TechConnect World 2017
National SBIR/STTR Conference National Innovation Summit & Showcase Nanotech 2017

Accelerating the Commercialization of

Global Innovation

Visas & Invitation Letters

Visas

As you know, the requirements for travel to the United States constantly change. The links below can connect you to the latest US Government Visa information. We urge everyone that requires a Visa to travel to the US to apply for the Visa as early as possible. Please read the following information carefully.

  • Apply at the appropriate location at least 5 months before intended travel. You can check on-line for the wait times for appointments.
  • Be prepared to allow inkless fingerprinting and digital photographs upon entry to the US.
  • Be accurate and specific in completing your application. Avoid mistakes. If needed, attach an additional explanation letter.
  • Attach evidence of your previous visits to the United States and of your intended return trip to your home country.
  • Acquire a police clearance, if possible.
  • Bring all documentation proving your home country connections. Suggestions include: past visas, bank accounts, family, professional position, home ownership, and marriage license.
  • If you are presenting a paper or speaking at the meeting or are receiving and award or grant, bring copies of correspondence confirming that.
  • Bring your letter of invitation.

Click here for information on Temporary Visas to participate in a meeting or other temporary travel to the United States.

Invitation Letters

If you require a letter of invitation for your visa application, please submit a request for a letter of invitation.

At least one of the following criteria must be met in order to honor the request for a letter of invitation. The requesting party must either:

  1. Be an author of an accepted submission (oral presentation, poster presentation, panel member)
  2. Have paid the registration fee, in full, for this conference.
  3. Have piad the exposition or showcase fee, in full, for this conference.

Important: All letters of invitation will be sent via regular mail unless you provide a validFederal Express or DHL account number. In most cases, Visa Offices will not accept faxed or e-mailed invitation letters.

Please provide the following information in your request:

  • Your full name (Please specify family name and given name)
  • Title (Dr., Professor, Mr., Mrs., Miss, Ms, etc.)
  • Organization
  • Full mailing address
  • Telephone and Fax numbers
  • Email address
  • Additional information such as if you are presenting a paper at the Conference
  • We cannot provide visa letters for spouses or guests

To request a letter of invitation:

Click here for a description from U.S Customs and Border Protection of the process for entering the United States.

The National Academy of Science has established an International Visitors Office with travel information specifically designed for scientists traveling to the US.


Platinum Sponsors
Korusip
NSTXL
nst

Silver Sponsors
Fujifilm
TechOpp

Corporate Acceleration Partners
Aerojet
Arkema
Church & Dwight
Corning
Cummins
Eastman Chemical
Evonik
Henkel
Huntsman
Ingersoll_Rand
LOreal
Magna
Michelman
Owens Corning
Panasonic
Praxair
Sabic
SAINT-GOBAIN
UTC

2016 Technology Development Partners
 
American University Ciaro
Argonne
Australian Nationa lUniversity
ceatech
Clemson University
Giant
Innovate Hawaii
Iowa State University
korusip
KYUNGPOOK National University
Lehigh University
LSU
MUSC
NASA
National University of Singapore
New Jersey Innovation Institute
Onami
Oregon Best
Oregon State University
SungKyunKwan University
UCI
University Central Florida
University Of Illinois
University Of Minnesota
University Of Southern Carolina
UCSB
Wilmington University

Supporting Partners
ACCT
American Elements
Angel Capital Associates
AOCS
Arrowhead Center
Asia Nano Forum
AURP
AUTM
Bilat USA
Diplomacy Matters
Explore Nano
FLC
FCHEA
Graphene Council
InterNano
Journal of Nanobiotechnology
LES
NVCA
NCURA
NECEC
SBIR
SBDC
Taylor Francis CRC
Texas Nanotech Initiative
Texas Tech University ORC.gif
UIDP

TechConnect World 2017

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