NANO3D provides revolutionary eLOCOS (electrochemical, low cost, selective and scalable) metallization platform technology based on proprietary plating chemicals. eLOCOS technology (CMP & PVD-free) enables NANO3D’s customers to fabricate high density interconnects that have better performance & controlled thermal expansion at lower cost compare to standard damascene and electrografting technologies.
Primary Application Area: Materials, Chemical
Technology Development Status: Ready to Market
FIGURES OF MERIT
Value Proposition: With the trend in convergent systems and functions with digital, RF, optical and MEMS, IoT sensors, LED etc in a single package or 3D microsystem with market of over $18.1B in Y2020, a new set of metallization material technologies are necessary. eLOCOS metallization technology drastically reduces the fabrication cost of metallization and enable stress-free & high density interconnects for most advanced 3D microsystems. eLOCOS controlled expansion alloy films enables fine-pitch area array and 3D interconnections with coefficient of thermal expansion (CTE's) tuned to match substrates and chips CTE's in order to fabricate stress-free 3D assemblies of electronic devices with improved joint reliability. NANO3D supplies customers with plating solutions to plate controlled expansion alloy films with superior properties for customer applications as well as provides controlled expansion alloy pinhole-free foils and films on variety of substrates for various applications in semiconductor, optical, sensor, display and clean energy technologies. By Y2018, directly addressable market for eLOCOS metallization materials will grow to over $3.1B including $712M 2D/3D IC & WLP metallization and $2.4B touchscreens (metal mesh) with additional opportunity in biomedical market (shaped particles) of $8.6B. NANO3D eLOCOS platform technology is protected by 4 issued US patents and 3 pending US patent applications.
Organization Type: Early-stage Startup (Seed)
Showcase Booth #: 401
GOVT/EXTERNAL FUNDING SOURCES
SBIR/STTR Awards: 1. $180,000. NSF SBIR Phase I/IB, 07/01/2013 – 06/30/2014
2. $925,999. NSF SBIR Phase II/Supplements, 03/01/2015 – 08/31/2017
External Funding to Date: 1. $250,000. ONAMI Gap Funding, 11/01/2015 – 31/10/2016.
2. $100,000. Seed funding from private investor, 01/06/2014.