Novel Polymer Substrates for Printed Electronics by Continuous Extrusion

A. Panwar, J. Mead, C. Barry, C. Lepont, R. Vaghani, J. Desrochers, A. Akyirtlu, A. Dericioglu, SE. Hajisaeid, M. Haghzadeh, M. Herndon, D. Rockosi
University of Massachusetts Lowell,
United States

Keywords: flexible substrates, continuous extrusion

Summary:

Flexible electronics are an attractive candidate for next generation electronics with promising applications such as RFID tags, e-skin, bio-sensors, wireless power and signal transmission sheets, and flexible displays. The use of polymers as flexible substrates opens the opportunity for affordable and diverse material properties and applications. In our approach, flexible composite materials were manufactured by mixing polypropylene with various volume fractions (10-40 vol%) of barium strontium titanate (BST) filler using the twin screw extrusion process to create tunable substrates for antenna and other applications. Dielectric constants of sheets manufactured by continuous extrusion process were measured as a function of BST loadings in the frequency range of 1-10 kHz. The dielectric constant of the composites increased with increasing volume fraction of BST. The dispersion of filler into the polymer matrix was studied by scanning electron microscopy.