wendel Wohlleben
Wendel Wohlleben
BASF, Germany
Rick Barto
Rick Barto
Lockheed Martin
Imre Gyuk
Imre Gyuk
U.S. Department of Energy, US
Evangelyn C. Alocilja
Evangelyn C. Alocilja
Michigan State University, US
Hongda Chen
Hongda Chen
U.S. Department of Agriculture, US
Brent Segal
Brent Segal
Lockheed Martin, US
 

"TechConnect World is an excellent opportunity to meet all key innovation players and stakeholders all in one place — at the premier innovation commercialization and networking event in the US."

BASF

"TechConnect is unique in specifically bringing together the creators of breakthrough technologies with corporations who can help commercialize, adopt, buy, re-sell and invest in those technologies"

Atrium Capital

"We come back to TechConnect World because they provide us the opportunity to meet top innovators across many technology areas all in one location."

Lockheed Martin

 
2017 Sponsors & Partners
2017 Sponsors & Partners

TechConnect World 2018

Jointly produced by