TechConnect World 2017
National SBIR/STTR Conference National Innovation Summit & Showcase Nanotech 2017

Accelerating the Commercialization of

Global Innovation

Paper Preparation Instructions

Accepted oral and poster presenters must provide a 4-page paper for publication in the annual TechConnect World Conference Technical Proceedings that are distributed as the TechConnect Briefs. Inclusion in this publications is at the discretion of the proceedings editors.

Preparation of Papers


Document Templates

Print the TechConnect.pdf file, and follow the instructions contained therein in preparing your manuscript. Your paper will appear in the published volume in exactly the submitted format. Please adhere strictly to the 2-column 10-point font format. Papers must not exceed 4 pages in length.

Download the Microsoft Word© or LaTeX2e sample documents provided below if you have these programs. The files will assist you in preparing your manuscript.

  • Microsoft Word©
    • Sample document TechConnect.doc
      Use the included TechConnect styles for editing you manuscript.

Preparation of PDF File of Paper

Please compare you final paper copy to the sample provided, to ensure that your paper has the same format (fonts, margins, styles). Use the following guidelines when preparing electronic PDF manuscripts:

  • Use a US Letter paper size when preparing your PDF
  • Use the Press preset of Acrobat Distiller© if available
  • Use a resolution of 600 dpi
  • DO NOT PASSWORD PROTECT your PDF
  • DO NOT ENCRYPT your PDF
  • INCLUDE ALL FONTS in your PDF (Press preset)
  • Check that here is no BLANK PAGE at the end of your PDF

If you do not have a PDF converter, please visit the PS2PDF site. Please print your PDF file on another computer to ensure that it includes all of the fonts required for printing.

Upload PDF of Your Paper

You may only upload your paper once, so proof-read it carefully. Instructions for upload of papers will be e-mailed to authors in early March. Use the link included in your e-mail to upload the PDF of your paper to the conference web server. If you have not received your instructions, please contact the conference secretariat: .

Copyright Forms


Copyright Forms

A signed copyright form in PDF format must be uploaded to the conference web site no later than March 24th, 2017. Manuscripts received without a signed copyright form will not be published.

U.S. government employees whose work is not subject to U.S. copyright, and authors of works subject to Crown Copyright should use this form.

Please follow the instructions below on how to electronically sign a PDF copyright form.

Preparation of PDF File of Copyright Form

Open the PDF of the copyright form in the free Adobe® Reader® (version XI or newer) program, and follow these instructions:

  • Create an image (TIF / GIF / PNG) of your signature (from a picture taken with your smart phone, or scan one in)
  • Click on the Sign link in the toolbar at top, and then on the Add Text button in the right hand column that opens, and enter the various fields including:
    • TITLE OF PAPER
    • AUTHOR(S)
    • ABSTRACT NUMBER
    • TITLE
    • EMPLOYER FOR WHOM WORK WAS PERFORMED
    • DATE
  • Click on the Place Signature button in the right hand column and place our signature in the SIGNATURE field.
  • Click on the Signed. Proceed to Send button in the right had column and select Save a Copy

Upload PDF of Your Copyright Form

You may only upload your copyright form once, so prepare it carefully. Instructions for upload of copyright forms will be e-mailed to authors in early March. Use the link included in your e-mail to upload the PDF of your copyright form to the conference web server. If you have not received your instructions, please contact the conference secretariat: .

 

Questions?


Please contact the conference secretariat if you encounter any problems preparing your papers or copyright forms.

↑ Back to Information for Authors


Platinum Sponsors
Korusip
KIAT
Lockheed Martin
NSTXL

Silver Sponsors
Fujifilm
TechOpp
Park Systems
Penn State
tekna

Corporate Acceleration Partners
Aerojet
Arkema
Baxter
Boeing
Church & Dwight
Corning
Cummins
Eastman Chemical
Energizer Holdings Inc.
Evonik
Henkel
Huntsman
Ingersoll_Rand
LG
Lockheed Martin
LOreal
Magna
Medtronic
Michelman
Owens Corning
Panasonic
Praxair
Sabic
SAINT-GOBAIN
Shell
Sherwin Williams
UTC

Technology Development Partners
 
AirForce Technology Transfer
Argonne
Business Sweden
ceatech
Fermilab
GLEAMM
Idaho National Laboratory
Innovate Hawaii
InvestInSkane
Iowa State University
Jefferson Lab
Kansas City National Security Campus
korusip
KYUNGPOOK National University
Lawrence Berkeley National Laboratory
NASA
NETL
NREL
New Jersey Innovation Institute
University of Buffalo NYSCEMI
OakRidgeNatLab
PolyU
PPPL
Sandia National Laboratories
SungKyunKwan University
Texas Tech Research Commercialization
UCI
University Of Melbourne
University Of Minnesota
University Of Vermont
UCLA Technology Development Group
UCSB
Vermont Department Economic Development
Vermont Technology Council

Supporting Partners
ACCT
American Elements
Angel Capital Associates
AOCS
Arrowhead Center
Asia Nano Forum
AURP
AUTM
BILAT USA 4.0
Coatings
Diplomacy Matters
European Commission
European Cluster Collaboration Platform
Explore Nano
FCHEA
FLC
Graphene Council
Graphene Entrepreneur
INNO
InterNano
Journal of Nanobiotechnology
LES
NVCA
NCURA
NECEC
SBIR
SBDC
Taylor Francis CRC
Texas Nanotech Initiative
UIDP

TechConnect World 2017

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