TechConnect World 2017
National SBIR/STTR Conference National Innovation Summit & Showcase Nanotech 2017

Informatics, Modeling, & Simulation

Informatics, Modeling, and Simulation

Submit Poster Abstract - due March 31

Please first review the information for authors — abstract submission guidelines.

Symposium Chair

Michael MakowskiMichael Makowski
Manager of New Technology Initiatives
PPG Industries


Symposium Sessions

Tuesday May 16

10:30Materials Informatics & Design Innovation
Informatics, Modeling & Simulation: Posters

Wednesday May 17

1:30IoT/Cyber/Grid Innovation Spotlights: DharmaGrowth, NSTXL

Symposium Program

Tuesday May 16

10:30Materials Informatics & Design Innovation
10:30Rapid Design, Development and Deployment of Materials for Extreme Environments
R. Conrad, D. Mollot, U.S. Department of Energy, US
10:50Thousand-fold speedup of discrete-particle-based computer-aided reactor design and scale-up
L. Lu, S. Benyahia, National Energy Technology Laboratory, US
11:10The coming revolution in materials informatics and artificial intelligence
D. Ramsey, G. Mulholland, Citrine Informatics, US
11:30AMO Roll-to-roll Advanced Materials Manufacturing Laboratory Consortium
C. Daniel, D. Wood, M. Ulsh, G. Krumdick, R. Prasher, National Renewable Energy Laboratory, US
11:50Automating the customer discovery process for accelerated rates of commercialization
R. Miller, H. Osorio, TOI box, LLC, US
12:10BioVM: A Virtual Machine for Biocomputation
M.C. Reynolds, Island Peak Software LLC, US
Informatics, Modeling & Simulation: PostersExpo Hall D & E
Reduction in Lags and Current Collapse in Field-Plate AlGaN/GaN HEMTs with High Acceptor Density in a Buffer Layer
Y. Saito, R. Tsurumaki, N. Noda, K. Horio, Shibaura institute of Technology, JP
The SIESTA Code: Basis Set Construction Strategy. Comparing Solid State DFT Codes
M. García-Mota, A. Martín, M. Callejo, J. Oroya, E. Artacho, Simune Atomistic Simulations, ES
Effects of Buffer Acceptors on Breakdown Voltages of AlGaN/GaN HEMTs with a High-k Passivation Layer
Y. Kawada, H. Hanawa, K. Horio, Shibaura institute of Technology, JP
Three Examples of Nonclassical Fullerenes with Tetrahedral Structure
F.J. Sanchez-Bernabe, Universidad Autonoma Metropolitana, MX
Positioning of Thermal Via Regions for Reducing Hotspot Temperature in 3D ICs
C. Maj, M. Galicia, P. Zajac, A. Napieralski, Lodz University of Technology, PL
Simulation of Breakdown Voltage Enhancement in AlGaN/GaN HEMTs with Double Passivation Layers
K. Horio, H. Hanawa, Shibaura Institute of Technology, JP
A Neural Network Method to Model Nanoscale FinFET Performance
J. He, Peking University Shenzhen SoC Key Lab, CN
Embedding high Reliability in Computer Aided Drug Designing by Fault Forecasting SFT Model
J.B. Prajapati, S.M. Parikh, Ganpat University, IN
Modeling the hydrogen and oxygen atoms interaction with the defects on a diamond surface
N.А. Lvova, О.V. Ponomarev, A.I. Ryazanova, Moscow Institute of Physics and Technology (State University), RU
Investigation of Iron Ion Transit in Ferritin by Molecular Dynamics Simulations
S.A. Limon, M. Stepanova, Missouri State University, US
Computed Encapsulations of Water and Water Aggregates in Fullerenes
Z. Slanina, F. Uhlik, T. Akasaka, S. Nagase, X. Lu, University of Tsukuba, JP
Nonclassical Fullerenes with Cubic and Octahedral Structure
F.J. Sanchez-Bernabe, Universidad Autonoma Metropolitana, MX
Electromagnetic Modeling of TSV chain inside 3-D ICs
M. Zubert, M. Jankowski, A. Napieralski, Lodz University of Technology, PL
Objectification Parallel Computing: A Real-time Solution for Big Data Computing
X. Li, Z. Yang, W. Liao, C.C. Zhou, NARI Group Corporation, CN
The Effects of Autonomous Vehicles on Highway Traffic
Y.W. Almulla, G.M. Brandt, Oregon State University, US

Wednesday May 17

1:30IoT/Cyber/Grid Innovation Spotlights: DharmaGrowth, NSTXL

The Informatics, Modeling and Simulation symposium provides a comprehensive forum for the multidisciplinary materials design, modeling, simulation, and informatics communities. The symposium (our 18th annual event) features presentations on the latest applications-focused research and development in computational methods, tools and simulation for advanced materials and formulation design. It will also highlight informatics and knowledge management issues including data management and expansion of data pattern recognition, structure-property correlation, and data-based prediction capabilities.

Developments in modeling and simulation tools, often in conjunction with experimental characterization, are revealing the nano- and micro-scale phenomena which determine materials performance. There is a growing consensus, and impressive early success stories, demonstrating that industrial advanced materials design tools of the future will combine theory and simulation based predictions and experimental data.

You are invited to submit on topics ranging from theoretical developments through industry-oriented applications.

Topics & Application Areas

  • Materials Informatics
  • Multiscale Modeling of Advanced Materials
  • Molecular Modeling
  • Materials Design Using Quantum Chemistry
  • Novel Modeling Methods & Theory
  • Modeling & Simulation of Polymer Nanostructures
  • Modeling Catalytic Surfaces & Reactions
  • Modeling & Simulation of Microsystems
  • Innovations In Computer-Aided Materials Design
  • Other

Related Industrial Impact Workshops

Sponsor & Exhibitor Opportunities

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Click here to add this event to your calendar.

Platinum Sponsors
Korusip
Lockheed Martin
NSTXL

Silver Sponsors
Fujifilm
TechOpp

Corporate Acceleration Partners
Aerojet
Arkema
Boeing
Church & Dwight
Corning
Cummins
Eastman Chemical
Evonik
Henkel
Huntsman
Ingersoll_Rand
LG
Lockheed Martin
LOreal
Magna
Michelman
Owens Corning
Panasonic
Praxair
Sabic
SAINT-GOBAIN
Shell
Sherwin Williams
UTC

Technology Development Partners
 
Argonne
Business Sweden
ceatech
Clemson University
Innovate Hawaii
InvestInSkane
Iowa State University
korusip
KYUNGPOOK National University
NASA
New Jersey Innovation Institute
PolyU
SungKyunKwan University
UCI
University Of Melbourne
University Of Minnesota
University Of Vermont
UCSB

Supporting Partners
ACCT
American Elements
Angel Capital Associates
AOCS
Arrowhead Center
Asia Nano Forum
AURP
AUTM
Coatings
Diplomacy Matters
Explore Nano
FCHEA
FLC
Graphene Council
InterNano
Journal of Nanobiotechnology
LES
NVCA
NCURA
NECEC
SBIR
SBDC
Taylor Francis CRC
Texas Nanotech Initiative
Texas Tech University ORC.gif
UIDP

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